Circuit boards using heat resistant resin for adhesive layers

Claim 2

A multilayer printed circuit board comprising a plurality of insulating substrate having conductor circuits thereon, insulating adhesive layers interposed between these insulating substrates alternately, and a plurality of plated through holes electrically connecting conductor circuits, said insulating adhesive layer having a storage elastic modulus at 300° C. of 30 MPa or more and a glass transition temperature of 180° C. or higher, and made from an adhesive composition comprising a polyamide-imide resin and a thermosetting component, wherein the adhesive composition comprises (a) 100 parts by weight of said polyamide-imide resin, said polyamide-imide resin having a molecular weight of 80,000 or more, and (b) 10 to 150 parts by weight of said thermosetting component, said thermosetting component comprising an epoxy resin and a curing agent therefor and/or a curing accelerator therefor, wherein the polyamide-imide resin is an aromatic polyamide-imide resin obtained by reacting an aromatic diimide carboxylic acid, which is obtained by reacting a diamine having 3 or more aromatic rings with trimellitic anhydride, with an aromatic diisocyanate, and wherein the diamine having 3 or more aromatic rings is at least one member selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl]-propane, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, bis[4-(4-aminophenoxy)phenyl]methane, 4,4-bis-(4-aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ketone, 1,3-bis(4-aminophenoxy)benzene, and 1,4-bis(4-aminophenoxy)benzene, and the aromatic diisocyanate is at least one member selected from the group consisting of 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, and 2,4-tolylene dimer.

Claim 3

A wire scribed circuit board comprising an insulating substrate having conductor circuit thereon, an insulating adhesive layer formed thereon, a plurality of wires having an insulating coating and fixed in said insulating adhesive layer, and a plurality of plated through holes formed in portions necessary for electrical connection, said insulating adhesive layer having a storage elastic modulus at 300° C. of 30 MPa or more and a glass transition temperature of 180° C. or higher, and made from an adhesive composition comprising a polyamide-imide resin and a thermosetting component, wherein the adhesive composition comprises (a) 100 parts by weight of the polyamide-imide resin, said polyamide-imide resin having a molecular weight of 80,000 or more, and (b) 10 to 150 parts by weight of said thermosetting component, said thermosetting component comprising an epoxy resin and a curing agent therefor and/or a curing accelerator therefor, wherein the polyamide-imide resin is an aromatic polyamide-imide resin obtained by reacting an aromatic diimide carboxylic acid, which is obtained by reacting a diamine having 3 or more aromatic rings with trimellitic anhydride, with an aromatic diisocyanate, and wherein the diamine having 3 or more aromatic rings is at least one member selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, bis[4-(4-aminophenoxy)phenyl]-methane, 4,4-bis-(4-aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ketone, 1,3-bis(4-aminophenoxy)benzene, and 1,4-bis(4-aminophenoxy)benzene, and the aromatic diisocyanate is at least one member selected from the group consisting of 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, and 2,4-tolylene dimer.

Claim 4

A wire scribed circuit board comprising an insulating substrate having conductor circuit thereon, an insulating adhesive layer formed thereon, a plurality of wires having an insulating coating and fixed in said insulating adhesive layer, and a plurality of plated through holes formed in portions necessary for electrical connection, said insulating adhesive layer having a storage elastic modulus at 300° C. of 30 MPa or more and a glass transition temperature of 180° C. or higher, and made from an adhesive composition comprising a polyamide-imide resin and a thermosetting component, wherein the adhesive composition comprises (a) 100 parts by weight of the polyamide-imide resin, said polyamide-imide resin having a molecular weight of 80,000 or more, and (b) 10 to 150 parts by weight of said thermosetting component, said thermosetting component comprising an epoxy resin and a curing agent therefor and/or a curing accelerator therefor, wherein the polyamide-imide resin is an aromatic polyamide-imide resin obtained by reacting an aromatic diimide carboxylic acid, which is obtained by reacting a diamine having 3 or more aromatic rings with trimellitic anhydride, with an aromatic diisocyanate, and wherein the diamine having 3 or more aromatic rings is at least one member selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone, 2,2-bis[4-(4-aminophenoxy)phenyl]hexafluoropropane, bis[4-(4-aminophenoxy)phenyl]-methane, 4,4-bis-(4-aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ketone, 1,3-bis(4-aminophenoxy)benzene, and 1,4-bis(4-aminophenoxy)benzene, and the aromatic diisocyanate is at least one member selected from the group consisting of 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, and 2,4-tolylene dimer.

