Manufacture of semiconductor device

Abstract

Abstract PURPOSE:To double the extent of integration of an element, by attaching a semiconductor pellet to each side of a frame bed and performing two resin sealing processes for enclosing the element within an enclosure formed of two resin layers. CONSTITUTION:A semiconductor pellet 1 is bonded to the surface of a frame bed 2. Then the surface of the semiconductor pellet 1 is electrically connected to leads 4 by means of bonding wires 3. The semiconductor pellet 1, bonding wires 3 and so on are sealed with resin and a resin layer 5 is formed. Another semiconductor pellet 11 is bonded to the rear face of the frame bed 2 and the surface of the semiconductor pellet 11 is electrically connected to the leads 4 by means of bonding wires 12. The semiconductor pellet 11, the bonding wires 12 and so on are sealed with resin and a resin layer 13 is formed. Thus an enclosure 14 is formed of the resin layer 5 and the resin layer 13.

Inventors

• 👤 Atsushi Yoshimura
• 👤 淳 芳村

Bibliographic Details