Patent US731519A successfully refreshed from Google Patents.
Patent US6089442A successfully refreshed from Google Patents.
US6089442A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Electrode connection method
Assignee: Canon Inc
•
Filing: 1997-04-07
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Granted: 2000-07-18
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Expires: 2017-04-07
Abstract
Abstract A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate and partially coated with a resist pattern so as to substantially expose an opening thereof at a surface of the second electrodes includes (a) coating the second electrodes with a solder at the opening of the resist pattern, (b) aligning the first electrodes with the second electrodes, and (c) electrically connecting the first electrodes to the second electrodes through the solder by heat-pressing the first and second electrodes with a heat-pressure bonding head including a tip face having a width smaller than a width of the opening of the resist pattern so as to heat-press the first and second electrodes at an entire region of the tip face of the heat-pressure bonding head. The method is effective in performing a good electrical connection between electrodes through a solder irrespective of an amount of the solder.
Inventors
- 👤 Toshimichi Ouchi
- 👤 Riichi Saito
- 👤 Masanori Takahashi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 22:47
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/363; B; B23; B23K; B23K1/00; B23K1/0004; B23K2101/00; B23K2101/36; B23K2101/40; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0388; H05K2201/0394; H05K2203/00; H05K2203/01; H05K2203/0195; H05K2203/11; H05K2203/1121; H05K3/30; H05K3/32; H05K3/34; H05K3/3452
Claims Analysis
Total Claims: 42
Claim 1
Independent Claim
141 words
A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate and partially coated with a resist pattern so as to substantially expose an opening thereof at a surface of the second electrodes, said method comprising the steps of: (a) coating the second electrodes with a solder at the opening of the resist pattern, (b) aligning the first electrodes with the second electrodes, and (c) electrically connecting the first electrodes to the second electrodes through the solder by heat-pressing the first and second electrodes with a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the first and second electrodes at an entire region of the tip face of the heat-pressure bonding head.
Claim 2
Independent Claim
141 words
A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate and partially coated with a resist pattern so as to substantially expose an opening thereof at a surface of the second electrodes, said method comprising the steps of: (a) coating the second electrodes with a solder at the opening of the resist pattern, (b) aligning the first electrodes with the second electrodes, and (c) electrically connecting the first electrodes to the second electrodes through the solder by heat-pressing the first and second electrodes with a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the first and second electrodes at an entire region of the tip face of the heat-pressure bonding head.
Claim 3
Dependent Claim
15 words
A method according to claim 1, wherein the first substrate comprises a flexible film substrate.
Claim 4
Dependent Claim
82 words
A method according to claim 1, wherein the first substrate is provided with a semiconductor device and the first electrodes comprising input electrodes and output electrodes, and the second substrate comprises a circuit board provided with the second electrodes comprising connection electrodes for supplying control signals and a power to the semiconductor device; in the step (c) of said method, the input electrodes of the semiconductor device of the first substrate are electrically connected to the connection electrodes of the second substrate.
Claim 5
Dependent Claim
15 words
A method according to claim 3, wherein the first substrate comprises a flexible film substrate.
Claim 6
Dependent Claim
101 words
A method according to claim 1, wherein the first substrate is provided with a semiconductor device and the first electrodes comprising input electrodes and output electrodes to constitute a tape carrier package structure, the output electrodes being connected to electrode terminals of an electronic device; and the second substrate comprises a circuit board provided with the second electrodes comprising connection electrodes for supplying control signals and a power to the semiconductor device; in the step (c) of said method, the input electrodes of the semiconductor device of the first substrate are electrically connected to the connection electrodes of the second substrate.
Claim 7
Dependent Claim
31 words
A method according to claim 5, wherein the first substrate comprises a flexible film substrate and the semiconductor device is mounted on the flexible film substrate by a tape-automated bonding method.
Claim 8
Dependent Claim
15 words
A method according to claim 5, wherein the electronic device comprises an optical modulation device.
Claim 9
Dependent Claim
14 words
A method according to claim 5, wherein the electronic device comprises a display device.
Claim 10
Dependent Claim
16 words
A method according to claim 5, wherein the electronic device comprises a liquid crystal display device.
Claim 11
Dependent Claim
14 words
A method according to claim 1, wherein the resist pattern comprises a solder resist.
Claim 12
Dependent Claim
24 words
A method according to claim 1, wherein in the step (c), a cooling gas is supplied toward the second substrate via the first substrate.
Claim 13
Independent Claim
116 words
A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate, said method comprising the steps of: (a) aligning the first electrodes with the second electrodes, and (b) electrically connecting the first electrodes to the second electrodes by heat-pressing the first and second electrodes using a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the first and second electrodes at an entire region of the tin face of the heat-pressure bonding head, while supplying a cooling gas to at least one of the first and second substrates.
