EP0219815A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Coaxial interconnection boards and process for making same
Assignee: Advanced Interconnection Technology Inc
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Filing: 1986-10-16
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Granted: —
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Expires: 2006-10-16
Abstract
Abstract in making coaxial interconnection boards according to this invention coaxial conductors are scribed onto a circuit board substrate. The coaxial conductors are preformed and affixed in a predetermined pattern on the substrate using an adhesive. A conductive layer forming a ground plane covers the surface of the substrate interconnecting the shields of the coaxial conductors. The conductive material other than the coaxial signal conductors is eliminated around the termina- tion points of the coaxial conductors thereby creating clearance areas. The clearance areas permit connection of the signal conductors to surface terminal pads without shorting to the shield conductors or ground planes.
Inventors
- 👤 Leonard Schieber
- 👤 J. Philip Plonski
- 👤 Michael Vignola
- 👤 Benjamin G. Chin
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 13:47
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/0213; H05K1/0216; H05K1/0218; H05K1/0219; H05K7/00; H05K7/02; H05K7/06; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09509; H05K2201/09654; H05K2201/09809; H05K2201/10; H05K2201/10227; H05K2201/10287; H05K3/00; H05K3/10; H05K3/103; H05K3/40; H05K3/42; H05K3/429
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
114 words
A wire scribed circuit board comprising an insulating planar substrate provided with a conductive ground plane; a plurality of terminal points on the surface of said substrate; at least one elongated preformed signal conductor surrounded by an insulating coating extending along its lengths and a conductive shield external to said insulating coating to form a coaxial conductor; each terminal point being surrounded by an area which is free of any conductive material other than said signal conductor; said conductive shield being electrically connected to said ground plane; and said signal conductor being adhered to said base following a predetermined path between terminal points and being terminated within said areas free of said conductive shields.
Claim 2
Dependent Claim
114 words
A wire scribed circuit board comprising an insulating planar substrate provided with a conductive ground plane; a plurality of terminal points on the surface of said substrate; at least one elongated preformed signal conductor surrounded by an insulating coating extending along its lengths and a conductive shield external to said insulating coating to form a coaxial conductor; each terminal point being surrounded by an area which is free of any conductive material other than said signal conductor; said conductive shield being electrically connected to said ground plane; and said signal conductor being adhered to said base following a predetermined path between terminal points and being terminated within said areas free of said conductive shields.
Claim 3
Dependent Claim
16 words
The wire scribed circuit board of claim 1 wherein said conductor is a preformed coaxial conductor.
Claim 4
Dependent Claim
38 words
The wire scribed circuit board of claim 1 or claim 2 wherein conductive material is removed by etching, exposure to laser energy or drilling, or by a combination thereof, to form, at least in part, said clearance areas.
Claim 5
Dependent Claim
124 words
A process for manufacturing a coaxial conductor circuit board using signal conductors surrounded with dielectric insulating material, the process comprising - providing an insulating planar substrate with a plurality of longitudinally and transversely spaced terminal points on the surface thereof; - scribing at least one insulated signal conductor onto said substrate base following a predetermined pattern; - providing an outer conductive shield which substantially surrounds said insulated signal conductor; - providing a conductive ground plane electrically connecting said conductive shields; - providing clearance areas free of any conductive shield or conductive ground plane in the area surrounding said terminal points; - exposing the ends of said signal conductor within said clearance areas; and - electrically connecting said signal conductor ends to said terminal points.
Claim 6
Dependent Claim
124 words
A process for manufacturing a coaxial conductor circuit board using signal conductors surrounded with dielectric insulating material, the process comprising - providing an insulating planar substrate with a plurality of longitudinally and transversely spaced terminal points on the surface thereof; - scribing at least one insulated signal conductor onto said substrate base following a predetermined pattern; - providing an outer conductive shield which substantially surrounds said insulated signal conductor; - providing a conductive ground plane electrically connecting said conductive shields; - providing clearance areas free of any conductive shield or conductive ground plane in the area surrounding said terminal points; - exposing the ends of said signal conductor within said clearance areas; and - electrically connecting said signal conductor ends to said terminal points.
