US5263246A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Bump forming method
Assignee: NEC Electronics Corp
•
Filing: 1992-02-14
•
Granted: 1993-11-23
•
Expires: 2012-02-14
Abstract
Abstract In order to minimize the size of an aluminum pad in a method of forming a bump, a metal wire is wedge-bonded on the aluminum pad, a necessary amount of the wire is left on the aluminum pad, and the metal wire is disconnected by a clamp. The width of a collapsed portion of the wire on the aluminum pad can be reduced to 1.5 times or less the wire diameter.
Inventors
- 👤 Tsutomu Aoki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-04 19:05
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0444; H10W; H10W72/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/071; H10W72/075; H10W72/07511; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/20; H10W72/251; H10W72/252; H10W72/29; H10W72/50; H10W72/541; H10W72/5434; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/90; H10W72/951; H10W72/952; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49147; Y10T29/49149
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
76 words
A bump forming method, comprising the steps of: wedge-bonding under pressure a portion of a wire to a metal pad located on a wafer by means of a wedge with an ultrasonic horn, said portion of said wire forming a bump on said metal pad and said bump being collapsed after completion of the wedge bonding, and disconnecting said wire from said portion of said wire by moving a clamping means for clamping said wire upward.
Claim 2
Dependent Claim
76 words
A bump forming method, comprising the steps of: wedge-bonding under pressure a portion of a wire to a metal pad located on a wafer by means of a wedge with an ultrasonic horn, said portion of said wire forming a bump on said metal pad and said bump being collapsed after completion of the wedge bonding, and disconnecting said wire from said portion of said wire by moving a clamping means for clamping said wire upward.
Claim 3
Dependent Claim
13 words
The method according to claim 1, wherein said wafer is a TAB wafer.
Claim 4
Dependent Claim
14 words
The method according to claim 1, wherein said metal pad is an aluminum pad.
Claim 5
Dependent Claim
21 words
The method according to claim 1, further comprising the step of: reducing the inner lead pitch between each said metal pad.
Claim 6
Dependent Claim
21 words
The method according to claim 4, wherein said inner lead pitch is reduced to less than or equal to 100 μm.
Claim 7
Dependent Claim
116 words
A bump manufactured by the process of wedge-bonding under pressure a portion of a wire to a metal pad located on a wafer by means of a wedge with an ultrasonic horn, said portion of said wire forming a bump on said metal pad and said bump being collapsed after completion of the wedge-bonding, and disconnecting said wire from said portion of said wire by moving a clamping means for clamping said wire upward, wherein a length of a collapsed portion of said wire is limited to or less than 2.0 times the wire diameter and a width of the collapsed portion of said wire is limited to or less than 1.5 times the wire diameter.
Claim 8
Dependent Claim
116 words
A bump manufactured by the process of wedge-bonding under pressure a portion of a wire to a metal pad located on a wafer by means of a wedge with an ultrasonic horn, said portion of said wire forming a bump on said metal pad and said bump being collapsed after completion of the wedge-bonding, and disconnecting said wire from said portion of said wire by moving a clamping means for clamping said wire upward, wherein a length of a collapsed portion of said wire is limited to or less than 2.0 times the wire diameter and a width of the collapsed portion of said wire is limited to or less than 1.5 times the wire diameter.
Claim 9
Dependent Claim
89 words
A bump forming method, comprising the steps of: wedge-bonding under pressure a portion of a wire to an elongated metal pad located on a wafer by means of a wedge with an ultrasonic horn, said portion of said wire forming a bump on said elongated metal pad and said bump being collapsed after completion of the wedge-bonding and including a non-collapsed wire portion of said portion of said wire, and disconnecting said wire from said portion of said wire by moving a clamping means for clamping said wire upward.
Claim 10
Dependent Claim
89 words
A bump forming method, comprising the steps of: wedge-bonding under pressure a portion of a wire to an elongated metal pad located on a wafer by means of a wedge with an ultrasonic horn, said portion of said wire forming a bump on said elongated metal pad and said bump being collapsed after completion of the wedge-bonding and including a non-collapsed wire portion of said portion of said wire, and disconnecting said wire from said portion of said wire by moving a clamping means for clamping said wire upward.
References Cited (Backward Citations)
US3460238A
Cited
US3689983A
Cited
US3747198A
Cited
US3718272A
Cited
US3954217A
Cited
US4597520A
Cited
JPS62115748A
Cited
US4765526A
Cited
US4771930A
Cited
US4776509A
Cited
US5118370A
Cited
US4955523A
Cited
JPS63173345A
Cited
JPS6473626A
Cited
JPH01286450A
Cited
JPH0212919A
Cited
US5116228A
Cited
US5018658A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1996-11-22 | 1997-05-24 | 1997-11-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2000-11-22 | 2001-05-24 | 2001-11-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2004-11-22 | 2005-05-24 | 2005-11-23 | $7700.00 | Window Closed / Lapsed |