Patent US6233049B1 successfully refreshed from Google Patents.
Patent US6097085A successfully refreshed from Google Patents.
US6097085A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electronic device and semiconductor package
Assignee: Toshiba Corp
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Filing: 1998-08-26
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Granted: 2000-08-01
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Expires: 2018-08-26
Abstract
Abstract The electronic device has a structure that a semiconductor package is mounted on a mother board. To relieve stress caused by cyclic thermal load and applied to solder bumps that are electrically and mechanically connect the semiconductor package and the mother board, a shape-holding plate (stiffener) adhered to a wiring film is composed of a metal with a thermal expansion coefficient of 13x10-6 to 17x10-6 almost close to that of a glass-epoxy wiring substrate as the mother board. Examples of the metal are 25Cr-20Ni stainless steel or copper alloy containing 0.01 to 0.03% by weight of Zr.
Inventors
- 👤 Morihiko Ikemizu
- 👤 Nobuaki Oie
- 👤 Ken Iwasaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 11:54
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H10W40/00; H10W40/20; H10W40/25; H10W40/258; H10W70/00; H10W70/40; H10W70/453; H10W70/456; H10W70/457; H10W74/131; H10W74/137; H10W76/00; H10W76/60; H10W70/60; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
149 words
An electronic device, comprising: a wiring substrate having connecting terminals formed on one main face thereof: a semiconductor package having: a wiring film having a device hole, external connecting terminals, and inner leads, the external connecting terminals and the inner leads being formed on one face thereof, a semiconductor element disposed in the device hole and electrically connected to the inner leads, and a shape-holding plate composed of a metal having a thermal expansion coefficient almost close to that of the wiring substrate, the shape-holding plate being disposed in a region that surrounds the device hole on the other main face of the wiring film; and bumps for electrically and mechanically connecting the external connecting terminals of the semiconductor package and the connecting terminals of the wiring substrate, wherein the shape-holding plate is composed of 25Cr-20Ni stainless steel or copper alloy containing 0.01 to 0.03% by weight of Zr.
Claim 2
Dependent Claim
149 words
An electronic device, comprising: a wiring substrate having connecting terminals formed on one main face thereof: a semiconductor package having: a wiring film having a device hole, external connecting terminals, and inner leads, the external connecting terminals and the inner leads being formed on one face thereof, a semiconductor element disposed in the device hole and electrically connected to the inner leads, and a shape-holding plate composed of a metal having a thermal expansion coefficient almost close to that of the wiring substrate, the shape-holding plate being disposed in a region that surrounds the device hole on the other main face of the wiring film; and bumps for electrically and mechanically connecting the external connecting terminals of the semiconductor package and the connecting terminals of the wiring substrate, wherein the shape-holding plate is composed of 25Cr-20Ni stainless steel or copper alloy containing 0.01 to 0.03% by weight of Zr.
Claim 3
Dependent Claim
16 words
The electronic device as set forth in claim 1, wherein the bumps are Pb-Sn solder bumps.
Claim 4
Dependent Claim
23 words
The electronic device as set forth in claim 1, further comprising: a covering member disposed outside the semiconductor element of said semiconductor package.
Claim 5
Dependent Claim
54 words
The electronic device as set forth in claim 1, wherein the wiring substrate is a glass-epoxy wiring substrate of which glass cloths impregnated with epoxy resin and copper wiring layers are laminated, and wherein the shape-holding plate is composed of a metal having a thermal expansion coefficient of 13×16 -6 to 17×10 -6 (/K).
Claim 6
Dependent Claim
154 words
An electronic device, comprising: a wiring substrate having connecting terminals formed on one main face thereof; a semiconductor package having: a wiring film having a device hole, external connecting terminals, and inner leads, the external connecting terminals and the inner leads being formed on one face thereof, a semiconductor element disposed in the device hole and electrically connected to the inner leads, and a covering member having a shape-holding characteristic composed of a metal, the covering member having a thermal expansion coefficient almost closed to that of the wiring substrate, fully covering the outside of the semiconductor element, being adhered on the other main face of the wiring film; and bumps for electrically and mechanically connecting the external connecting materials terminals of the semiconductor package and the connecting terminals of the wiring substrate, wherein the covering member is composed of 25Cr-20Ni stainless steel or copper alloy containing 0.01 to 0.03% by weight of Zr.
