US5653017A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of mechanical and electrical substrate connection
Assignee: Micron Technology Inc
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Filing: 1996-05-03
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Granted: 1997-08-05
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Expires: 2016-05-03
Abstract
Abstract The disclosure describes a method of attaching and electrically connecting first and second planar substrates, wherein the first and second substrates have inwardly-facing surfaces with matching patterns of bond pads. The method includes adjusting a wire bonder's tear. length to a setting which leaves a projecting tail of severed bond wire at a terminating wedge bond connection. Further steps include making a wedge bond to an individual bond pad of the first planar substrate with bond wire from the wire bender, and then severing the bond wire adjacent said wedge bond. The adjusted tear length of the wire bender results in a tail of severed bond wire which projects from said wedge bond and said individual bond pad. Subsequent steps include positioning the first and second planar substrates with their inwardly-facing surfaces facing each other, aligning the matching bond pad patterns of the first and second planar substrates, and pressing the first and second planar substrates against each other. The bond wire tail deforms between the bond pads of the first and second planar substrates to conductively bond therebetween.
Inventors
- 👤 David A. Cathey
- 👤 Charles Watkins
- 👤 Derek Gochnour
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 17:04
CPC Classifications
H; H10; H10W; H10W90/00; H01; H01J; H01J9/00; H01J9/24; H01J9/26; H01J9/241; H01J9/261; H01J9/32; H01J9/36; H10W70/00; H10W70/60; H10W70/611; H10W90/401; H01J2329/00; H01J2329/86; H01J2329/8625; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/328; H05K3/36; H05K3/368; H10W72/00; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5524; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 32
Claim 1
Independent Claim
147 words
A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces with at least one pair of opposing first and second electrically conductive bonding areas, the method comprising: providing a wire wedge bond onto at least one of the opposing first and second bonding areas, the wire wedge bond having a tail of severed bond wire projecting from said wedge bond and said at least one bonding area; positioning the first and second substrates with their inwardly-facing surfaces facing each other; aligning the first and second bonding areas of the first and second substrates, the bond wire tail being interposed between the first and second bonding areas; and pressing the first and second substrates against each other, the bond wire tail deforming between the first and second bonding areas of the first and second substrates to conductively bond therebetween.
Claim 2
Independent Claim
147 words
A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces with at least one pair of opposing first and second electrically conductive bonding areas, the method comprising: providing a wire wedge bond onto at least one of the opposing first and second bonding areas, the wire wedge bond having a tail of severed bond wire projecting from said wedge bond and said at least one bonding area; positioning the first and second substrates with their inwardly-facing surfaces facing each other; aligning the first and second bonding areas of the first and second substrates, the bond wire tail being interposed between the first and second bonding areas; and pressing the first and second substrates against each other, the bond wire tail deforming between the first and second bonding areas of the first and second substrates to conductively bond therebetween.
Claim 3
Dependent Claim
18 words
A method as recited in claim 1 wherein at least one of the substrates is a semiconductor die.
Claim 4
Dependent Claim
15 words
A method as recited in claim 1 wherein the first substrate is a semiconductor die.
Claim 5
Dependent Claim
15 words
A method as recited in claim 1 wherein the second substrate is a semiconductor die.
Claim 6
Dependent Claim
24 words
A method as recited in claim 1 and further comprising applying heat during the pressing step to bond between the first and second substrates.
Claim 7
Dependent Claim
24 words
A method as recited in claim 1 and further comprising applying vibration during the pressing step to bond between the first and second substrates.
Claim 8
Dependent Claim
25 words
A method as recited in claim 1 and being void of any separate adhesive interconnect between the bonding areas of the first and second substrates.
Claim 9
Independent Claim
113 words
A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces, the method comprising: providing a wire wedge bond onto at least one of the inwardly-facing surfaces of the first and second substrates, the wire wedge bond having a tail of severed bond wire projecting from said wedge bond and said at least one surface; positioning the first and second substrates with their inwardly-facing surfaces facing each other, the bond wire tail being interposed between the first and second substrates; and pressing the first and second substrates against each other, the bond wire tail deforming between the first and second substrates to conductively bond therebetween.
Claim 10
Independent Claim
113 words
A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces, the method comprising: providing a wire wedge bond onto at least one of the inwardly-facing surfaces of the first and second substrates, the wire wedge bond having a tail of severed bond wire projecting from said wedge bond and said at least one surface; positioning the first and second substrates with their inwardly-facing surfaces facing each other, the bond wire tail being interposed between the first and second substrates; and pressing the first and second substrates against each other, the bond wire tail deforming between the first and second substrates to conductively bond therebetween.
