US5323534A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Process for producing coaxial conductor interconnection wiring board
Assignee: Hitachi Ltd
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Filing: 1993-03-08
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Granted: 1994-06-28
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Expires: 2013-03-08
Abstract
Abstract A coaxial conductor interconnection wiring board characterized by having at least one inner wall metallized conductive hole for connecting a conductive shield of coaxial conductor to a ground layer, or having connection metal layers for connecting ground layers or connecting the conductive shield to a ground layer, and an inner wall metallized conductive hole for connecting a central signal conductor of coaxial conductor to other circuits, is excellent in preventing crosstalk noise and shielding effect.
Inventors
- 👤 Yorio Iwasaki
- 👤 Toshiro Okamura
- 👤 Shigeharu Arike
- 👤 Yasushi Shimada
- 👤 Hiroharu Kamiyama
- 👤 Eisaku Namai
- 👤 Fujio Kojima
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 12:55
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K1/0219; H05K3/00; H05K3/40; H05K3/42; H05K3/429; H05K7/00; H05K7/02; H05K7/06; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09654; H05K2201/09809; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K3/10; H05K3/103; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49155; Y10T29/49162
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
407 words
A process for producing a coaxial conductor interconnection wiring board including a circuit substrate having a ground layer, an adhesive insulating layer formed on the circuit substrate, at least one coaxial conductor with a desired shape fixed on the surface of the adhesive insulating layer, at least one inner wall metallized conductive hole connected to a conductive shield of the coaxial conductor and the ground layer, and at least one inner wall metallized conductive hole connected to a central signal conductor of the coaxial conductor, connection of the central signal conductor to the inner wall metallized conductive hole being obtained by using the coaxial conductor from which a part of conductive shield has been removed selectively, the process comprising the steps of: fixing a plurality of coaxial conductors with a desired form on an adhesive insulating layer formed on a surface of a circuit substrate having a ground layer, forming an insulating layer on the coaxial conductors, removing a portion of the circuit substrate having the ground layer thereon and the adhesive insulating layer to form a conductive hole for connecting the ground layer to a conductive shield of a coaxial conductor of the coaxial conductors, and removing an additional portion of the insulating layer, the circuit substrate having the ground layer thereon and the adhesive insulating layer to expose the conductive shield of the coaxial conductor and to form a conductive hole for connecting the center signal conductor of the coaxial conductor to additional circuits, by irradiating laser beam, metallizing an inner wall of the conductive hole for connecting the ground layer to the conductive shield of the coaxial conductor, selectively removing the exposed conductive shield of coaxial conductor in the conductive hole for connecting the central signal conductor of the coaxial conductor to the additional circuits by etching, integrating the resulting substrate, the insulating layer and an inner plate, and filling the portion to be formed into the conductive hole for connecting the central signal conductor to the additional circuits and from which the portion of the insulating material has been removed with a resin, and drilling a hole filled with the resin, and metallizing an inner wall of the hole which connects the central signal conductor to the additional circuits, wherein in the removing step, the laser beams are irradiated from a side of the insulating layer and from a side of the circuit substrate to substantially expose the conductive shield of coaxial conductor.
Claim 2
Dependent Claim
407 words
A process for producing a coaxial conductor interconnection wiring board including a circuit substrate having a ground layer, an adhesive insulating layer formed on the circuit substrate, at least one coaxial conductor with a desired shape fixed on the surface of the adhesive insulating layer, at least one inner wall metallized conductive hole connected to a conductive shield of the coaxial conductor and the ground layer, and at least one inner wall metallized conductive hole connected to a central signal conductor of the coaxial conductor, connection of the central signal conductor to the inner wall metallized conductive hole being obtained by using the coaxial conductor from which a part of conductive shield has been removed selectively, the process comprising the steps of: fixing a plurality of coaxial conductors with a desired form on an adhesive insulating layer formed on a surface of a circuit substrate having a ground layer, forming an insulating layer on the coaxial conductors, removing a portion of the circuit substrate having the ground layer thereon and the adhesive insulating layer to form a conductive hole for connecting the ground layer to a conductive shield of a coaxial conductor of the coaxial conductors, and removing an additional portion of the insulating layer, the circuit substrate having the ground layer thereon and the adhesive insulating layer to expose the conductive shield of the coaxial conductor and to form a conductive hole for connecting the center signal conductor of the coaxial conductor to additional circuits, by irradiating laser beam, metallizing an inner wall of the conductive hole for connecting the ground layer to the conductive shield of the coaxial conductor, selectively removing the exposed conductive shield of coaxial conductor in the conductive hole for connecting the central signal conductor of the coaxial conductor to the additional circuits by etching, integrating the resulting substrate, the insulating layer and an inner plate, and filling the portion to be formed into the conductive hole for connecting the central signal conductor to the additional circuits and from which the portion of the insulating material has been removed with a resin, and drilling a hole filled with the resin, and metallizing an inner wall of the hole which connects the central signal conductor to the additional circuits, wherein in the removing step, the laser beams are irradiated from a side of the insulating layer and from a side of the circuit substrate to substantially expose the conductive shield of coaxial conductor.
Claim 3
Dependent Claim
31 words
A process according to claim 1, wherein the conductive shield of coaxial conductor is made of a wound wire of copper, a copper foil or a copper layer obtained by plating.
Claim 4
Dependent Claim
18 words
A process according to claim 1, wherein the coaxial conductor has an adhesive layer on the conductive shield.
Claim 5
Dependent Claim
41 words
A process according to claim 1, wherein the insulating layer and the adhesive insulating layer are made from a thermosetting resin or a photocurable resin containing an organic cloth, an organic filler, an inorganic particulate filler or an inorganic short-fiber filler.
