Patent US6087722A successfully refreshed from Google Patents.
US6087722A
Expired / Lapsed
US
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Multi-chip package
Assignee: Samsung Electronics Co Ltd
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Filing: 1999-04-14
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Granted: 2000-07-11
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Expires: 2019-04-14
Abstract
Abstract A multi-chip stack package does not include a die pad. The elimination of the die pad provides more room for elements in the package which. Thus, a balanced inner package structure can be achieved, and a poor molding which may expose one of the package elements can be avoided. In the package, an upper chip is bonded to the top surface of a lower chip. To stabilize the chips, auxiliary or inner leads of a lead frame attach to the top surface of a lower chip. This shortens wire lengths between the chips and the inner leads. The shorter wires reduce wire loop heights and thus reduce the probability of exposing wires in a subsequent transfer-molding. A multi-chip stack package which includes an auxiliary lead(s) is also disclosed. The auxiliary leads attach to the top surface of the lower chip and can provide a stable support of a semiconductor chip and prevent the chip from tilting and shifting in transfer-molding. An auxiliary lead can be between the lower and upper chips. The auxiliary leads can also be positioned to prevent undesirable spreading of an adhesive when an upper chip is attached to a lower chip.
Inventors
- 👤 Kwan Jai Lee
- 👤 Young Jae Song
- 👤 Do Soo Jeong
- 👤 Tae Je Cho
- 👤 Suk Hong Chang
- 👤 Chang Cheol Lee
- 👤 Beung Seuck Song
- 👤 Jong Hee Choi
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 13:30
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/811; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W72/00; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W90/701; H10W90/731; H10W90/732; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 15
Claim 1
Independent Claim
116 words
A semiconductor package comprising: a first chip having bonding pads on an active surface thereof; a second chip on which said first chip is attached, said second chip having bonding pads on an active surface thereof; a plurality of inner leads which are attached to said active surface of said second chip; a plurality of metal wires which electrically connect said bonding pads of said first and second chips to said inner leads; and a package body which encapsulates said first chip, second chip, inner leads and metal wires, wherein said first chip is directly attached on said active surface of said second chip, and said first chip and said second chip face the same direction.
Claim 2
Dependent Claim
116 words
A semiconductor package comprising: a first chip having bonding pads on an active surface thereof; a second chip on which said first chip is attached, said second chip having bonding pads on an active surface thereof; a plurality of inner leads which are attached to said active surface of said second chip; a plurality of metal wires which electrically connect said bonding pads of said first and second chips to said inner leads; and a package body which encapsulates said first chip, second chip, inner leads and metal wires, wherein said first chip is directly attached on said active surface of said second chip, and said first chip and said second chip face the same direction.
Claim 3
Dependent Claim
41 words
The semiconductor package according to claim 1, further comprising an auxiliary lead which is attached on said active surface of said second chip but not electrically connected to said bonding pads of either of said first chip and said second chip.
Claim 4
Dependent Claim
20 words
The semiconductor package according to claim 2, wherein said auxiliary lead has a square-ring shape attached to said second chip.
Claim 5
Dependent Claim
15 words
The semiconductor package according to claim 2, wherein said auxiliary lead has a bar shape.
Claim 6
Dependent Claim
16 words
The semiconductor package according to claim 1, wherein parts of said inner leads are downwardly stepped.
Claim 7
Dependent Claim
142 words
A semiconductor package comprising: a first chip having bonding pads on an active surface thereof; a second chip on which said first chip is attached, said second chip having bonding pads on an active surface thereof, a plurality of inner leads; a first auxiliary lead between said second chip and said first chip, said first auxiliary lead being attached both to said active surface of said second chip and to a back surface of said first chip; a plurality of metal wires which electrically connect said bonding pads of said first and second chips to said corresponding inner leads; and a package body which encapsulates said first chip, second chip, inner leads and metal wires, wherein said first chip is directly attached on said active surface of said second chip, and said first chip and said second chip face the same direction.
Claim 8
Dependent Claim
142 words
A semiconductor package comprising: a first chip having bonding pads on an active surface thereof; a second chip on which said first chip is attached, said second chip having bonding pads on an active surface thereof, a plurality of inner leads; a first auxiliary lead between said second chip and said first chip, said first auxiliary lead being attached both to said active surface of said second chip and to a back surface of said first chip; a plurality of metal wires which electrically connect said bonding pads of said first and second chips to said corresponding inner leads; and a package body which encapsulates said first chip, second chip, inner leads and metal wires, wherein said first chip is directly attached on said active surface of said second chip, and said first chip and said second chip face the same direction.
Claim 9
Dependent Claim
142 words
A semiconductor package comprising: a first chip having bonding pads on an active surface thereof; a second chip on which said first chip is attached, said second chip having bonding pads on an active surface thereof; a plurality of inner leads; a first auxiliary lead between said second chip and said first chip, said first auxiliary lead being attached both to said active surface of said second chip and to a back surface of said first chip; a second auxiliary lead which is attached to said active face of said second chip; a plurality of metal wires which electrically connect said bonding pads of said first and second chips to said corresponding inner leads; and a package body which encapsulates said first chip, second chip, inner leads and metal wires, wherein said first chip and said second chip face the same direction.
Claim 10
Dependent Claim
142 words
A semiconductor package comprising: a first chip having bonding pads on an active surface thereof; a second chip on which said first chip is attached, said second chip having bonding pads on an active surface thereof; a plurality of inner leads; a first auxiliary lead between said second chip and said first chip, said first auxiliary lead being attached both to said active surface of said second chip and to a back surface of said first chip; a second auxiliary lead which is attached to said active face of said second chip; a plurality of metal wires which electrically connect said bonding pads of said first and second chips to said corresponding inner leads; and a package body which encapsulates said first chip, second chip, inner leads and metal wires, wherein said first chip and said second chip face the same direction.
Claim 11
Dependent Claim
19 words
The semiconductor package according to claim 7, wherein said first auxiliary lead and said second auxiliary lead are bar-shaped.
Claim 12
Dependent Claim
72 words
A semiconductor package comprising: a first chip having bonding pads; a second chip having a first surface to which said first chip is attached, said second chip having bonding pads; and an auxiliary lead which is attached to said first surface of said second chip, wherein said first chip is directly attached on said active surface of said second chip, and said first chip and said second chip face the same direction.
Claim 13
Dependent Claim
72 words
A semiconductor package comprising: a first chip having bonding pads; a second chip having a first surface to which said first chip is attached, said second chip having bonding pads; and an auxiliary lead which is attached to said first surface of said second chip, wherein said first chip is directly attached on said active surface of said second chip, and said first chip and said second chip face the same direction.
Claim 14
Dependent Claim
50 words
The semiconductor package of claim 9, further comprising: a plurality of inner leads; a plurality of metal wires which electrically connect said bonding pads of said first and second chips to said inner leads; and a package body which encapsulates said first chip, second chip, inner leads and metal wires.
Claim 15
Dependent Claim
23 words
The semiconductor package of claim 10, wherein the bonding pads of said second chip are on said first surface of said second chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-07-11 | 2004-01-10 | 2004-07-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-07-11 | 2008-01-10 | 2008-07-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-07-11 | 2012-01-10 | 2012-07-11 | $7700.00 | Window Closed / Lapsed |