Patent US6127726A successfully refreshed from Google Patents.
US6127726A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cavity down plastic ball grid array multi-chip module
Assignee: 501Fit Studios LLC
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Filing: 1999-05-27
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Granted: 2000-10-03
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Expires: 2019-05-27
Abstract
Abstract A circuit assembly comprising a substrate, a first set of contacts, a second set of contacts, and a third set of contacts. Also, a plurality of electrically conductive lines located on the substrate providing electrical connection between the first set of contacts, the second set of contacts, and the third set of contacts, wherein the plurality of electrically conductive lines are configured such that data can be transferred between the first set of contacts, the second set of contacts and the third set of contacts. A first die is electrically connected to the first set of contacts, and a molding compound surrounds the substrate, wherein the molding compound is formed such that the second set of contacts is exposed allowing electrical connection of the second die to the second set of contacts.
Inventors
- 👤 William T. Bright
- 👤 Donald C. Foster
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 09:32
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/736; H10W90/751; H10W90/754
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
127 words
A circuit assembly comprising: a substrate; a first set of contacts; a second set of contacts; a third set of contacts; a plurality of electrically conductive lines located on the substrate providing electrical connection between the first set of contacts, the second set of contacts, and the third set of contacts, wherein the plurality of electrically conductive lines are configured such that data can be transferred between the first set of contacts, the second set of contacts, and the third set of contacts; a first die electrically connected to the first set of contacts; and an enclosure surrounding the substrate, wherein the enclosure is formed such that the second set of contacts is exposed allowing electrical connection of a second die to the second set of contacts.
Claim 2
Dependent Claim
127 words
A circuit assembly comprising: a substrate; a first set of contacts; a second set of contacts; a third set of contacts; a plurality of electrically conductive lines located on the substrate providing electrical connection between the first set of contacts, the second set of contacts, and the third set of contacts, wherein the plurality of electrically conductive lines are configured such that data can be transferred between the first set of contacts, the second set of contacts, and the third set of contacts; a first die electrically connected to the first set of contacts; and an enclosure surrounding the substrate, wherein the enclosure is formed such that the second set of contacts is exposed allowing electrical connection of a second die to the second set of contacts.
Claim 3
Dependent Claim
41 words
The circuit assembly of claim 1, wherein the first set of contacts are located on a first side of the substrate while the second set of contacts are located on a second side of the substrate opposite to the first side.
Claim 4
Dependent Claim
24 words
The circuit assembly of claim 1, wherein the substrate includes a copper stiffener and wherein the first die is mounted on the copper stiffener.
Claim 5
Dependent Claim
17 words
The circuit assembly of claim 1, wherein the circuit assembly is a plastic ball grid array assembly.
Claim 6
Dependent Claim
16 words
The circuit assembly of claim 1, wherein the first die is an application specific integrated circuit.
Claim 7
Dependent Claim
14 words
The circuit assembly of claim 1, wherein the second die is a memory die.
Claim 8
Dependent Claim
14 words
The circuit assembly of claim 1, wherein the second die is a flip chip.
Claim 9
Dependent Claim
17 words
The circuit assembly of claim 1, wherein the second die is located in a chip scale package.
Claim 10
Dependent Claim
16 words
The circuit assembly of claim 1, wherein the second die is a direct chip attach die.
Claim 11
Dependent Claim
12 words
The circuit of claim 1, wherein the enclosure is a molding compound.
Claim 12
Dependent Claim
12 words
The circuit of claim 1, wherein the enclosure is a copper stiffener.
Claim 13
Dependent Claim
115 words
A circuit assembly comprising: a substrate; a bus formed from a plurality of conductive lines located on the substrate; a first integrated circuit attached to the substrate and electrically connected to the bus; a die connector electrically connected to the bus, wherein the die connector provides a point for an electrical connection of a second integrated circuit to the bus; an input/output connector electrically connected to the bus, wherein the second connector provides a point for electrical connection to the bus; and an enclosure enclosing the substrate, wherein a portion of the substrate containing the die connector is exposed to allow for physical and electrical attachment of the second integrated circuit to the die connector.
Claim 14
Dependent Claim
115 words
A circuit assembly comprising: a substrate; a bus formed from a plurality of conductive lines located on the substrate; a first integrated circuit attached to the substrate and electrically connected to the bus; a die connector electrically connected to the bus, wherein the die connector provides a point for an electrical connection of a second integrated circuit to the bus; an input/output connector electrically connected to the bus, wherein the second connector provides a point for electrical connection to the bus; and an enclosure enclosing the substrate, wherein a portion of the substrate containing the die connector is exposed to allow for physical and electrical attachment of the second integrated circuit to the die connector.
Claim 15
Dependent Claim
38 words
The circuit assembly of claim 12, wherein the die connector is located on a first side of the substrate and wherein the input/output connector is located on a second side of the substrate opposite to the first side.
Claim 16
Dependent Claim
22 words
The circuit assembly of claim 13, wherein input/output connection includes a plurality of terminals configured for connection to a printed circuit board.
Claim 17
Dependent Claim
16 words
The circuit assembly of claim 14, wherein the plurality of terminals comprise a plurality of solderballs.
Claim 18
Dependent Claim
18 words
The circuit assembly of claim 13, wherein the die connector is configured to receive a chip scale package.
Claim 19
Dependent Claim
17 words
The circuit assembly of claim 13, wherein the die connector is configured to receive a flip chip.
Claim 20
Dependent Claim
17 words
The circuit assembly of claim 13, wherein the first integrated circuit is an application specific integrated circuit.
Claim 21
Dependent Claim
14 words
The circuit assembly of claim 13, wherein the second integrated circuit is a memory.
Claim 22
Dependent Claim
17 words
The circuit assembly of claim 13, wherein the second integrated circuit is a application specific integrated circuit.
Claim 23
Dependent Claim
34 words
The circuit assembly of claim 13, wherein the bus is configured such that the first integrated circuit and an external device connected to the input/output connector access the second integrated circuit through the bus.
References Cited (Backward Citations)
US5239198A
Cited
US5869894A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-10-03 | 2004-04-03 | 2004-10-03 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-10-03 | 2008-04-03 | 2008-10-03 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-10-03 | 2012-04-03 | 2012-10-03 | $7700.00 | Window Closed / Lapsed |