Patent US6136661A successfully refreshed from Google Patents.
US6136661A
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US
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Method to fabricate capacitor structures with very narrow features using silyated photoresist
Assignee: Taiwan Semiconductor Manufacturing Co TSMC Ltd
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Filing: 1999-06-14
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Granted: 2000-10-24
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Expires: 2019-06-14
Abstract
Abstract A method of fabrication of a storage capacitors for DRAM memory cells using silylated photoresist is described. Partially completed DRAM memory cells comprising wordline transistor gates and bitline source and drain regions is provided. Conductive plugs are provided through a dielectric layer to the top surfaces of the bitline drain regions. A first conductive layer is deposited overlying the conductive plugs. A photoresist layer is deposited overlying the first conductive layer. The photoresist layer is etched to define the areas for the lower plates of the storage capacitors. The photoresist is exposed to a silylating agent to form a silylated layer. The top layer of the silylated photoresist is etched through to form a mask for subsequent etching. The photoresist layer is etched as defined by the mask. The first conductive layer is etched as defined by the mask to form the shape of the lower nodes of the storage capacitors. The remaining silylated photoresist is removed. A capacitor dielectric layer is deposited overlying the lower nodes of the storage capacitors. A second conductive layer is deposited to form the upper nodes of the storage capacitors. A passivation layer is deposited to complete fabrication.
Inventors
- 👤 Tzu-Shih Yen
- 👤 Erik S. Jeng
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:05
CPC Classifications
H; H10; H10D; H10D1/00; H10D1/01; H10D1/041; H10D1/043; G; G03; G03F; G03F7/00; G03F7/26; G03F7/40; G03F7/405; H10D1/60; H10D1/68; H10D1/692; H10D1/711; H10D1/716; H10P; H10P50/00; H10P50/71; H10P76/00; H10P76/20; H10P76/204; H10B; H10B12/00; H10B12/01; H10B12/02; H10B12/03; H10B12/033
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
187 words
A method of fabrication of storage capacitors in an integrated circuit device comprising: providing a semiconductor substrate where conductive plugs are formed through a dielectric layer; depositing a first conductive layer overlying said conductive plugs and said dielectric layer; depositing a photoresist layer overlying said first conductive layer; patterning said photoresist layer to define a photoresist mask overlying said conductive plugs; silylating said photoresist mask to form a top silylated photoresist portion overlying and silylated photoresist sidewalls adjacent to an inner unsilylated photoresist portion; etching through said top silylated photoresist portion to expose the top surface of said inner unsilylated photoresist portion; etching said inner unsilylated photoresist portion; etching said first conductive layer and thereby forming the lower nodes of said storage capacitors wherein said silylated photoresist sidewalls act as an etching mask; etching away remaining said said silylated photoresist sidewalls; depositing a capacitor dielectric layer overlying said lower nodes of said storage capacitors and said dielectric layer; depositing a second conductive layer overlying said capacitor dielectric layer and thereby forming the upper nodes of said storage capacitors; and completing said fabrication of said integrated circuit device.
Claim 2
Independent Claim
187 words
A method of fabrication of storage capacitors in an integrated circuit device comprising: providing a semiconductor substrate where conductive plugs are formed through a dielectric layer; depositing a first conductive layer overlying said conductive plugs and said dielectric layer; depositing a photoresist layer overlying said first conductive layer; patterning said photoresist layer to define a photoresist mask overlying said conductive plugs; silylating said photoresist mask to form a top silylated photoresist portion overlying and silylated photoresist sidewalls adjacent to an inner unsilylated photoresist portion; etching through said top silylated photoresist portion to expose the top surface of said inner unsilylated photoresist portion; etching said inner unsilylated photoresist portion; etching said first conductive layer and thereby forming the lower nodes of said storage capacitors wherein said silylated photoresist sidewalls act as an etching mask; etching away remaining said said silylated photoresist sidewalls; depositing a capacitor dielectric layer overlying said lower nodes of said storage capacitors and said dielectric layer; depositing a second conductive layer overlying said capacitor dielectric layer and thereby forming the upper nodes of said storage capacitors; and completing said fabrication of said integrated circuit device.
Claim 3
Dependent Claim
27 words
The method according to claim 1 wherein said first conductive layer is comprised of polysilicon deposited to a thickness of between about 2,000 Angstroms and 10,000 Angstroms.
Claim 4
Dependent Claim
23 words
The method according to claim 1 wherein said photoresist layer is deposited to a thickness of between about 2,000 Angstroms and 15,000 Angstroms.
Claim 5
Dependent Claim
32 words
The method according to claim 1 wherein said step of silylating is performed using a silylating agent comprising one of the group of: dimethylsilyldimethylamine (DMSDMA), dimethylsilyldiethylamine (DMSDEA), dimethylaminopentamethyldisilane (DMDS), and N,N-dimethylamino-1,2dimethyldisilane (DMDS).