Claim 7
Dependent Claim
154 words
An electronic device, comprising: a wiring substrate having connecting terminals formed on one main face thereof; a semiconductor package having: a wiring film having a device hole, external connecting terminals, and inner leads, the external connecting terminals and the inner leads being formed on one face thereof, a semiconductor element disposed in the device hole and electrically connected to the inner leads, and a covering member having a shape-holding characteristic composed of a metal, the covering member having a thermal expansion coefficient almost closed to that of the wiring substrate, fully covering the outside of the semiconductor element, being adhered on the other main face of the wiring film; and bumps for electrically and mechanically connecting the external connecting materials terminals of the semiconductor package and the connecting terminals of the wiring substrate, wherein the covering member is composed of 25Cr-20Ni stainless steel or copper alloy containing 0.01 to 0.03% by weight of Zr.
Claim 8
Dependent Claim
16 words
The electronic device as set forth in claim 5, wherein the bumps are Pb-Sn solder bumps.
Claim 9
Dependent Claim
54 words
The electronic device as set forth in claim 5, wherein the wiring substrate is a glass-epoxy wiring substrate of which glass cloths impregnated with epoxy resin and copper wiring layers are laminated, and wherein the covering member is composed of a metal having a thermal expansion coefficient of 13×16 -6 to 17×10 -6 (/K).
Claim 10
Dependent Claim
109 words
A semiconductor package, comprising: a wiring film having a device hole, external connecting terminals, and inner leads, the external connecting terminals and the inner leads being formed on one face thereof; a semiconductor element disposed in the device hole and electrically connected to the inner leads; and a shape-holding plate composed of a metal having a thermal expansion coefficient of 13×16 -6 to 17×10 -6 (/K), the shape-holding plate being disposed in a region that surrounds the device hole on the other main face of the wiring film, wherein the shape-holding plate is composed of 25Cr-20Ni stainless steel or copper alloy containing 0.01 to 0.03% by weight of Zr.
Claim 11
Dependent Claim
109 words
A semiconductor package, comprising: a wiring film having a device hole, external connecting terminals, and inner leads, the external connecting terminals and the inner leads being formed on one face thereof; a semiconductor element disposed in the device hole and electrically connected to the inner leads; and a shape-holding plate composed of a metal having a thermal expansion coefficient of 13×16 -6 to 17×10 -6 (/K), the shape-holding plate being disposed in a region that surrounds the device hole on the other main face of the wiring film, wherein the shape-holding plate is composed of 25Cr-20Ni stainless steel or copper alloy containing 0.01 to 0.03% by weight of Zr.
Claim 12
Dependent Claim
20 words
The semiconductor package as set forth in claim 8, wherein Pb-Sn solder bumps are disposed on the external connecting terminals.
Claim 13
Dependent Claim
113 words
A semiconductor package, comprising: a wiring film having a device hole, external connecting terminals, and inner leads, the external connecting terminals and the inner leads being formed on one face thereof; a semiconductor element disposed in the device hole and electrically connected to the inner leads; and a covering member having a shape-holding characteristic composed of a metal, the covering member having a thermal expansion coefficient of 13×16 -6 to 17×10 -6 (/K), fully covering the outside of the semiconductor element, being adhered on the other main face of the wiring film, wherein the covering member is composed of 25Cr-20Ni stainless steal or copper alloy containing 0.01 to 0.03% by weight of Zr.
Claim 14
Dependent Claim
113 words
A semiconductor package, comprising: a wiring film having a device hole, external connecting terminals, and inner leads, the external connecting terminals and the inner leads being formed on one face thereof; a semiconductor element disposed in the device hole and electrically connected to the inner leads; and a covering member having a shape-holding characteristic composed of a metal, the covering member having a thermal expansion coefficient of 13×16 -6 to 17×10 -6 (/K), fully covering the outside of the semiconductor element, being adhered on the other main face of the wiring film, wherein the covering member is composed of 25Cr-20Ni stainless steal or copper alloy containing 0.01 to 0.03% by weight of Zr.
Claim 15
Dependent Claim
20 words
The semiconductor package as set forth in claim 10, wherein Pb-Sn solder bumps are disposed on the external connecting terminals.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-08-01 | 2004-01-31 | 2004-08-01 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-08-01 | 2008-01-31 | 2008-08-01 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-08-01 | 2012-01-31 | 2012-08-01 | $7700.00 | Window Closed / Lapsed |