Semiconductor device comprising stacked semiconductor elements

Claim 2

A semiconductor device comprising: a mounting board having a wiring pattern on a major surface thereof; and a plurality of structural units, each structural unit comprising: a flexible substrate having lead wires formed thereon; and a semiconductor element having electrodes formed thereon and being mounted on said flexible substrate so as to electrically connect said electrodes with said lead wires, wherein said plurality of structural units are stacked into a plurality of layers and mounted on said mounting board by said flexible substrate bent in such a way that said lead wires of said flexible substrate are brought to said wiring pattern of said mounting board so as to establish electrical connection therebetween.

Claim 3

The semiconductor device according to claim 1, wherein said mounting board is a package board having a wiring pattern on the major surface thereof and outer terminals on the rear surface thereof connected to said wiring pattern; and wherein said plurality of said stacked structural units of a semiconductor element are sealed on said package board.

Claim 4

The semiconductor device according to claim 1, wherein said electrodes of said semiconductor element are aligned along one side of said semiconductor element.

Claim 5

The semiconductor device according to claim 1, wherein said plurality of the structural units of a semiconductor element are formed into identical shapes.

Claim 6

A semiconductor device comprising: a mounting board having a plurality of wiring patterns on a major surface thereof; and a plurality of structural units, each structural unit comprising: a common flexible substrate having a plural set of lead wires formed thereon; and a semiconductor element having electrodes formed thereon and being mounted on said common flexible substrate so as to electrically connect said electrodes with one set of said lead wires, wherein said plurality of structural units are staked into a plurality of layers and mounted on said mounting board by said flexible substrate bent in such a way that each set of the lead wires of said flexible substrate are brought to said wiring patterns of said mounting board so as to establish electrical connection therebetween.

Claim 7

A semiconductor device comprising: a mounting board having a plurality of wiring patterns on a major surface thereof; and a plurality of structural units, each structural unit comprising: a common flexible substrate having a plural set of lead wires formed thereon; and a semiconductor element having electrodes formed thereon and being mounted on said common flexible substrate so as to electrically connect said electrodes with one set of said lead wires, wherein said plurality of structural units are staked into a plurality of layers and mounted on said mounting board by said flexible substrate bent in such a way that each set of the lead wires of said flexible substrate are brought to said wiring patterns of said mounting board so as to establish electrical connection therebetween.

Claim 8

A semiconductor device according to claim 5, wherein said mounting board is a package board having a wiring pattern on the major surface thereof and outer terminals on the rear surface thereof connected to said wiring pattern; and wherein said plurality of said stacked structural units of a semiconductor element are sealed on said package board.

Claim 9

The semiconductor device according to claim 5, wherein said electrodes of said semiconductor elements are aligned along one side of said semiconductor element.

Claim 10

The semiconductor device according to claim 5, wherein adjacent structural unit of a semiconductor elements are provided on said flexible substrate in a symmetrical pattern.