US6093630A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semi-conductor personalization structure and method
Assignee: International Business Machines Corp
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Filing: 1998-05-18
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Granted: 2000-07-25
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Expires: 2018-05-18
Abstract
Abstract The preferred embodiment of the present invention provides a structure and method for personalizing a semiconductor device in the context of a bump array connection to packaging, substrates and such. The preferred embodiment method uses a plurality of conduction lines on said semiconductor device, including a plurality of landing lines and personalization lines. Vias are opened to the plurality of landing lines and selectively opened to a portion of the personalization lines. Connections are made between the opened personalization lines with bumps deposited as part of the bump array.
Inventors
- 👤 Robert Michael Geffken
- 👤 William Thomas Motsiff
- 👤 Ronald R. Uttecht
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 10:22
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/40; H10W20/49; H10W72/00; H10W72/01; H10W72/019; H10W72/20; H10W72/251; H10W72/50; H10W72/551; H10W72/552; H10W72/5524; H10W72/90; H10W72/921; H10W72/923; H10W72/931; H10W72/934; H10W72/936; H10W72/941; H10W72/9415; H10W72/951; H10W72/952
Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
185 words
A method of selectively personalizing a semiconductor device comprising the steps of: a) forming a plurality of conduction lines on said semiconductor device, including a plurality of landing lines and including a plurality of personalization lines sets, wherein each of said personalization line sets comprises at least two personalization lines in relatively close proximity to each other, wherein said at least two personalization lines are each connected to said semiconductor device such that a connection between at least two personlizatio lines programs said device; b) depositing an insulator layer on top of said semiconductor device; c) opening vias in said insulator layer to at lest a portion of said landing lines; d) selectively opening vias in said insulator layer to at least one of said personalization line sets; and d) depositing an array of device connection bumps over said plurality of conduction lines; said array of device connection bumps including at least one bump forming an interconnect connection to said at least one of said plurality of landing lines and at least one bump forming a connection between one of said sets of personalization lines.
Claim 2
Independent Claim
185 words
A method of selectively personalizing a semiconductor device comprising the steps of: a) forming a plurality of conduction lines on said semiconductor device, including a plurality of landing lines and including a plurality of personalization lines sets, wherein each of said personalization line sets comprises at least two personalization lines in relatively close proximity to each other, wherein said at least two personalization lines are each connected to said semiconductor device such that a connection between at least two personlizatio lines programs said device; b) depositing an insulator layer on top of said semiconductor device; c) opening vias in said insulator layer to at lest a portion of said landing lines; d) selectively opening vias in said insulator layer to at least one of said personalization line sets; and d) depositing an array of device connection bumps over said plurality of conduction lines; said array of device connection bumps including at least one bump forming an interconnect connection to said at least one of said plurality of landing lines and at least one bump forming a connection between one of said sets of personalization lines.
Claim 3
Dependent Claim
34 words
The method of claim 1 wherein said step of depositing an insulator layer comprises depositing an insulator layer capable of having vias opened in said insulator layer by laser ablation without damaging the semiconductor.
Claim 4
Dependent Claim
11 words
The method of claim 2 wherein said insulator layer comprises polyimide.
Claim 5
Dependent Claim
33 words
The method of claim 1 wherein said step of depositing an array of device connection bumps comprises depositing an array of transition layers and an array connection bumps on array of transition layers.
Claim 6
Dependent Claim
28 words
The method of claim 1 wherein said step of selectively opening vias to at least one of said personalization line sets comprises opening said vias by laser ablation.
Claim 7
Dependent Claim
26 words
The method of claim 1 wherein said step of depositing an array of device connection bumps comprises depositing an array of controlled collapse chip connection bumps.
Claim 8
Dependent Claim
19 words
The method of claim 1 further comprising the step of depositing transition layers atop said plurality of conduction lines.
Claim 9
Dependent Claim
70 words
The method of claim 1 further comprising the step of forming contacts above each said landing lines and each of said personalization lines and wherein said step of opening vias in said insulator layer to at least a portion of said landing lines and said step of selectively opening vias in said insulator layer to at least one of said sets of personalization lines comprise opening vias to said contacts.
Claim 10
Dependent Claim
11 words
The method of claim 1 wherein said conduction lines comprise copper.
Claim 11
Dependent Claim
11 words
The method of claim 1 wherein said conduction lines comprise aluminum.
Claim 12
Dependent Claim
19 words
The method of claim 1 wherein said conduction lines are formed as part of the last metal layer interconnect.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-25 | 2004-01-24 | 2004-07-25 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-25 | 2008-01-24 | 2008-07-25 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-25 | 2012-01-24 | 2012-07-25 | $7700.00 | Window Closed / Lapsed |