Patent US5059137A successfully refreshed from Google Patents.
US4523219A
Expired / Lapsed
US
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Semiconductor component with pressure contact
Assignee: Siemens AG
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Filing: 1983-08-25
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Granted: 1985-06-11
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Expires: 2003-08-25
Abstract
Abstract Semiconductor component, including a case having a metal bottom, at least one semiconductor body disposed in the case and having first and second principal surfaces, the first principal surface being in at least thermal contact with the metal bottom, at least one lead electrode in contact with the second principal surface, a spring anchored in the metal bottom and pressing the metal bottom, semiconductor body and lead electrode together into contact with each other, casting compound at least partially filling the case and contacting given surfaces of the spring seating the spring in the casting compound, and a permanently elastic synthetic resin mass at least partially coating the given surfaces of the spring being in contact with the casting compound.
Inventors
- 👤 Peter Heidegger
- 👤 Jakob Kiefer
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 22:58
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/10; H10W74/111; H10W72/00; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W78/00; H10W90/00
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
120 words
Semiconductor component, comprising a case having a metal bottom, at least one semiconductor body disposed in said case and having first and second principal surfaces, said first principal surface being in at least thermal contact with said metal bottom, at least one lead electrode in contact with said second principal surface, a spring anchored in said metal bottom and pressing said metal bottom, semiconductor body and lead electrode together into contact with each other, casting compound at least partially filling said case and contacting given surfaces of said spring seating said spring in said casting compound, and a permanently elastic synthetic resin mass at least partially coating said given surfaces of said spring being in contact with said casting compound.
Claim 2
Dependent Claim
120 words
Semiconductor component, comprising a case having a metal bottom, at least one semiconductor body disposed in said case and having first and second principal surfaces, said first principal surface being in at least thermal contact with said metal bottom, at least one lead electrode in contact with said second principal surface, a spring anchored in said metal bottom and pressing said metal bottom, semiconductor body and lead electrode together into contact with each other, casting compound at least partially filling said case and contacting given surfaces of said spring seating said spring in said casting compound, and a permanently elastic synthetic resin mass at least partially coating said given surfaces of said spring being in contact with said casting compound.
Claim 3
Dependent Claim
33 words
Semiconductor component according to claim 1, wherein said spring is a leaf spring and includes a surface being free of said permanently elastic synthetic resin mass for placement of a tightening tool thereon.
Claim 4
Dependent Claim
16 words
Semiconductor component according to claim 2, wherein said synthetic resin mass is formed of silicone rubber.
Claim 5
Dependent Claim
16 words
Semiconductor component according to claim 1, wherein said synthetic resin mass is formed of silicone rubber.
References Cited (Backward Citations)
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1988-06-10 | 1988-12-10 | 1989-06-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1992-06-10 | 1992-12-10 | 1993-06-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 1996-06-10 | 1996-12-10 | 1997-06-11 | $7700.00 | Window Closed / Lapsed |