Multilayer wiring board for mounting semiconductor device and method of producing the same

Claim 1

A multilayer wiring board for mounting a semiconductor device, which has a multi-bonding-deck cavity for housing a semiconductor device and comprises at least two wiring boards each having at least one wiring surface and a cavity, the cavity of one wiring board being larger in size of circumference than the cavity of the other wiring board, the wiring boards being put in layers, with a circumference of the cavity of one wiring board being exterior to a circumference of the cavity of the other wiring board, and bonded to each other with an insulation adhesive layer, the insulation adhesive layer having an elastic modulus of 1,400 MPa or lower as measured at 25° C., having a coefficient of thermal expansion of 450 ppm/° C. or lower in a direction of thickness and being a cured product of an adhesive film which is a semi-cured product of an adhesive composition, the adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber which is a copolymerization product of 18 to 40% by weight of acrylonitrile, 2 to 6% by weight of glycidyl acrylate, glycidyl methacrylate or a mixture thereof as a functional group-containing monomer and balance of at least one selected from the group consisting of ethyl acrylate, ethyl methacrylate, butyl acrylate and butyl methacrylate, and has a glass transition point of -10° C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.

Claim 9

A method of producing a multilayer wiring board for mounting a semiconductor device, comprising forming a laminate composite by putting in layers at least a first wiring board and a second wiring board each having at least one wiring surface and a cavity, the cavity of the first wiring board being larger in size of circumference than the cavity of the second wiring board, with an adhesive film, which has a cavity being identical in size and shape of circumference with the cavity of the first wiring board, disposed between the two wiring boards, so that the circumference of the cavity of the first wiring board is located exterior to the circumference of the cavity of the second wiring board and is located just on the circumference of the cavity of the adhesive film, and bonding the laminate composite with heat and pressure, the adhesive film being a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber which is a copolymerization product of 18 to 40% by weight of acrylonitrile, 2 to 6% by weight of glycidyl acrylate, glycidyl methacrylate or a mixture thereof as a functional group-containing monomer and balance of at least one selected from the group consisting of ethyl acrylate, ethyl methacrylate, butyl acrylate and butyl methacrylate, and has a glass transition point of -10° C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.

Claim 10

A method of producing a multilayer wiring board for mounting a semiconductor device, comprising forming a laminate composite by putting in layers at least a first wiring board and a second wiring board each having at least one wiring surface and a cavity, the cavity of the first wiring board being larger in size of circumference than the cavity of the second wiring board, with an adhesive film, which has a cavity being identical in size and shape of circumference with the cavity of the first wiring board, disposed between the two wiring boards, so that the circumference of the cavity of the first wiring board is located exterior to the circumference of the cavity of the second wiring board and is located just on the circumference of the cavity of the adhesive film, and bonding the laminate composite with heat and pressure, the adhesive film being a semi-cured product of an adhesive composition comprising (a) 71 to 100 parts by weight of an epoxy group-containing acrylic rubber which is a copolymerization product of 18 to 40% by weight of acrylonitrile, 2 to 6% by weight of glycidyl acrylate, glycidyl methacrylate or a mixture thereof as a functional group-containing monomer and balance of at least one selected from the group consisting of ethyl acrylate, ethyl methacrylate, butyl acrylate and butyl methacrylate, and has a glass transition point of -10° C. or above and a weight average molecular weight of 100,000 or above, (b) 50 to 70 parts by weight of a combination of an epoxy resin having a weight average molecular weight of less than 10,000 and a curing agent, (c) 10 to 60 parts by weight of a high-molecular weight resin being compatible with the epoxy resin and having a weight average molecular weight of 30,000 or above and (d) 0.1 to 5 parts by weight of a cure accelerator.