Claim 14
Independent Claim
116 words
A method of connecting first electrodes formed on a first substrate to second electrodes formed on a second substrate, said method comprising the steps of: (a) aligning the first electrodes with the second electrodes, and (b) electrically connecting the first electrodes to the second electrodes by heat-pressing the first and second electrodes using a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the first and second electrodes at an entire region of the tin face of the heat-pressure bonding head, while supplying a cooling gas to at least one of the first and second substrates.
Claim 15
Dependent Claim
35 words
A method according to claim 12, wherein the first substrate comprises a flexible film substrate and the cooling gas is supplied to the flexible film substrate so as to cool the second substrate disposed thereunder.
Claim 16
Dependent Claim
90 words
A method according to claim 12, wherein the first substrate is provided with a semiconductor device and the first electrodes comprising input electrodes and output electrodes, and the second substrate comprises a circuit board provided with the second electrodes comprising connection electrodes for supplying control signals and a power to the semiconductor device; in the step (b) of said method, the input electrodes are electrically connected to the connection electrodes while supplying the cooling gas is supplied to the first substrate so as to cool the second substrate disposed thereunder.
Claim 17
Dependent Claim
15 words
A method according to claim 14, wherein the first substrate comprises a flexible film substrate.
Claim 18
Dependent Claim
109 words
A method according to claim 12, wherein the first substrate is provided with a semiconductor device and the first electrodes comprising input electrodes and output electrodes to constitute a tape carrier package structure, the output electrodes being connected to electrode terminals of an electronic device; and the second substrate comprises a circuit board provided with the second electrodes comprising connection electrodes for supplying control signals and a power to the semiconductor device; in the step (b) of said method, the input electrodes are electrically connected to the connection electrodes while supplying the cooling gas is supplied to the first substrate so as to cool the second substrate disposed thereunder.
Claim 19
Dependent Claim
31 words
A method according to claim 16, wherein the first substrate comprises a flexible film substrate and the semiconductor device is mounted on the flexible film substrate by a tape-automated bonding method.
Claim 20
Dependent Claim
38 words
A method according to claim 16, wherein said tape carrier package structure comprises a plurality of tape carrier package structures and the steps (a) and (b) are repeatedly performed with respect to the respective tape carrier package structures.
Claim 21
Dependent Claim
25 words
A method according to claim 18, wherein in each step (b) repeatedly performed, the cooling gas is supplied in synchronism with a heat-pressure bonding operation.
Claim 22
Dependent Claim
24 words
A method according to claim 18, wherein in each step (b) repeatedly performed, the cooling gas is supplied irrespective of a heat-pressure bonding operation.
Claim 23
Dependent Claim
15 words
A method according to claim 16, wherein the electronic device comprises an optical modulation device.
Claim 24
Dependent Claim
14 words
A method according to claim 16, wherein the electronic device comprises a display device.
Claim 25
Dependent Claim
16 words
A method according to claim 16, wherein the electronic device comprises a liquid crystal display device.
Claim 26
Dependent Claim
15 words
A method according to claim 16, wherein the circuit board comprises a glass-epoxy resin board.
Claim 27
Independent Claim
206 words
A method for producing an optical modulation apparatus which includes: an optical modulation panel; a tape carrier package structure comprising a flexible substrate, a semiconductor device for driving the panel mounted on the flexible substrate, and input electrodes and output electrodes for the semiconductor device; and a circuit board provided with connection electrodes partially coated with resist pattern so as to leave an opening thereof and supplying power and supplying control signals to the semiconductor device; said processing comprising the steps of: (a) electrically connecting electrode terminals of the optical modulation panel to the output electrodes of the tape carrier package structure, (b) coating the connection electrodes with a solder at the opening of the resist pattern, (c) aligning the input electrodes of the tape carrier package structure with the connection electrodes of the circuit board, and (d) electrically connecting the input electrodes to the connection electrodes through the solder by heat-pressing the input and connection electrodes with a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the input and connection electrodes at an entire region of the tip face of the heat-pressure bonding head.
Claim 28
Independent Claim
206 words
A method for producing an optical modulation apparatus which includes: an optical modulation panel; a tape carrier package structure comprising a flexible substrate, a semiconductor device for driving the panel mounted on the flexible substrate, and input electrodes and output electrodes for the semiconductor device; and a circuit board provided with connection electrodes partially coated with resist pattern so as to leave an opening thereof and supplying power and supplying control signals to the semiconductor device; said processing comprising the steps of: (a) electrically connecting electrode terminals of the optical modulation panel to the output electrodes of the tape carrier package structure, (b) coating the connection electrodes with a solder at the opening of the resist pattern, (c) aligning the input electrodes of the tape carrier package structure with the connection electrodes of the circuit board, and (d) electrically connecting the input electrodes to the connection electrodes through the solder by heat-pressing the input and connection electrodes with a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the input and connection electrodes at an entire region of the tip face of the heat-pressure bonding head.
