Patent US6133067A successfully refreshed from Google Patents.
US6133067A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Architecture for dual-chip integrated circuit package and method of manufacturing the same
Assignee: Amic Technology Inc
•
Filing: 1998-03-26
•
Granted: 2000-10-17
•
Expires: 2018-03-26
Abstract
Abstract An architecture for a dual-chip IC package and a method of manufacturing the same are provided. The dual-chip IC package allows two chips to be mounted on the same leadframe in the same package. The two chips can be either the same type of a semiconductor device or two different types of semiconductor devices with different functions such as a memory chip and a logic control chip. The architecture allows a simplified manufacturing process and an increased good yield rate for the two IC chips that are to be enclosed in the dual-chip IC package. Moreover, the dual-chip IC package can be manufactured with existing packaging equipment and processes, so that it can be realized without having to invest on and install additional ones.
Inventors
- 👤 Jacob Jeng
- 👤 Kun-Luh Chen
- 👤 Edward Chen
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:43
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/121; H10W46/00; H10W74/01; H10W90/00; H10W90/811; H10W46/401; H10W46/601; H10W46/607; H10W72/00; H10W72/071; H10W72/075; H10W72/90; H10W72/951; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
138 words
A method for manufacturing a dual-chip IC package, comprising the steps of: (1) preparing a leadframe which includes a die pad and a number of package pins; (2) performing a first die-attach process so as to mount a first chip on a first side of the die pad; (3) performing a first wire-bonding process so as to electrically connect the first chip to a first selected set of the package pins; (4) performing a second die-attach process so as to mount a second chip on a second side of the die pad; (5) performing a second wire-bonding process so as to electrically connect the second chip to a second selected set of the package pins; (6) performing a molding process so as to form a molded compound to simultaneously enclose the first chip and the second chip therein.
Claim 2
Independent Claim
138 words
A method for manufacturing a dual-chip IC package, comprising the steps of: (1) preparing a leadframe which includes a die pad and a number of package pins; (2) performing a first die-attach process so as to mount a first chip on a first side of the die pad; (3) performing a first wire-bonding process so as to electrically connect the first chip to a first selected set of the package pins; (4) performing a second die-attach process so as to mount a second chip on a second side of the die pad; (5) performing a second wire-bonding process so as to electrically connect the second chip to a second selected set of the package pins; (6) performing a molding process so as to form a molded compound to simultaneously enclose the first chip and the second chip therein.
Claim 3
Dependent Claim
22 words
The method of claim 1, wherein the first chip and the second chip are formed with different types of semiconductor devices respectively.
Claim 4
Dependent Claim
23 words
The method of claim 1, wherein the first chip and the second chip are formed with the same type of a semiconductor device.
Claim 5
Independent Claim
210 words
A method for manufacturing a dual-chip IC package, comprising the steps of: (1) preparing a leadframe which includes a die pad and a number of package pins; (2) performing a first die-attach process so as to mount a first chip on a first side of the die pad; (3) performing a first wire-bonding process so as to electrically connect the first chip to a first selected set of the package pins; (4) performing a molding process with a molding material so as to form a molded compound which covers the entire packaging area on the first side of the leadframe to enclose the first chip therein, but only a peripheral part of the packaging area on the second side of the leadframe with a window to expose the bonding area on the second side of the leadframe; (5) performing a second die-attach process so as to mount a second chip through the window on the second side of the die pad; (6) performing a second wire-bonding process so as to electrically connect the second chip to a second selected set of the package pins; and (7) performing a dispensing process with a dispensing material so as to form a dispensed compound in the window to enclose the second chip therein.
Claim 6
Independent Claim
210 words
A method for manufacturing a dual-chip IC package, comprising the steps of: (1) preparing a leadframe which includes a die pad and a number of package pins; (2) performing a first die-attach process so as to mount a first chip on a first side of the die pad; (3) performing a first wire-bonding process so as to electrically connect the first chip to a first selected set of the package pins; (4) performing a molding process with a molding material so as to form a molded compound which covers the entire packaging area on the first side of the leadframe to enclose the first chip therein, but only a peripheral part of the packaging area on the second side of the leadframe with a window to expose the bonding area on the second side of the leadframe; (5) performing a second die-attach process so as to mount a second chip through the window on the second side of the die pad; (6) performing a second wire-bonding process so as to electrically connect the second chip to a second selected set of the package pins; and (7) performing a dispensing process with a dispensing material so as to form a dispensed compound in the window to enclose the second chip therein.
Claim 7
Dependent Claim
25 words
The method of claim 4, wherein the bonding area includes the die pad therewithin, in which the first chip and the second chip are mounted.
Claim 8
Dependent Claim
28 words
The method of claim 4, wherein the bonding area includes a plurality of bonding lead tips therewithin which are wired to corresponding bonding pads on the second chip.
Claim 9
Dependent Claim
22 words
The method of claim 4, wherein the first chip and the second chip are formed with different types of semiconductor devices respectively.
Claim 10
Dependent Claim
23 words
The method of claim 4, wherein the first chip and the second chip are formed with the same type of a semiconductor device.
Claim 11
Dependent Claim
17 words
The method of claim 4, wherein the molding material and the dispensing material are two different materials.
Claim 12
Dependent Claim
17 words
The method of claim 4, wherein the molding material and the dispensing material are one same material.
Claim 13
Dependent Claim
11 words
The method of claim 4, wherein the molding material includes plastics.
Claim 14
Dependent Claim
11 words
The method of claim 4, wherein the molding material includes resin.
Claim 15
Dependent Claim
12 words
The method of claim 4, wherein the dispensing material includes colored resin.
Claim 16
Dependent Claim
11 words
The method of claim 4, wherein the dispensing material includes resin.
Claim 17
Dependent Claim
11 words
The method of claim 4, wherein the dispensing material includes plastics.
Claim 18
Dependent Claim
28 words
The method of claim 4, wherein the dispensed compound is protruded with respect to the surrounding part of the molded compound on the second side of the leadframe.
Claim 19
Dependent Claim
26 words
The method of claim 4, wherein the dispensed compound is leveled with the surrounding part of the molded compound on the second side of the leadframe.
Claim 20
Dependent Claim
28 words
The method of claim 4, wherein the dispensed compound is recessed with respect to the surrounding part of the molded compound on the second side of the leadframe.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-10-17 | 2004-04-17 | 2004-10-17 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-10-17 | 2008-04-17 | 2008-10-17 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-10-17 | 2012-04-17 | 2012-10-17 | $7700.00 | Window Closed / Lapsed |