← Back to Patent Explorer
US4765526A Expired / Lapsed US ⏱️ 0.0 years remaining

Wire bonding apparatus

Assignee: Toshiba Corp
•
Filing: 1987-01-27
•
Granted: 1988-08-23
•
Expires: 2007-01-27
📄 Original PDF 🌐 Google Patents 🔄 Sync Now

Abstract

Abstract An apparatus is provided with a capillary having a plurality of through holes. A plurality of bonding wires are delivered through the plurality of through holes at the same time from a wire supply unit. The apparatus connects a plurality of bonding wires to an element subject to bonding at the same time.

Inventors

  • 👤 Kazuhide Sato

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-05 03:07
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; B23K20/005; H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/073; H10W72/075; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/50; H10W72/531; H10W72/5363; H10W72/851; H10W72/874; H10W72/884

Claims Analysis

Total Claims: 5
Claim 1
Independent Claim 67 words
A wire bonding apparatus comprising a capillary having a plurality of through holes for passing bonding wires therethrough, a wire supply unit for simultaneously supplying a plurality of bonding wires, a drive unit adapted to move said capillary to a predetermined bonding position, and a connecting unit for connecting said plurality of bonding wires to a plurality of elements subject to bonding at said predetermined bonding position.
Claim 2
Dependent Claim 67 words
A wire bonding apparatus comprising a capillary having a plurality of through holes for passing bonding wires therethrough, a wire supply unit for simultaneously supplying a plurality of bonding wires, a drive unit adapted to move said capillary to a predetermined bonding position, and a connecting unit for connecting said plurality of bonding wires to a plurality of elements subject to bonding at said predetermined bonding position.
Claim 3
Dependent Claim 26 words
A wire bonding apparatus as claimed in claim 1, wherein said through holes have a pitch equal to a pitch of said element subject to bonding.
Claim 4
Dependent Claim 43 words
A wire bonding apparatus as claimed in claim 1, wherein said connecting device connects said wires to said elements subject to bonding by means of wedge bonding and said capillary comprises a wedge part for pressing and cutting said plurality of wires simultaneously.
Claim 5
Dependent Claim 43 words
A wire bonding apparatus as claimed in claim 2, wherein said connecting device connects said wires to said elements subject to bonding by means of wedge bonding and said capillary comprises a wedge part for pressing and cutting said plurality of wires simultaneously.

References Cited (Backward Citations)

US3627190A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 1991-08-23 1992-02-22 1992-08-23 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 1995-08-23 1996-02-22 1996-08-23 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 1999-08-23 2000-02-22 2000-08-23 $7700.00 Window Closed / Lapsed

Assigned Categories & Tags

No categories assigned to this patent yet.

Assign Category Tag