US5295045A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Plastic-molded-type semiconductor device and producing method therefor
Assignee: Hitachi Ltd
•
Filing: 1991-11-14
•
Granted: 1994-03-15
•
Expires: 2011-11-14
Abstract
Abstract A plastic-molded-type semiconductor device having a high degree of integration encases a plurality of semiconductor chips in a package unit with each chip situated perpendicular to the substrate for mounting. On a surface of each chip containing circuits or on a reverse surface of the same, a lead frame is attached with an insulating material interposed therebetween. The chip and lead frame are connected with each other by using wire. The lead frame is arranged perpendicularly to another lead frame provided in parallel and connected therewith by welding. A printed circuit board may be used in place of said latter lead frame. By arranging the chips in projections made of resin, the thermal resistance of the semiconductor device is decreased. The present invention is particularly effective for a memory IC.
Inventors
- 👤 Makoto Kitano
- 👤 Asao Nishimura
- 👤 Akihiro Yaguchi
- 👤 Nae Yoneda
- 👤 Maya Obata
- 👤 Ryuji Kohno
- 👤 Mitsuaki Haneda
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:22
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/811; H10W74/00; H10W74/40; H10W74/47; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W72/00; H10W72/50; H10W74/10; H10W74/131; H10W72/851; H10W72/853; H10W72/865; H10W72/874; H10W72/884; H10W72/90; H10W72/931; H10W72/932; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 54
Claim 1
Independent Claim
128 words
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein said plurality of semiconductor chips are arranged in directions intersecting a substrate for mounting the semiconductor device thereon; a first lead frame group is connected with circuit formed surfaces of said plurality of semiconductor chips by using electrically insulating material interposed therebetween; said first lead frame group is electrically connected with said semiconductor chips; and said first lead frame group is connected with a second lead frame group continuing from said outside lead group.
Claim 2
Dependent Claim
128 words
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein said plurality of semiconductor chips are arranged in directions intersecting a substrate for mounting the semiconductor device thereon; a first lead frame group is connected with circuit formed surfaces of said plurality of semiconductor chips by using electrically insulating material interposed therebetween; said first lead frame group is electrically connected with said semiconductor chips; and said first lead frame group is connected with a second lead frame group continuing from said outside lead group.
Claim 3
Dependent Claim
131 words
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein said plurality of semiconductor chips are arranged in directions intersecting a substrate for mounting the semiconductor device thereon; a first lead frame group is connected with reverse surfaces of circuit formed surfaces of said plurality of semiconductor chips by using electrically insulating material interposed therebetween; said first lead frame group is electrically connected with said semiconductor chips; and said first lead frame group is connected with a second lead frame group continuing from said outside lead group.
Claim 4
Dependent Claim
131 words
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein said plurality of semiconductor chips are arranged in directions intersecting a substrate for mounting the semiconductor device thereon; a first lead frame group is connected with reverse surfaces of circuit formed surfaces of said plurality of semiconductor chips by using electrically insulating material interposed therebetween; said first lead frame group is electrically connected with said semiconductor chips; and said first lead frame group is connected with a second lead frame group continuing from said outside lead group.
Claim 5
Dependent Claim
131 words
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein said plurality of semiconductor chips are arranged in directions intersecting a substrate for mounting the semiconductor device thereon; a first lead frame group is connected with the circuit formed surfaces of said plurality of semiconductor chips by using electrically insulating material interposed therebetween; an inside wiring board is arranged inside of said package unit; and said first lead frame group and a second lead frame group continuing from said outside leads are electrically connected with said substrate.
Claim 6
Dependent Claim
131 words
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein said plurality of semiconductor chips are arranged in directions intersecting a substrate for mounting the semiconductor device thereon; a first lead frame group is connected with the circuit formed surfaces of said plurality of semiconductor chips by using electrically insulating material interposed therebetween; an inside wiring board is arranged inside of said package unit; and said first lead frame group and a second lead frame group continuing from said outside leads are electrically connected with said substrate.
