US5733802A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and method of manufacturing the same
Assignee: Toshiba Corp
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Filing: 1995-10-03
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Granted: 1998-03-31
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Expires: 2015-10-03
Abstract
Abstract There is provided a semiconductor device having a very thin, highly reliable semiconductor package and a method of easily manufacturing the semiconductor apparatus. The method comprises a first step of coating and melting a thermosetting resin in a mold for resin sealing, while keeping the mold at a predetermined temperature, the mold being divided into an upper mold and a lower mold, a second step of fixing within the mold a lead frame supporting a semiconductor chip, and a third step of applying a pressure on the mold and compression-molding the resin, thus forming a package.
Inventors
- 👤 Yumi Inoue
- 👤 Tsutomu Nakazawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:55
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 33
Claim 1
Independent Claim
86 words
A method of manufacturing a semiconductor device, comprising: a first step of coating and melting a thermosetting resin in an inside surface of an upper mold and a lower mold for resin sealing, while keeping the mold at a predetermined!temperature; a second step of fixing within said upper and lower molds one of a lead frame and a TAB tape supporting a semiconductor chip; and a third step of applying a pressure on the upper and lower molds and compression-molding the resin, thus forming a package.
Claim 2
Independent Claim
86 words
A method of manufacturing a semiconductor device, comprising: a first step of coating and melting a thermosetting resin in an inside surface of an upper mold and a lower mold for resin sealing, while keeping the mold at a predetermined!temperature; a second step of fixing within said upper and lower molds one of a lead frame and a TAB tape supporting a semiconductor chip; and a third step of applying a pressure on the upper and lower molds and compression-molding the resin, thus forming a package.
Claim 3
Dependent Claim
34 words
The method of manufacturing the semiconductor device according to claim 1, wherein a powder resin is sprayed to coat the resin on the inside of the upper and lower molds in said first step.
Claim 4
Dependent Claim
45 words
The method of manufacturing the semiconductor device according to claim 2, wherein when said powder resin is sprayed, said powder resin is simultaneously supplied onto the insides of said upper and lower molds from a single nozzle having upwardly and downwardly branched distal end portions.
Claim 5
Dependent Claim
36 words
The method of manufacturing the semiconductor device according to claim 2, wherein when said powder resin is sprayed, said powder resin is supplied separately onto the insides of said upper and lower molds from two nozzles.
Claim 6
Dependent Claim
40 words
The method of manufacturing the semiconductor device according to claim 2, wherein when said powder resin is sprayed, said powder resin is supplied onto the inside of the mold from a nozzle having a plurality of opening distal end portions.
Claim 7
Dependent Claim
35 words
The method of manufacturing the semiconductor device according to claim 3, wherein when said powder resin is sprayed, said powder resin is supplied onto the inside of the mold while the nozzle is being moved.
Claim 8
Dependent Claim
35 words
The method of manufacturing the semiconductor device according to claim 4, wherein when said powder resin is sprayed, said powder resin is supplied onto the inside of the mold while the nozzle is being moved.
Claim 9
Dependent Claim
35 words
The method of manufacturing the semiconductor device according to claim 5, wherein when said powder resin is sprayed, said powder resin is supplied onto the inside of the mold while the nozzle is being moved.
Claim 10
Dependent Claim
34 words
The method of manufacturing the semiconductor device according to claim 2, wherein when said powder resin is sprayed, an equal amount of resin is supplied onto the insides of the upper and lower molds.
Claim 11
Dependent Claim
34 words
The method of manufacturing the semiconductor device according to claim 3, wherein when said powder resin is sprayed, an equal amount of resin is supplied onto the insides of the upper and lower molds.
Claim 12
Dependent Claim
34 words
The method of manufacturing the semiconductor device according to claim 4, wherein when said powder resin is sprayed, an equal amount of resin is supplied onto the insides of the upper and lower molds.
Claim 13
Dependent Claim
34 words
The method of manufacturing the semiconductor device according to claim 5, wherein when said powder resin is sprayed, an equal amount of resin is supplied onto the insides of the upper and lower molds.
Claim 14
Dependent Claim
34 words
The method of manufacturing the semiconductor device according to claim 6, wherein when said powder resin is sprayed, an equal amount of resin is supplied onto the insides of the upper and lower molds.
Claim 15
Dependent Claim
34 words
The method of manufacturing the semiconductor device according to claim 7, wherein when said powder resin is sprayed, an equal amount of resin is supplied onto the insides of the upper and lower molds.
Claim 16
Dependent Claim
34 words
The method of manufacturing the semiconductor device according to claim 8, wherein when said powder resin is sprayed, an equal amount of resin is supplied onto the insides of the upper and lower molds.
Claim 17
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 2, wherein when said powder resin is sprayed, different amounts of resin are supplied onto the insides of the upper and lower molds.
Claim 18
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 3, wherein when said powder resin is sprayed, different amounts of resin are supplied onto the insides of the upper and lower molds.
Claim 19
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 4, wherein when said powder resin is sprayed, different amounts of resin are supplied onto the insides of the upper and lower molds.
Claim 20
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 5, wherein when said powder resin is sprayed, different amounts of resin are supplied onto the insides of the upper and lower molds.
Claim 21
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 6, wherein when said powder resin is sprayed, different amounts of resin are supplied onto the insides of the upper and lower molds.
Claim 22
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 7, wherein when said powder resin is sprayed, different amounts of resin are supplied onto the insides of the upper and lower molds.
Claim 23
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 8, wherein when said powder resin is sprayed, different amounts of resin are supplied onto the insides of the upper and lower molds.
Claim 24
Dependent Claim
41 words
The method of manufacturing the semiconductor device according to claim 1, wherein in order to coat the resin onto the inside of the mold in said first step, a resin formed by powdering a resin table for transfer molding is sprayed.
Claim 25
Dependent Claim
27 words
The method of manufacturing the semiconductor device according to claim 1, wherein a liquid resin is coated onto the inside of the mold in said first step.
Claim 26
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 2, wherein when said powder resin is sprayed, different kinds of resins are supplied onto the insides of the upper and lower molds.
Claim 27
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 3, wherein when said powder resin is sprayed, different kinds of resins are supplied onto the insides of the upper and lower molds.
Claim 28
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 4, wherein when said powder resin is sprayed, different kinds of resins are supplied onto the insides of the upper and lower molds.
Claim 29
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 5, wherein when said powder resin is sprayed, different kinds of resins are supplied onto the insides of the upper and lower molds.
Claim 30
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 6, wherein when said powder resin is sprayed, different kinds of resins are supplied onto the insides of the upper and lower molds.
Claim 31
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 7, wherein when said powder resin is sprayed, different kinds of resins are supplied onto the insides of the upper and lower molds.
Claim 32
Dependent Claim
33 words
The method of manufacturing the semiconductor device according to claim 8, wherein when said powder resin is sprayed, different kinds of resins are supplied onto the insides of the upper and lower molds.
Claim 33
Dependent Claim
17 words
The method of claim 1, wherein the first step is completed prior to beginning the third step.
References Cited (Backward Citations)
US4999319A
Cited
JPH0590314A
Cited
JPH05175264A
Cited
US5304512A
Cited
US5496775A
Cited
US5424250A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2001-03-30 | 2001-09-29 | 2002-03-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2005-03-30 | 2005-09-29 | 2006-03-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2009-03-30 | 2009-09-29 | 2010-03-31 | $7700.00 | Window Closed / Lapsed |