EP0552984A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Methods of making thin-film wiring boards, thin-film wiring boards made thereby, and adhesive materials
Assignee: Hitachi Ltd
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Filing: 1993-01-22
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Granted: —
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Expires: 2013-01-22
Abstract
Abstract A wiring board having plural layers is made by bonding together individual wiring sheets (1,11,21), each typically comprising copper wiring on a polyimide film substrate. The sheets are bonded together by applying a liquid varnish (16,26) to the wired surface (3) of one sheet. The varnish contains a polyimide precursor, preferably a polyamic acid ester, or a soluble polyimide, as well as a thermosetting adhesion promoter, preferably maleimide-terminated. The liquid varnish (16,26) is dried to a solid polyimide layer on the wired surface. A further wiring sheet is then pressed onto the polyimide layer and the adhesion promoter is polymerised by heating to bond the layers together.
Inventors
- 👤 Yoshiaki Okabe
- 👤 Ris Tawata
- 👤 Koji Fujisaki
- 👤 Takayoshi Ikeda
- 👤 Takao Miwa
- 👤 Junichi Katagiri
- 👤 Akio Takahashi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 12:31
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4652; H05K3/4655; H10; H10W; H10W70/00; H10W70/01; H10W70/05; H10W70/60; H10W70/67; H10W70/69; H10W70/695; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2201/0183; H05K2201/0195; H05K2203/00; H05K2203/07; H05K2203/0756; H05K2203/0759; H05K3/38; H05K3/386; H05K3/4602; H05K3/4605
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
155 words
A method of manufacturing a thin film wiring board for mounting a semiconductor chip, which comprises the steps of: (a) providing a first wiring sheet (1) comprising a substrate (2) of a polymeric material and wiring lines (4) of a conductive material formed on the substrate (2); (b) applying a liquid varnish layer (16) to cover the wiring lines and fill interstices of the wiring lines and the surfaces of the substrate (2), said varnish comprising a polyimide ingredient selected from the group consisting of a solvent-soluble polyimide and a precursor of a polyimide, a polymerizable compound, and a solvent for dissolving the polyimide ingredient and the polymerizable compound; (c) drying the varnish layer to form a hardenable layer (16) comprising polyimide; (d) pressing the hardenable layer (16) against another surface to be bonded; and (e) polymerizing the polymerizable compound in the hardenable layer to bond the first wiring sheet (1) to the another surface.
Claim 2
Independent Claim
152 words
A method of manufacturing a thin film wiring board for mounting a semiconductor chip, which comprises the steps of: (a) providing a first wiring sheet (1) comprising a substrate (2) of a polymeric material and a wiring (4) of a conductive material formed on the substrate (2); (b) applying a liquid varnish layer (16) covering the wiring (4) and substrate surfaces between the wiring (4), said varnish comprising a member selected from the group consisting of polyimide, a precursor of a polyimide, and a mixture thereof; a polymerizable compound, and an organic solvent dissolving said member and the polymerizable compound; (c) drying the varnish layer to form a hardenable layer (16) containing polyimide, while keeping the polymerizable compound unpolymerized; (d) pressing the hardenable layer against a second wiring sheet formed on a substrate; and (e) polymerizing the polymerizable compound in the hardenable layer to bond the wiring to the second wiring sheet.
Claim 3
Independent Claim
161 words
A method of manufacturing a thin film wiring board for mounting a semiconductor chip, which comprises the steps of: (a) providing a first wiring sheet (1) comprising a substrate of a polymeric material and a wiring of a conductive material formed on the substrate; (b) applying a liquid varnish layer covering the wiring and surfaces between the wiring, said varnish comprising a member selected from the group consisting of polyimide, a precursor of a polyimide, and mixtures thereof; a polymerizable adhesion promotor, and an organic solvent for solving the polyimide and the adhesion promotor; (c) drying the varnish layer to form a hardenable layer comprising a member selected from the group consisting of the polyimide, and a mixture of the polyimide and the precursor thereof, while keeping the promotor unpolymerized; (d) pressing the hardenable layer to a surface of a ceramic wiring board; and (e) polymerizing the promotor in the hardenable layer to bond the wiring to the ceramic wiring board.
Claim 4
Dependent Claim
58 words
A thermosetting adhesive material comprising (i) a member selected from the group consisting of a polyimide and a polyimide precursor convertible to polyimide upon heating above an imidization temperature; (ii) a polymerizable compound to form a cross-linked polymer upon polymerization above a polymerization temperature higher than said imidization temperature, and (iii) an organic solvent for dissolving the polyimide.
Claim 5
Independent Claim
190 words
A method of manufacturing a multi-layered thin film wiring board for mounting a semiconductor chip, which comprises the steps of: (a) providing a first wiring sheet comprising a substrate of a polymeric material and a wiring of a conductive material formed on the substrate; (b) applying a liquid varnish layer covering the wiring and surfaces between the wiring, said varnish comprising a polyimide and/or a precursor of a polyimide, a polymerizable adhesion promotor and an organic solvent for solving the polyimide and the promotor; (c) drying the varnish layer to form a hardenable layer of the polyimide or a mixture of the polyimide and the precursor, while keeping the promotor unpolymerized; (d) pressing the hardenable layer to a surface of a second wiring on a second substrate; (e) polymerizing the promotor in the hardenable layer to bond the first wiring to the rear surface of the second wiring; (f) forming through-holes in the second wiring and its substrate; (g) electrically connecting the first wiring and the second wiring through the through-holes; and (h) repeating the steps (b) to (g) until a desired number of layers of the wiring is obtained.
Claim 6
Dependent Claim
126 words
A multi-layered assembly for mounting semiconductor chips, which comprises a laminate of thin film wiring board comprising a plurality of wiring layers each being adhered to respective substrates of a polymeric material, thermosetting polyimide-containing layers each being filled in interstices between the substrates and wiring layers, and a ceramic wiring board adhered to the laminate; wherein the wiring layers are electrically connected through through-holes formed in the substrates and the surfaces of said wiring layers are covered with a thin layer of the polyimide-containing layer, said polyimide-containing layer being a cured composition of (i) a polyimide or a polyamic acid or polyamic acid ester imidizable upon heating to a imidization temperature, and (ii) a monomer polymerizable upon heating at a temperature higher than said imidization temperature.
Claim 7
Independent Claim
56 words
A method, or a thermosetting adhesive, according to any one of claims 1 to 6 in which the polyimide precursor has repeating units of the formula wherein X and Y are organic moieties having from 1 to 100 carbon atoms and R¹ is H or a carboxyl-group-free organic moiety having from 1 to 30 carbon atoms.
Claim 8
Dependent Claim
18 words
A method or adhesive according to claim 7 in which the polyimide precursor is a polyamic acid ester.
Claim 9
Dependent Claim
17 words
A method or adhesive according to claim 7 in which the polyimide precursor is a polyamic acid.
Claim 10
Independent Claim
33 words
A method, or a thermosetting adhesive, according to any one of the preceding claims in which the polymerisable compound or adhesion promotor has the general formula in which p is 2 or 3.
References Cited (Backward Citations)
No citation records indexed.
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