Method to form a protected metal fuse

Claim 1

A method of fabricating a metal fuse surrounded by protective layers; comprising the steps of a) forming a first dielectric layer on a semiconductor structure; b) forming only a bottom protection layer on said first dielectric layer; said bottom protection layer is comprised of a material selected from the group consisting of SiON and SiN; c) forming only a blanket metal layer on said bottom protection layer; and pattering said blanket metal layer to form a metal fuse and metal lines on said bottom protection layer; d) forming only a top protection layer on said metal fuse, said sidewalls of said metal fuse, said metal lines, and said bottom protection layer; said top protection layer and said bottom protection layer forming a moisture-proof seal around said metal fuse; said top protection layer is composed of a material selected from the group consisting of SiN and SiON; e) forming only a second dielectric layer on said top protection layer protection layer; whereby, said top protection layer and said bottom protection layer form a moisture proof seal around said metal fuse and protect said metal fuse from moisture and contaminates.

Claim 2

A method of fabricating a metal fuse surrounded by protective layers; comprising the steps of a) forming a first dielectric layer on a semiconductor structure; b) forming only a bottom protection layer on said first dielectric layer; said bottom protection layer is comprised of a material selected from the group consisting of SiON and SiN; c) forming only a blanket metal layer on said bottom protection layer; and pattering said blanket metal layer to form a metal fuse and metal lines on said bottom protection layer; d) forming only a top protection layer on said metal fuse, said sidewalls of said metal fuse, said metal lines, and said bottom protection layer; said top protection layer and said bottom protection layer forming a moisture-proof seal around said metal fuse; said top protection layer is composed of a material selected from the group consisting of SiN and SiON; e) forming only a second dielectric layer on said top protection layer protection layer; whereby, said top protection layer and said bottom protection layer form a moisture proof seal around said metal fuse and protect said metal fuse from moisture and contaminates.

Claim 7

A method of fabricating a metal fuse surrounded by protective layers; comprising the steps of: a) forming a first dielectric layer on a semiconductor structure; said first dielectric layer is a interlevel dielectric or an inter metal dielectric layer; b) forming only a bottom protection layer on the entire surface of said first dielectric layer; (1) said bottom protection layer comprised of a material selected from the group consisting of SiON and SiN, and said bottom protection layer having a thickness in a range of between about 500 and 2000 Å; c) forming only a blanket metal layer over said bottom protection layer; and pattering said blanket metal layer to form a metal fuse and metal lines over said bottom protection layer; (1) said metal fuse is composed of an aluminum cooper alloy; d) forming a top protection layer on said fuse metal, said metal lines, said sidewalls of said metal fuse and said bottom protection layer; said a top protection layer and said bottom protection layer forming a moisture-proof seal around said metal fuse; (1) said top protection layer is composed of a material selected from the group consisting of SiN and SiON; and said top protection layer having a thickness in a range of between about 500 and 1000 Å; e) forming only a second dielectric layer on said metal fuse layer, said top protection layer and said bottom fuse protection layer; whereby, said top protection layer and said bottom protection layer form a moisture proof seal around said metal fuse and protect said metal fuse from moisture and contaminates.

Claim 8

A method of fabricating a metal fuse surrounded by protective layers; comprising the steps of: a) forming a first dielectric layer on a semiconductor structure; said first dielectric layer is a interlevel dielectric or an inter metal dielectric layer; b) forming only a bottom protection layer on the entire surface of said first dielectric layer; (1) said bottom protection layer comprised of a material selected from the group consisting of SiON and SiN, and said bottom protection layer having a thickness in a range of between about 500 and 2000 Å; c) forming only a blanket metal layer over said bottom protection layer; and pattering said blanket metal layer to form a metal fuse and metal lines over said bottom protection layer; (1) said metal fuse is composed of an aluminum cooper alloy; d) forming a top protection layer on said fuse metal, said metal lines, said sidewalls of said metal fuse and said bottom protection layer; said a top protection layer and said bottom protection layer forming a moisture-proof seal around said metal fuse; (1) said top protection layer is composed of a material selected from the group consisting of SiN and SiON; and said top protection layer having a thickness in a range of between about 500 and 1000 Å; e) forming only a second dielectric layer on said metal fuse layer, said top protection layer and said bottom fuse protection layer; whereby, said top protection layer and said bottom protection layer form a moisture proof seal around said metal fuse and protect said metal fuse from moisture and contaminates.

Claim 9

A method of fabricating a metal fuse surrounded by protective layers; comprising the steps of: a) forming a first dielectric layer on a semiconductor structure; said first dielectric layer is a interlevel dielectric or an inter metal dielectric layer; b) forming only a bottom protection layer on the entire surface said first dielectric layer; (1) said bottom protection layer comprised of a material selected from the group consisting of SiON and SiN, and said bottom protection layer having a thickness in a range of between about 500 and 2000 Å; c) forming only a blanket metal layer on said bottom protection layer; and pattering said blanket metal layer to form a metal fuse and metal lines over said bottom protection layer; (1) said metal fuse and metal lines composed of an aluminum cooper alloy; d) forming only a top protection layer on said fuse metal, said metal lines, said sidewalls of said metal fuse and said bottom protection layer; said a top protection layer and said bottom protection layer forming a moisture-proof seal around said metal fuse; (1) said top protection layer is composed of a material selected from the group consisting of SiN and SiON; and said top protection layer having a thickness in a range of between about 500 and 1000 Å; e) forming only a second dielectric layer on said metal fuse layer, said metal lines, said top protection layer and said bottom fuse protection layer; whereby, said top protection layer and said bottom protection layer form a moisture proof seal around said metal fuse and protect said metal fuse from moisture and contaminates.

Claim 10

A method of fabricating a metal fuse surrounded by protective layers; comprising the steps of: a) forming a first dielectric layer on a semiconductor structure; said first dielectric layer is a interlevel dielectric or an inter metal dielectric layer; b) forming only a bottom protection layer on the entire surface said first dielectric layer; (1) said bottom protection layer comprised of a material selected from the group consisting of SiON and SiN, and said bottom protection layer having a thickness in a range of between about 500 and 2000 Å; c) forming only a blanket metal layer on said bottom protection layer; and pattering said blanket metal layer to form a metal fuse and metal lines over said bottom protection layer; (1) said metal fuse and metal lines composed of an aluminum cooper alloy; d) forming only a top protection layer on said fuse metal, said metal lines, said sidewalls of said metal fuse and said bottom protection layer; said a top protection layer and said bottom protection layer forming a moisture-proof seal around said metal fuse; (1) said top protection layer is composed of a material selected from the group consisting of SiN and SiON; and said top protection layer having a thickness in a range of between about 500 and 1000 Å; e) forming only a second dielectric layer on said metal fuse layer, said metal lines, said top protection layer and said bottom fuse protection layer; whereby, said top protection layer and said bottom protection layer form a moisture proof seal around said metal fuse and protect said metal fuse from moisture and contaminates.