Claim 7
Dependent Claim
35 words
The process of claim 4 wherein said substrate and/or said coaxial conductor is/are coated with an adhesive and wherein said signal conductor is affixed by activating said adhesive as said signal conductor is being scribed.
Claim 8
Dependent Claim
37 words
The process of claim 5 wherein said clearance areas are provided,at least in part, by drilling the board at the terminal points and selectively etching conductive material other than said signal conductor away from the hole wall.
Claim 9
Dependent Claim
27 words
The process of claim 5 wherein said clearance areas are provided, at least in part, by selectively removing material other than said signal conductor using laser energy.
Claim 10
Dependent Claim
88 words
The process of claims 4 or 5 further comprising coating the side of said board provided with said coaxial conductors with a conductive material after scribing said coaxial conductors to interconnect the outer conductive shields thereof; using laser energy to remove material at a terminal point to expose the signal conductor at the terminal point; applying insulating material to any conductive material other than the signal conductor which is exposed at said terminal point; and driling a hole at said terminal point to again expose said signal conductor.
Claim 11
Dependent Claim
28 words
The process of claim 8 wherein said coating of conductive material is a plated copper layer and wherein plated copper is removed at said terminal point by etching.
Claim 12
Dependent Claim
44 words
The process of claim 9 wherein shield material of said coaxial conductors above said signal conductor is removed by etching before application of said laser energy and wherein shield material below said signal conductor is removed by etching after application of said laser energy.
Claim 13
Dependent Claim
17 words
The process of claim 8 wherein said hole at said terminal point is drilled by laser drilling.
Claim 14
Dependent Claim
43 words
The process of claim 11 wherein said laser energy used to remove material drills a first hole and a second laser drilling step is employed to again expose said signal conductor and providing a second hole smaller in diameter than said first hole.
Claim 15
Dependent Claim
31 words
The process of claim 12 wherein insulating material is applied to exposed conductive material in said first hole by filling said hole and coating the board with a non-conductive resin material.
Claim 16
Dependent Claim
22 words
The process of claim 8 wherein a metallic laser energy bounce pad is provided beneath said signal conductor at said terminal point.
Claim 17
Dependent Claim
31 words
The process of claim 8 wherein said drilled hole is exposed to a metallizing process to form a signal conductor connection to the surface of the board at the terminal point.
Claim 18
Dependent Claim
38 words
The process of one or more of the preceeding claims 4 to 15 wherein the signal conductor is a noble metal, said conductive shield is a less noble metal,and said etchant is selective toward the less noble metal.
Claim 19
Dependent Claim
30 words
The process of one or more of the preceeding claims 4 to 16 wherein the signal conductor is copper, the conductive shield is aluminum and the etchant is sodium hydroxide.
Claim 20
Dependent Claim
36 words
The process of one or more of the preceeding claims 4 to 16 wherein said etching back is achieved by electrically connecting to the conductive shield to electrolytically etch the conductive shield using an electrolytic etch.
Claim 21
Dependent Claim
22 words
The process of claim 18 wherein the conductive shield is copper and said electrolytic etch is a sulfuric acid copper sulfate solution.
Claim 22
Dependent Claim
54 words
The process of one or more of the preceeding claims 4 to 16 wherein the scribed coaxial conductors are coated with an encapsulating resin, said resin coating is punctured to expose sections of the conductive shield, and wherein the coating of conductive material is thereafter applied to interconnect the conductive shields via said punctures.
Claim 23
Dependent Claim
26 words
The process of one or more of the preceeding claims wherein insulating material is applied to the exposed ends of said etched back conductive material electrophoretically.
Claim 24
Dependent Claim
44 words
The process of one or more of the preceeding claims 4 to 16 wherein said holes are filled with an insulating material after said etching back and thereafter drilled again to provide a hole of a diameter selected to expose only the signal conductor.
References Cited (Backward Citations)
No citation records indexed.
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