Claim 7
Dependent Claim
131 words
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having-outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein said plurality of semiconductor chips are arranged in directions intersecting a substrate for mounting the semiconductor device thereon; a first lead frame group is connected with reverse surfaces of circuit formed surfaces of said plurality of semiconductor chips by using electrically insulating material interposed therebetween; an inside wiring board is arranged in said package unit; and said first lead frame group and a second lead frame group continuing from said outside leads are elctrically connected with said substrate.
Claim 8
Dependent Claim
131 words
A plastic-molded-type semiconductor device including a plurality of semiconductor chips, lead frames having-outside lead groups and inside lead groups, and connecting members for electrically connecting said semiconductor chips with said lead frames, a part of said lead frames, said semiconductor chips and said electrical connecting members being plastic-molded in a package unit, wherein said plurality of semiconductor chips are arranged in directions intersecting a substrate for mounting the semiconductor device thereon; a first lead frame group is connected with reverse surfaces of circuit formed surfaces of said plurality of semiconductor chips by using electrically insulating material interposed therebetween; an inside wiring board is arranged in said package unit; and said first lead frame group and a second lead frame group continuing from said outside leads are elctrically connected with said substrate.
Claim 9
Dependent Claim
37 words
The plastic-molded-type semiconductor device according to claim 3 or 4, wherein said inside wiring board is arranged substantially in parallel to the substrate for mounting the semiconductor device thereon, and has electrically insulating materials and wiring patterns.
Claim 10
Dependent Claim
43 words
The plastic-molded-type semiconductor device according to claim 5, wherein one additional semiconductor chip is arranged substantially in parallel to the substrate for mounting the semiconductor device thereon, and is electrically connected with said second lead frame group continuing from said outside lead group.
Claim 11
Dependent Claim
30 words
The plastic-molded type semiconductor device according to claim 5, wherein said second lead frame group has a lead frame group united with outside leads and lead frame group connected therewith.
Claim 12
Dependent Claim
27 words
The plastic-molded-type semiconductor device according to claim 5, wherein said plurality of semiconductor chips are arranged substantially perpendicular to said substrate for mounting the semiconductor device thereon.
Claim 13
Dependent Claim
27 words
The plastic-molded-type semiconductor device according to 5, wherein said plurality of semiconductor chips are arranged substantially perpendicular to a principal plane of said second lead frame group.
Claim 14
Dependent Claim
27 words
The plastic-molded-type semiconductor device according to 5, wherein said plurality of semiconductor chips are arranged substantially perpendicular to a principal plane of said second lead frame group.
Claim 15
Dependent Claim
19 words
The plastic-molded-type semiconductor device according to claim 5, wherein all of said plurality of semiconductor chips are memory chips.
Claim 16
Dependent Claim
24 words
The plastic-molded-type semiconductor device according to claim 5, wherein said plurality of semiconductor chips are memory chips and chips for controlling the memory chips.
Claim 17
Dependent Claim
24 words
The plastic-molded-type semiconductor device according to claim 5, wherein said first lead frame group is electrically connected with said semiconductor chips by using wires.
Claim 18
Dependent Claim
51 words
The plastic-molded-type semiconductor device according to claim 5, wherein projections made of molding resin are provided on a package surface opposite to other package surface facing to the substrate for mounting the semiconductor device thereon, and at least a part of said plurality of semiconductor chips is accommodated in said projections.
Claim 19
Dependent Claim
47 words
The plastic-molded-type semiconductor device according to one of claims 1 to 4, wherein one additional semiconductor chip is arranged substantially in parallel to the substrate for mounting the semiconductor device thereon, and is electrically connected with said second lead frame group continuing from said outside lead group.
Claim 20
Dependent Claim
27 words
The plastic-molded-type semiconductor device according to claim 14, wherein said plurality of semiconductor chips are arranged substantially perpendicular to said substrate for mounting the semiconductor device thereon.
Claim 21
Dependent Claim
28 words
The plastic-molded-type semiconductor device according to claim 14, wherein said plurality of semiconductor chips are arranged substantially perpendicular to a principal plane of said second lead frame group.