Claim 6
Dependent Claim
30 words
The method according to claim 1 wherein said top silylated photoresist portion and said silylated photoresist sidewalls are formed to a thickness of between about 200 Angstroms and 2,000 Angstroms.
Claim 7
Dependent Claim
28 words
The method according to claim 1 wherein said shape of the lower nodes of said storage capacitors is one of a group comprising crown shaped and cylindrical shaped.
Claim 8
Dependent Claim
31 words
The method according to claim 1 wherein said etching through of said top silylated photoresist portion is by reactive ion etching using a chemistry comprising Cl 2 and O 2 .
Claim 9
Dependent Claim
31 words
The method according to claim 1 wherein said etching of said inner unsilylated photoresist portion is by reactive ion etching using a chemistry comprising O 2 , N 2 and He.
Claim 10
Independent Claim
232 words
A method of fabrication of a crown shaped storage capacitor in an integrated circuit device comprising: providing a semiconductor substrate where conductive plugs are formed through a dielectric layer; depositing a first polysilicon layer overlying said conductive plugs and said dielectric layer; depositing a photoresist layer overlying said first polysilicon layer; patterning said photoresist layer to define a photoresist mask overlying said conductive plugs; silylating said photoresist mask to form a top silylated photoresist portion overlying and silylated photoresist sidewalls adjacent to an inner unsilylated photoresist portion; etching through said top silylated photoresist portion to expose the top surface of said inner unsilylated photoresist portion; etching said inner unsilylated photoresist portion wherein a thin layer of said inner unsilylated photoresist portion is left overlying said first polysilicon layer; etching said thin layer of said inner unsilylated photoresist portion and said first polysilicon layer and thereby forming crown shaped lower nodes of said storage capacitors leaving a thin layer of said first polysilicon layer overlying said dielectric layer wherein said silylated photoresist sidewalls act as an etching mask; etching away remaining said silylated photoresist sidewalls; depositing a capacitor dielectric layer overlying said crown shaped lower nodes of said storage capacitors and said dielectric layer; depositing a second polysilicon layer overlying said capacitor dielectric layer and thereby forming the upper nodes of said storage capacitors; and completing said fabrication of said integrated circuit device.
Claim 11
Independent Claim
232 words
A method of fabrication of a crown shaped storage capacitor in an integrated circuit device comprising: providing a semiconductor substrate where conductive plugs are formed through a dielectric layer; depositing a first polysilicon layer overlying said conductive plugs and said dielectric layer; depositing a photoresist layer overlying said first polysilicon layer; patterning said photoresist layer to define a photoresist mask overlying said conductive plugs; silylating said photoresist mask to form a top silylated photoresist portion overlying and silylated photoresist sidewalls adjacent to an inner unsilylated photoresist portion; etching through said top silylated photoresist portion to expose the top surface of said inner unsilylated photoresist portion; etching said inner unsilylated photoresist portion wherein a thin layer of said inner unsilylated photoresist portion is left overlying said first polysilicon layer; etching said thin layer of said inner unsilylated photoresist portion and said first polysilicon layer and thereby forming crown shaped lower nodes of said storage capacitors leaving a thin layer of said first polysilicon layer overlying said dielectric layer wherein said silylated photoresist sidewalls act as an etching mask; etching away remaining said silylated photoresist sidewalls; depositing a capacitor dielectric layer overlying said crown shaped lower nodes of said storage capacitors and said dielectric layer; depositing a second polysilicon layer overlying said capacitor dielectric layer and thereby forming the upper nodes of said storage capacitors; and completing said fabrication of said integrated circuit device.
Claim 12
Dependent Claim
23 words
The method according to claim 9 wherein said photoresist layer is deposited to a thickness of between about 2,000 Angstroms and 15,000 Angstroms.
Claim 13
Dependent Claim
31 words
The method according to claim 1 wherein said step of silylating is performed using a silylating agent from the group consisting of: dimethylsilyldimethylamine (DMSDMA), dimethylsilyldiethylamine (DMSDEA), dimethylaminopentamethyldisilane (DMDS), and N,N-dimethylamino-1,2dimethyldisilane (DMDS).
Claim 14
Dependent Claim
31 words
The method according to claim 9 wherein said etching through of said top silylated photoresist portion is by reactive ion etching using a chemistry comprising Cl 2 and O 2 .
Claim 15
Dependent Claim
63 words
The method according to claim 9 wherein said etching of said inner unsilylated photoresist portion is by reactive ion etching using a chemistry comprising O 2 , N 2 and He, and wherein said etching of said inner unsilylated photoresist portion is timed such that said inner unsilylated photoresist portion left overlying said first polysilicon is between about 1,000 Angstroms and 3,000 Angstroms.
