US6140683A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Efficient NPN turn-on in a high voltage DENMOS transistor for ESD protection
Assignee: Texas Instruments Inc
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Filing: 1999-02-16
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Granted: 2000-10-31
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Expires: 2019-02-16
Abstract
Abstract A high voltage DENMOS transistor (10) having improved ESD protection. The transistor (10) is optimized to provide maximum substrate current in order to turn on the inherent lateral npn transistor during an ESD event so that the lateral npn can dissipate the ESD event without damage to the transistor (10). This is accomplished by optimizing the overlap (A) of the drain extended region (16) and the gate electrode (28) to control the gate coupling to achieve maximum substrate current.
Inventors
- 👤 Charvaka Duvvury
- 👤 David Douglas Briggs
- 👤 Fernando David Carvajal
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-07 16:03
CPC Classifications
H; H10; H10D; H10D89/00; H10D89/60; H10D89/601; H10D89/711; H10D84/00; H10D84/40; H10D84/401; H10D84/403; H10D84/409
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
140 words
A DENMOS transistor for ESD protection located in a substrate, comprising: a p-type tank region located in said substrate; a drain extended region located in said p-type tank region; a drain region located within said drain extended region; a n-well region located in said p-type tank region; a source region located partly within said n-well region and partly within said p-type tank region; a field oxide region located over a portion of said drain extend region; a gate oxide located adjacent said field oxide region and extending from said field oxide region to said source region; and a gate electrode extending over said gate oxide and part of said field oxide region, wherein said drain extended region overlaps a portion of said gate electrode extending over said gate oxide to a distance corresponding to maximum substrate current under ESD conditions.
Claim 2
Dependent Claim
140 words
A DENMOS transistor for ESD protection located in a substrate, comprising: a p-type tank region located in said substrate; a drain extended region located in said p-type tank region; a drain region located within said drain extended region; a n-well region located in said p-type tank region; a source region located partly within said n-well region and partly within said p-type tank region; a field oxide region located over a portion of said drain extend region; a gate oxide located adjacent said field oxide region and extending from said field oxide region to said source region; and a gate electrode extending over said gate oxide and part of said field oxide region, wherein said drain extended region overlaps a portion of said gate electrode extending over said gate oxide to a distance corresponding to maximum substrate current under ESD conditions.
Claim 3
Dependent Claim
19 words
The DENMOS of claim 1, wherein said p-type tank region has a resistivity on the order of 30 Kohm-μm.
Claim 4
Dependent Claim
18 words
The DENMOS of claim 1, further comprising a resistor connected between said gate electrode and said source region.
Claim 5
Dependent Claim
14 words
The DENMOS of claim 3, wherein said resistor is located within said n-well region.
Claim 6
Dependent Claim
15 words
The DENMOS of claim 3, wherein said resistor is in the range of 10-20 Kohms.
Claim 7
Dependent Claim
24 words
The DENMOS of claim 3, wherein said overlap of said drain extended region and said gate electrode is on the order of 2 μm.
References Cited (Backward Citations)
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