Claim 22
Dependent Claim
19 words
The plastic-molded-type semiconductor device according to claim 14, wherein all of said plurality of semiconductor chips are memory chips.
Claim 23
Dependent Claim
24 words
The plastic-molded-type semiconductor device according to claim 14, wherein said plurality of semiconductor chips are memory chips and chips for controlling the memory chips.
Claim 24
Dependent Claim
24 words
The plastic-molded-type semiconductor device according to claim 14, wherein said first lead frame group is electrically connected with said semiconductor chips by using wires.
Claim 25
Dependent Claim
51 words
The plastic-molded-type semiconductor device according to claim 14 wherein projections made of molding resin are provided on a package surface opposite to other package surface facing to the substrate for mounting the semiconductor device thereon, and at least a part of said plurality of semiconductor chips is accommodated in said projections.
Claim 26
Dependent Claim
33 words
The plastic-molded-type semiconductor device according to one of claims 1 to 4, wherein said second lead frame group has a lead frame group united with outside leads and lead frame group connected therewith.
Claim 27
Dependent Claim
27 words
The plastic-molded-type semiconductor device according to claim 21, wherein said plurality of semiconductor chips are arranged substantially perpendicular to said substrate for mounting the semiconductor device thereon.
Claim 28
Dependent Claim
28 words
The plastic-molded-type semiconductor device according to claim 21, wherein said plurality of semiconductor chips are arranged substantially perpendicular to a principal plane of said second lead frame group.
Claim 29
Dependent Claim
19 words
The plastic-molded-type semiconductor device according to claim 21, wherein all of said plurality of semiconductor chips are memory chips.
Claim 30
Dependent Claim
24 words
The plastic-molded-type semiconductor device according to claim 21, wherein said plurality of semiconductor chips are memory chips and chips for controlling the memory chips.
Claim 31
Dependent Claim
24 words
The plastic-molded-type semiconductor device according to claim 21, wherein said first lead frame group is electrically connected with said semiconductor chips by using wires.
Claim 32
Dependent Claim
51 words
The plastic-molded-type semiconductor device according to claim 21, wherein projections made of molding resin are provided on a package surface opposite to other package surface facing to the substrate for mounting the semiconductor device thereon, and at least a part of said plurality of semiconductor chips is accommodated in said projections.
Claim 33
Dependent Claim
31 words
The plastic-molded-type semiconductor device according to one of claims 1 to 4, wherein said plurality of semiconductor chips are arranged substantially perpendicular to said substrate for mounting the semiconductor device thereon.
Claim 34
Dependent Claim
19 words
The plastic-molded-type semiconductor device according to claim 28, wherein all of said plurality of semiconductor chips are memory chips.
Claim 35
Dependent Claim
24 words
The plastic-molded-type semiconductor device according to claim 28, wherein said plurality of semiconductor chips are memory chips and chips for controlling the memory chips.
Claim 36
Dependent Claim
24 words
The plastic-molded-type semiconductor device according to claim 28, wherein said first lead frame group is electrically connected with said semiconductor chips by using wires.
Claim 37
Dependent Claim
51 words
The plastic-molded-type semiconductor device according to claim 28, wherein projections made of molding resin are provided on a package surface opposite to other package surface facing to the substrate for mounting the semiconductor device thereon, and at least a part of said plurality of semiconductor chips is accommodated in said projections.
Claim 38
Dependent Claim
32 words
The plastic-molded-type semiconductor device according to one of claims 1 to 4, wherein said plurality of semiconductor chips are arranged substantially perpendicular to a principal plane of said second lead frame group.
Claim 39
Dependent Claim
19 words
The plastic-molded-type semiconductor device according to claim 33, wherein all of said plurality of semiconductor chips are memory chips.
Claim 40
Dependent Claim
24 words
The plastic-molded-type semiconductor device according to claim 33, wherein said plurality of semiconductor chips are memory chips and chips for controlling the memory chips.