Claim 5

A circuit board for chip carrier comprising: a plurality of insulating layers, a plurality of interlayer substrates each having conductor circuits thereon, a plurality of insulating adhesive layers, each insulating adhesive layer bonding each insulating layer and each interlayer substrate or each insulating layer, a plurality of through holes having conductors on inner wall surfaces thereof and electrically connected to the conductor circuits, and a cavity for housing at least one semiconductor chip, each insulating adhesive layer having a storage elastic modulus at 300° C. of 30 MPa or more and a glass transition temperature of 180° C. or higher, and made from an adhesive composition comprising a polyamide-imide resin and a thermosetting component, wherein the adhesive composition comprises (a) 100 parts by weight of said polyamide-imide resin, said polyamide-imide resin having a molecular weight of 80,000 or more, and (b) 10 to 150 parts by weight of said thermosetting component, said thermosetting component comprising an epoxy resin and a curing agent therefor and/or a curing accelerator therefor, wherein the polyamide-imide resin is an aromatic polyamide-imide resin obtained by reacting an aromatic diimide carboxylic acid, which is obtained by reacting a diamine having 3 or more aromatic rings with trimellitic anhydride, with an aromatic diisocyanate, and wherein the diamine having 3 or more aromatic rings is at least one member selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone, 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane, bis[4-(4-aminophenoxy)-phenyl]methane, 4,4-bis-(4-aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ketone, 1,3-bis(4-aminophenoxy)benzene, and 1,4-bis(4-aminophenoxy)benzene, and the aromatic diisocyanate is at least one member selected from the group consisting of 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, and 2,4-tolylene dimer.

Claim 6

A circuit board for chip carrier comprising: a plurality of insulating layers, a plurality of interlayer substrates each having conductor circuits thereon, a plurality of insulating adhesive layers, each insulating adhesive layer bonding each insulating layer and each interlayer substrate or each insulating layer, a plurality of through holes having conductors on inner wall surfaces thereof and electrically connected to the conductor circuits, and a cavity for housing at least one semiconductor chip, each insulating adhesive layer having a storage elastic modulus at 300° C. of 30 MPa or more and a glass transition temperature of 180° C. or higher, and made from an adhesive composition comprising a polyamide-imide resin and a thermosetting component, wherein the adhesive composition comprises (a) 100 parts by weight of said polyamide-imide resin, said polyamide-imide resin having a molecular weight of 80,000 or more, and (b) 10 to 150 parts by weight of said thermosetting component, said thermosetting component comprising an epoxy resin and a curing agent therefor and/or a curing accelerator therefor, wherein the polyamide-imide resin is an aromatic polyamide-imide resin obtained by reacting an aromatic diimide carboxylic acid, which is obtained by reacting a diamine having 3 or more aromatic rings with trimellitic anhydride, with an aromatic diisocyanate, and wherein the diamine having 3 or more aromatic rings is at least one member selected from the group consisting of 2,2-bis[4-(4-aminophenoxy)phenyl]propane, bis[4-(3-aminophenoxy)phenyl]sulfone, bis[4-(4-aminophenoxy)phenyl]sulfone, 2,2-bis[4-(4-aminophenoxy)-phenyl]hexafluoropropane, bis[4-(4-aminophenoxy)-phenyl]methane, 4,4-bis-(4-aminophenoxy)biphenyl, bis[4-(4-aminophenoxy)phenyl]ether, bis[4-(4-aminophenoxy)phenyl]ketone, 1,3-bis(4-aminophenoxy)benzene, and 1,4-bis(4-aminophenoxy)benzene, and the aromatic diisocyanate is at least one member selected from the group consisting of 4,4'-diphenylmethane diisocyanate, 2,4-tolylene diisocyanate, 2,6-tolylene diisocyanate, naphthalene-1,5-diisocyanate, and 2,4-tolylene dimer.