Claim 16
Dependent Claim
58 words
The method according to claim 9 wherein said etching of said first polysilicon layer is by reactive ion etching using a chemistry comprising Cl 2 , HBr, and O 2 , and wherein said etching is timed such that said thin layer of first polysilicon left overlying said dielectric layer is between about 500 Angstroms and 2,000 Angstroms.
Claim 17
Independent Claim
198 words
A method of fabrication of a cylindrical shaped storage capacitor in an integrated circuit device comprising: providing a semiconductor substrate where conductive plugs are formed through a dielectric layer; depositing a first polysilicon layer overlying said conductive plugs and said dielectric layer; depositing a photoresist layer overlying said first polysilicon layer; patterning said photoresist layer to define a photoresist mask wherein said photoresist mask intersects said conductive plugs; silylating said photoresist mask to form a top silylated photoresist portion overlying and silylated photoresist sidewalls adjacent to an inner unsilylated photoresist portion; etching through said top silylated photoresist portion to expose the top surface of said inner unsilylated photoresist portion; etching through said inner unsilylated photoresist portion; etching through said first polysilicon layer to form the cylindrical shaped lower nodes of said storage capacitors wherein said silylated photoresist sidewalls acts as an etching mask; removing remaining said silylated layer of photoresist; depositing a capacitor dielectric layer overlying said cylindrical shaped lower nodes of said storage capacitors and said dielectric layer; depositing a second polysilicon layer overlying said capacitor dielectric layer and thereby forming the upper nodes of said storage capacitors; and completing said fabrication of said integrated circuit device.
Claim 18
Independent Claim
198 words
A method of fabrication of a cylindrical shaped storage capacitor in an integrated circuit device comprising: providing a semiconductor substrate where conductive plugs are formed through a dielectric layer; depositing a first polysilicon layer overlying said conductive plugs and said dielectric layer; depositing a photoresist layer overlying said first polysilicon layer; patterning said photoresist layer to define a photoresist mask wherein said photoresist mask intersects said conductive plugs; silylating said photoresist mask to form a top silylated photoresist portion overlying and silylated photoresist sidewalls adjacent to an inner unsilylated photoresist portion; etching through said top silylated photoresist portion to expose the top surface of said inner unsilylated photoresist portion; etching through said inner unsilylated photoresist portion; etching through said first polysilicon layer to form the cylindrical shaped lower nodes of said storage capacitors wherein said silylated photoresist sidewalls acts as an etching mask; removing remaining said silylated layer of photoresist; depositing a capacitor dielectric layer overlying said cylindrical shaped lower nodes of said storage capacitors and said dielectric layer; depositing a second polysilicon layer overlying said capacitor dielectric layer and thereby forming the upper nodes of said storage capacitors; and completing said fabrication of said integrated circuit device.
Claim 19
Dependent Claim
23 words
The method according to claim 15 wherein said photoresist layer is deposited to a thickness of between about 2,000 Angstroms and 15,000 Angstroms.
Claim 20
Dependent Claim
31 words
The method according to claim 1 wherein said step of silylating is performed using a silylating agent from the group consisting of: dimethylsilyldimethylamine (DMSDMA), dimethylsilyldiethylamine (DMSDEA), dimethylaminopentamethyldisilane (DMDS), and N,N-dimethylamino-1,2dimethyldisilane (DMDS).
Claim 21
Dependent Claim
31 words
The method according to claim 15 wherein said etching through of said top silylated photoresist portion is by reactive ion etching using a chemistry comprising Cl 2 and O 2 .
Claim 22
Dependent Claim
49 words
The method according to claim 15 wherein said etching through of said inner unsilylated photoresist portion is by reactive ion etching using a chemistry comprising O 2 , N 2 and He, wherein an optical endpoint detection is used to stop said etching of said inner unsilylated photoresist portion.
Claim 23
Dependent Claim
47 words
The method according to claim 15 wherein said etching of said first polysilicon layer is by reactive ion etching using a chemistry comprising Cl 2 , HBr, and O 2 , wherein an optical endpoint detection is used to stop said etching of said first polysilicon layer.
References Cited (Backward Citations)
US5330614A
Cited
US5399518A
Cited
US5380673A
Cited
US5753419A
Cited
US5753420A
Cited
US5712202A
Cited
US5663093A
Cited
US5759892A
Cited
US5759893A
Cited
US5926719A
Cited
US6004845A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-10-24 | 2004-04-24 | 2004-10-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-10-24 | 2008-04-24 | 2008-10-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-10-24 | 2012-04-24 | 2012-10-24 | $7700.00 | Window Closed / Lapsed |