Claim 6
Dependent Claim
236 words
A process for producing a coaxial conductor interconnection wiring board comprising the steps of: fixing a plurality of coaxial conductors with a desired shape on an adhesive insulating layer formed on an insulating substrate, forming an insulating layer on the coaxial conductors, exposing portions of the insulating layer, the adhesive insulating layer and the insulating substrate to a laser beam so as to remove unnecessary portions for forming connection metal layers, removing only a portion of a conductive shield of the coaxial conductors retained by said laser beam in the exposing step by etching, forming the connection metal layers by plating on said exposed insulating substrate, and exposed insulating layer and adhesive insulating layer, and the entire surfaces of the insulating substrate and the insulating layer to form ground layers, and for connecting at least two of the ground layers, and for connecting the conductive shield of the coaxial conductor to the ground layer, filling the unnecessary portions removed by the laser beam with an insulating resin, drilling a hole in the insulating resin to expose a terminal of a central signal conductor and a conductor insulating layer of the coaxial conductors or a cross-section thereof and to be insulated from the conductive shield and the connection metal layers and the ground layer formed in the step of forming the connection metal layers, and metallizing an inner wall of the hole drilled in the drilling step.
Claim 7
Dependent Claim
236 words
A process for producing a coaxial conductor interconnection wiring board comprising the steps of: fixing a plurality of coaxial conductors with a desired shape on an adhesive insulating layer formed on an insulating substrate, forming an insulating layer on the coaxial conductors, exposing portions of the insulating layer, the adhesive insulating layer and the insulating substrate to a laser beam so as to remove unnecessary portions for forming connection metal layers, removing only a portion of a conductive shield of the coaxial conductors retained by said laser beam in the exposing step by etching, forming the connection metal layers by plating on said exposed insulating substrate, and exposed insulating layer and adhesive insulating layer, and the entire surfaces of the insulating substrate and the insulating layer to form ground layers, and for connecting at least two of the ground layers, and for connecting the conductive shield of the coaxial conductor to the ground layer, filling the unnecessary portions removed by the laser beam with an insulating resin, drilling a hole in the insulating resin to expose a terminal of a central signal conductor and a conductor insulating layer of the coaxial conductors or a cross-section thereof and to be insulated from the conductive shield and the connection metal layers and the ground layer formed in the step of forming the connection metal layers, and metallizing an inner wall of the hole drilled in the drilling step.
Claim 8
Dependent Claim
315 words
A process for producing a coaxial conductor interconnection wiring board comprising the steps of: fixing a plurality of coaxial conductors with a desired shape on an adhesive insulating layer formed on an insulating substrate, forming an insulating layer on the coaxial conductors, exposing portions of the insulating layer, the adhesive insulating layer and the insulating substrate to a laser beam to remove unnecessary portions for forming connection metal layers, forming the connection metal layers by plating to an exposed conductive shield of a coaxial conductor, the exposed insulating layer and the adhesive insulating layer, and the entire surfaces of the insulating substrate and the insulating layer to form ground layers, and for connecting at least two of the ground layers and for connecting the conductive shield of the coaxial conductor to the ground layers, filling the unnecessary portions removed by the laser beam with an insulating resin, removing a portion of the insulating resin by exposing to the laser beam in a range narrower than connecting portions of the connection metal layers by forming a hole while exposing a terminal of the coaxial conductor including a central signal conductor, a conductor insulating layer and the conductive shield and the ground layers formed around the coaxial conductor to the resulting hole, removing the conductive shield of the coaxial conductor exposed to the hole by etching, filling the unnecessary portions removed by the laser beam with another insulating resin, drilling an additional hole at a portion filled with the other insulating resin to expose terminals of the central signal conductor and the conductor insulating layer of coaxial conductor or cross-section thereof and to be insulated from the conductive shield of coaxial conductor, and the ground layer and the connection metal layers formed in the step of removing the portion of the insulating resin, and metallizing an inner wall of the additional hole drilled in the drilling step.
Claim 9
Dependent Claim
315 words
A process for producing a coaxial conductor interconnection wiring board comprising the steps of: fixing a plurality of coaxial conductors with a desired shape on an adhesive insulating layer formed on an insulating substrate, forming an insulating layer on the coaxial conductors, exposing portions of the insulating layer, the adhesive insulating layer and the insulating substrate to a laser beam to remove unnecessary portions for forming connection metal layers, forming the connection metal layers by plating to an exposed conductive shield of a coaxial conductor, the exposed insulating layer and the adhesive insulating layer, and the entire surfaces of the insulating substrate and the insulating layer to form ground layers, and for connecting at least two of the ground layers and for connecting the conductive shield of the coaxial conductor to the ground layers, filling the unnecessary portions removed by the laser beam with an insulating resin, removing a portion of the insulating resin by exposing to the laser beam in a range narrower than connecting portions of the connection metal layers by forming a hole while exposing a terminal of the coaxial conductor including a central signal conductor, a conductor insulating layer and the conductive shield and the ground layers formed around the coaxial conductor to the resulting hole, removing the conductive shield of the coaxial conductor exposed to the hole by etching, filling the unnecessary portions removed by the laser beam with another insulating resin, drilling an additional hole at a portion filled with the other insulating resin to expose terminals of the central signal conductor and the conductor insulating layer of coaxial conductor or cross-section thereof and to be insulated from the conductive shield of coaxial conductor, and the ground layer and the connection metal layers formed in the step of removing the portion of the insulating resin, and metallizing an inner wall of the additional hole drilled in the drilling step.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1997-06-27 | 1997-12-27 | 1998-06-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-06-27 | 2001-12-27 | 2002-06-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-06-27 | 2005-12-27 | 2006-06-28 | $7700.00 | Window Closed / Lapsed |