Claim 11
Dependent Claim
18 words
A method as recited in claim 8 wherein at least one of the substrates is a semiconductor die.
Claim 12
Dependent Claim
15 words
A method as recited in claim 8 wherein the first substrate is a semiconductor die.
Claim 13
Dependent Claim
15 words
A method as recited in claim 8 wherein the second substrate is a semiconductor die.
Claim 14
Dependent Claim
24 words
A method as recited in claim 8 and further comprising applying heat during the pressing step to bond between the first and second substrates.
Claim 15
Dependent Claim
24 words
A method as recited in claim 8 and further comprising applying vibration during the pressing step to bond between the first and second substrates.
Claim 16
Dependent Claim
20 words
A method as recited in claim 8 and being void of any separate adhesive interconnect on the bond wire tail.
Claim 17
Independent Claim
126 words
A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces with at least one pair of opposing first and second electrically conductive bonding areas, the method comprising: providing a projecting tail of a conductor from at least one of the opposing first and second bonding areas; positioning the first and second substrates with their inwardly-facing surfaces facing each other; aligning the first and second bonding areas of the first and second substrates, the projecting conductor tail being interposed between the first and second bonding areas; and pressing the first and second substrates against each other, the projecting conductor tail deforming between the first and second bonding areas of the first and second substrates to conductively bond therebetween.
Claim 18
Independent Claim
126 words
A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces with at least one pair of opposing first and second electrically conductive bonding areas, the method comprising: providing a projecting tail of a conductor from at least one of the opposing first and second bonding areas; positioning the first and second substrates with their inwardly-facing surfaces facing each other; aligning the first and second bonding areas of the first and second substrates, the projecting conductor tail being interposed between the first and second bonding areas; and pressing the first and second substrates against each other, the projecting conductor tail deforming between the first and second bonding areas of the first and second substrates to conductively bond therebetween.
Claim 19
Dependent Claim
18 words
A method as recited in claim 15 wherein at least one of the substrates is a semiconductor die.
Claim 20
Dependent Claim
15 words
A method as recited in claim 15 wherein the first substrate is a semiconductor die.
Claim 21
Dependent Claim
15 words
A method as recited in claim 15 wherein the second substrate is a semiconductor die.
Claim 22
Dependent Claim
24 words
A method as recited in claim 15 and further comprising applying heat during the pressing step to bond between the first and second substrates.
Claim 23
Dependent Claim
24 words
A method as recited in claim 15 and further comprising applying vibration during the pressing step to bond between the first and second substrates.
Claim 24
Dependent Claim
25 words
A method as recited in claim 15 and being void of any separate adhesive interconnect between the bonding areas of the first and second substrates.
Claim 25
Independent Claim
93 words
A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces, the method comprising: providing a projecting tail of a conductor from at least one of the inwardly-facing surfaces of the first and second substrates; positioning the first and second substrates with their inwardly-facing surfaces facing each other, the projecting conductor tail being interposed between the first and second substrates; and pressing the first and second substrates against each other, the projecting conductor tail deforming between the first and second substrates to conductively bond therebetween.
Claim 26
Independent Claim
93 words
A method of attaching and electrically connecting first and second substrates, the first and second substrates having inwardly-facing surfaces, the method comprising: providing a projecting tail of a conductor from at least one of the inwardly-facing surfaces of the first and second substrates; positioning the first and second substrates with their inwardly-facing surfaces facing each other, the projecting conductor tail being interposed between the first and second substrates; and pressing the first and second substrates against each other, the projecting conductor tail deforming between the first and second substrates to conductively bond therebetween.
Claim 27
Dependent Claim
18 words
A method as recited in claim 22 wherein at least one of the substrates is a semiconductor die.
Claim 28
Dependent Claim
15 words
A method as recited in claim 22 wherein the first substrate is a semiconductor die.
Claim 29
Dependent Claim
15 words
A method as recited in claim 22 wherein the second substrate is a semiconductor die.
Claim 30
Dependent Claim
24 words
A method as recited in claim 22 and further comprising applying heat during the pressing step to bond between the first and second substrates.
Claim 31
Dependent Claim
24 words
A method as recited in claim 22 and further comprising applying vibration during the pressing step to bond between the first and second substrates.
Claim 32
Dependent Claim
20 words
A method as recited in claim 22 and being void of any separate adhesive interconnect on the bond wire tail.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-08-04 | 2001-02-03 | 2001-08-05 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-08-04 | 2005-02-03 | 2005-08-05 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-08-04 | 2009-02-03 | 2009-08-05 | $7700.00 | Window Closed / Lapsed |