Claim 29
Dependent Claim
28 words
A method according to claim 25, wherein the optical modulation panel comprises a display panel including a substrate provided with the electrode terminals at an edge portion thereof.
Claim 30
Dependent Claim
36 words
A method according to claim 25, wherein the optical modulation panel comprises a display panel including a pair of substrates at least one of which is provided with the electrode terminals to an edge portion thereof.
Claim 31
Dependent Claim
24 words
A method according to claim 25, wherein in the step (d), a cooling gas is supplied toward the circuit board via the flexible substrate.
Claim 32
Independent Claim
186 words
A method for producing an optical modulation apparatus which includes: an optical modulation panel; a tape carrier package structure comprising a flexible substrate a semiconductor device for driving the panel mounted on the flexible substrate, and input electrode and output electrodes for the semiconductor device; and a circuit board provided with connection electrodes for supplying power and supplying control signals to the semiconductor device; said process comprising the steps of: (a) electrically connecting electrode terminals of the optical modulation panel to the output electrodes of the tape carrier package structure, (b) aligning the input electrodes of the tape carrier package structure with the connection electrodes of the circuit board, and (c) electrically connecting the input electrodes to the connection electrodes by a heat-pressure bonding using a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the input and connection electrodes at an entire region of the tip face of the heat-pressure bonding head, while supplying a cooling gas toward the circuit board via the flexible substrate.
Claim 33
Independent Claim
186 words
A method for producing an optical modulation apparatus which includes: an optical modulation panel; a tape carrier package structure comprising a flexible substrate a semiconductor device for driving the panel mounted on the flexible substrate, and input electrode and output electrodes for the semiconductor device; and a circuit board provided with connection electrodes for supplying power and supplying control signals to the semiconductor device; said process comprising the steps of: (a) electrically connecting electrode terminals of the optical modulation panel to the output electrodes of the tape carrier package structure, (b) aligning the input electrodes of the tape carrier package structure with the connection electrodes of the circuit board, and (c) electrically connecting the input electrodes to the connection electrodes by a heat-pressure bonding using a heat-pressure bonding head including a substantially flat rectangular tip face having a width smaller than a width of the opening of the resist pattern so as to uniformly heat-press the input and connection electrodes at an entire region of the tip face of the heat-pressure bonding head, while supplying a cooling gas toward the circuit board via the flexible substrate.
Claim 34
Dependent Claim
28 words
A method according to claim 29, wherein the optical modulation panel comprises a display panel including a substrate provided with the electrode terminals at an edge portion thereof.
Claim 35
Dependent Claim
36 words
A method according to claim 29, wherein the optical modulation panel comprises a display panel including a pair of substrates at least one of which is provided with the electrode terminals to an edge portion thereof.
Claim 36
Dependent Claim
77 words
A method according to claim 3, wherein said opening of the resist pattern comprises an inner portion, a connection portion and an outer portion closer to an end portion of the first substrate and in the step (c), the input electrodes are electrically connected to the connection electrodes at the connection portion so as to leave the inner portion and the outer portion, the inner portion having a width larger than a width of the outer portion.
Claim 37
Dependent Claim
31 words
A method according to claim 3, wherein each of the input electrodes has a first region and a second region, said second region corresponding to the opening of the solder resist.
Claim 38
Dependent Claim
77 words
A method according to claim 5, wherein said opening of the resist pattern comprises an inner portion, a connection portion and an outer portion closer to an end portion of the first substrate and in the step (c), the input electrodes are electrically connected to the connection electrodes at the connection portion so as to leave the inner portion and the outer portion, the inner portion having a width larger than a width of the outer portion.
Claim 39
Dependent Claim
31 words
A method according to claim 5, wherein each of the input electrodes has a first region and a second region, said second region corresponding to the opening of the solder resist.
Claim 40
Dependent Claim
77 words
A method according to claim 25, wherein said opening of the resist pattern comprises an inner portion, a connection portion and an outer portion closer to an end portion of the first substrate and in the step (c), the input electrodes are electrically connected to the connection electrodes at the connection portion so as to leave the inner portion and the outer portion, the inner portion having a width larger than a width of the outer portion.
Claim 41
Dependent Claim
31 words
A method according to claim 25, wherein each of the input electrodes has a first region and a second region, said second region corresponding to the opening of the solder resist.
Claim 42
Dependent Claim
17 words
A method according to claim 1, wherein, in the step (c), the first electrodes are electrically connected.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-18 | 2004-01-17 | 2004-07-18 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-18 | 2008-01-17 | 2008-07-18 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-18 | 2012-01-17 | 2012-07-18 | $7700.00 | Window Closed / Lapsed |