Claim 41
Dependent Claim
24 words
The plastic-molded-type semiconductor device according to claim 33, wherein said first lead frame group is electrically connected with said semiconductor chips by using wires.
Claim 42
Dependent Claim
51 words
The plastic-molded-type semiconductor device according to claim 33, wherein projections made of molding resin are provided on a package surface opposite to other package surface facing to the substrate for mounting the semiconductor device thereon, and at least a part of said plurality of semiconductor chips is accommodated in said projections.
Claim 43
Dependent Claim
23 words
The plastic-molded-type semiconductor device according to one of claims 1 to 4, wherein all of said plurality of semiconductor chips are memory chips.
Claim 44
Dependent Claim
51 words
The plastic-molded-type semiconductor device according to claim 38, wherein projections made of molding resin are provided on a package surface opposite to other package surface facing to the substrate for mounting the semiconductor device thereon, and at least a part of said plurality of semiconductor chips is accommodated in said projections.
Claim 45
Dependent Claim
28 words
The plastic-molded-type semiconductor device according to one of claims 1 to 4, wherein said plurality of semiconductor chips are memory chips and chips for controlling the memory chips.
Claim 46
Dependent Claim
51 words
The plastic-molded-type semiconductor device according to claim 40, wherein projections made of molding resin are provided on a package surface opposite to other package surface facing to the substrate for mounting the semiconductor device thereon, and at least a part of said plurality of semiconductor chips is accommodated in said projections.
Claim 47
Dependent Claim
28 words
The plastic-molded-type semiconductor device according to one of claims 1 to 4, wherein said first lead frame group is electrically connected with said semiconductor chips by using wires.
Claim 48
Dependent Claim
51 words
The plastic-molded-type semiconductor device according to claim 42, wherein projections made of molding resin are provided on a package surface opposite to other package surface facing to the substrate for mounting the semiconductor device thereon, and at least a part of said plurality of semiconductor chips is accommodated in said projections.
Claim 49
Dependent Claim
55 words
The plastic-molded-type semiconductor device according to one of claims 1 to 4, wherein projections made of molding resin are provided on a package surface opposite to other package surface facing to the substrate for mounting the semiconductor device thereon, and at least a part of said plurality of semiconductor chips is accommodated in said projections.
Claim 50
Dependent Claim
27 words
The plastic-molded-type semiconductor device according to claim 44, wherein said projections are plural, and a part of said semiconductor chip is accommodated in each of said projections.
Claim 51
Independent Claim
83 words
A method of producing a plastic-molded-type semiconductor device, comprising the steps of sticking an end of a first lead frame to a semiconductor chip with an insulating film interposed therebetween, wire-bonding a first lead with said semiconductor chip, electrically connecting said first lead with a second lead continuing from an outside lead and fixing them, arranging the semiconductor chips substantially perpendicular to a substrate at the time of connecting the first lead, and plastic-molding said constituent members together after arranging the semiconductor chip.
Claim 52
Independent Claim
83 words
A method of producing a plastic-molded-type semiconductor device, comprising the steps of sticking an end of a first lead frame to a semiconductor chip with an insulating film interposed therebetween, wire-bonding a first lead with said semiconductor chip, electrically connecting said first lead with a second lead continuing from an outside lead and fixing them, arranging the semiconductor chips substantially perpendicular to a substrate at the time of connecting the first lead, and plastic-molding said constituent members together after arranging the semiconductor chip.
Claim 53
Dependent Claim
21 words
The method of producing a plastic-molded-type semiconductor device according to claim 46, wherein said second lead is an inside wiring board.
Claim 54
Dependent Claim
21 words
The method of producing a plastic-molded-type semiconductor device according to claim 46, wherein said second lead is an additional semiconductor chip.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
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| 3.5 Years (Year 4) | 1997-03-14 | 1997-09-13 | 1998-03-15 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2001-03-14 | 2001-09-13 | 2002-03-15 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2005-03-14 | 2005-09-13 | 2006-03-15 | $7700.00 | Window Closed / Lapsed |