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US6139972A
Expired / Lapsed
US
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Solder paste containment device
Assignee: Agilent Technologies Inc
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Filing: 1998-10-26
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Granted: 2000-10-31
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Expires: 2018-10-26
Abstract
Abstract The invention provides an improved donor substrate for the formation and transfer of solder bumps useful in IC packaging and related interconnect applications. The donor substrate is improved by shaping the solder paste containment region (cavity) so that during reflow, the solder bump is urged to protrude significantly above the surface of the donor substrate, enabling proximity transfer of the solder bump to a receiving substrate.
Inventors
- 👤 Gary R Trott
- 👤 Geary L. Chew
- 👤 Matthew K. Schwiebert
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 18:06
CPC Classifications
B; B23; B23K; B23K3/00; B23K3/06; B23K3/0607; B23K3/0638; H; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/3465; H05K3/3485; B23K2101/00; B23K2101/36; B23K2101/40; H05K2203/00; H05K2203/01; H05K2203/0104; H05K2203/0113; H05K2203/03; H05K2203/0338; Y; Y10; Y10T; Y10T428/00; Y10T428/31504; Y10T428/31678; Y10T428/31681; Y10T428/31721
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
115 words
An improved contained paste deposition apparatus, said apparatus including a donor substrate, a receiving substrate and solder bumps formed from paste during reflow with the donor substrate remaining in place during reflow and solder bumps transferring from the donor substrate to the receiving substrate, said improvement comprising: solder paste containment regions on the donor substrate, said containment regions having the geometric shape of a fractal to a predetermined depth which determines the volume of the formed solder bumps, each said region operable during reflow to position a molten solder bump such that the molten solder bump protrudes from the surface of the donor substrate thereby facilitating transfer from the donor substrate to the receiving substrate.
Claim 2
Dependent Claim
115 words
An improved contained paste deposition apparatus, said apparatus including a donor substrate, a receiving substrate and solder bumps formed from paste during reflow with the donor substrate remaining in place during reflow and solder bumps transferring from the donor substrate to the receiving substrate, said improvement comprising: solder paste containment regions on the donor substrate, said containment regions having the geometric shape of a fractal to a predetermined depth which determines the volume of the formed solder bumps, each said region operable during reflow to position a molten solder bump such that the molten solder bump protrudes from the surface of the donor substrate thereby facilitating transfer from the donor substrate to the receiving substrate.
Claim 3
Dependent Claim
48 words
An improved contained paste deposition apparatus useful in the formation of solder bumps as in claim 1, said improvement further comprising: solder paste containment region having one or more stub walls around the perimeter of the regions operable to encourage a molten solder bump to a predetermined position.
Claim 4
Dependent Claim
39 words
An improved contained paste deposition apparatus useful in the formation of solder bumps as in claim 1, said improvement further comprising: a paste containment region having a perimeter which maximizes the cavity volume when tiled into a regular array.
Claim 5
Dependent Claim
39 words
An improved contained paste deposition apparatus useful in the formation of solder bumps as in claim 1, said improvement further comprising: a paste containment region having a perimeter which maximizes the cavity wall when tiled onto a staggered array.
Claim 6
Dependent Claim
38 words
An improved contained paste deposition containment apparatus useful in the formation of solder bumps as in claim 1, said improvement further comprising: filleted internal corners and rounded external corners operable to enhance mechanical strength and to facilitate cleaning.
Claim 7
Dependent Claim
35 words
An improved contained paste deposition containment apparatus useful in the formation of solder bumps as in claim 1: where the outer dimensions of the paste containment region are from about 25 μm to 2.5 mm.
Claim 8
Dependent Claim
47 words
An improved contained paste deposition containment apparatus useful in the formation of solder bumps as in claim 1: where the donor substrate is a material with a non-solder-wettable surface and a coefficient of thermal expansion that substantially matches the coefficient of thermal expansion of the receiving substrate.
Claim 9
Dependent Claim
30 words
An improved contained paste deposition containment apparatus useful in the formation of solder bumps as in claim 1: where the donor substrate is the same material as the receiving substrate.
Claim 10
Dependent Claim
30 words
A donor substrate as in claim 8: where the donor substrate is a silicon wafer with solder paste containment cavities etched into the surface with a reactive ion etching process.
Claim 11
Dependent Claim
33 words
A donor substrate as in claim 8: where the donor substrate is a ceramic, sapphire or glass substrate with solder paste containment cavities etched into the surface with a reactive ion etching process.
Claim 12
Dependent Claim
31 words
A donor substrate as in claim 8: where the donor substrate is a metal plate, with solder paste containment cavities machined into the surface with conventional milling or electrical discharge machining.
Claim 13
Dependent Claim
14 words
A donor substrate as in claim 11: where the substrate material is substantially aluminum.
Claim 14
Dependent Claim
39 words
A donor substrate as in claim 8: where the donor substrate is a laminate structure of a polymer film over a rigid backer, with solder paste containment cavities etched into the polymer film with photolithographic processing or laser ablation.
Claim 15
Dependent Claim
13 words
A donor substrate as in claim 13: where the polymer film is polyimide.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-10-31 | 2004-05-01 | 2004-10-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-10-31 | 2008-05-01 | 2008-10-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-10-31 | 2012-05-01 | 2012-10-31 | $7700.00 | Window Closed / Lapsed |