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US6078093A Expired / Lapsed US ⏱️ 0.0 years remaining

Capacitor structure of semiconductor device for high dielectric constant

Assignee: SK Hynix Inc
•
Filing: 1997-10-30
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Granted: 2000-06-20
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Expires: 2017-10-30
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Abstract

Abstract A semiconductor device capacitor structure comprises a semiconductor substrate having an impurity diffusion region; an insulating layer formed on the semiconductor substrate and having a contact hole on the impurity diffusion region; a first lower electrode of a half ring type formed on the insulating film along an upper edge of the contact hole; a second lower electrode formed on a surface of the substrate exposed through the contact hole, a wall of the contact hole, and the first lower electrode; a dielectric layer formed on the first and second lower electrodes; and an upper electrode formed on the dielectric layer. This structure increases capacitance, thereby improving the characteristics and reliability of the device.

Inventors

  • 👤 Chang Jae Lee

Bibliographic Details

Application Number —
Jurisdiction US
Data Source google_patents
Last Synchronized 2026-11-02 12:52
CPC Classifications
H; H10; H10B; H10B12/00; H10B12/01; H10B12/02; H10B12/03; H10B12/033; H10D; H10D1/00; H10D1/60; H10D1/68

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 121 words
A capacitor structure of a semiconductor device, the capacitor structure comprising: a semiconductor substrate having an impurity diffusion region; an insulating layer on the semiconductor substrate and having a contact hole on the impurity diffusion region; a first lower electrode having a hemispherical shape in a cross-sectional view perpendicular to the semiconductor substrate on the insulating layer along an upper edge of the contact hole; a barrier metal layer on the first lower electrode and in the contact hole; a second lower electrode on the barrier metal layer, wherein the first and second lower electrodes are not directly in contact with each other; a dielectric layer on the first and second lower electrodes; and an upper electrode on the dielectric layer.
Claim 2
Dependent Claim 121 words
A capacitor structure of a semiconductor device, the capacitor structure comprising: a semiconductor substrate having an impurity diffusion region; an insulating layer on the semiconductor substrate and having a contact hole on the impurity diffusion region; a first lower electrode having a hemispherical shape in a cross-sectional view perpendicular to the semiconductor substrate on the insulating layer along an upper edge of the contact hole; a barrier metal layer on the first lower electrode and in the contact hole; a second lower electrode on the barrier metal layer, wherein the first and second lower electrodes are not directly in contact with each other; a dielectric layer on the first and second lower electrodes; and an upper electrode on the dielectric layer.
Claim 3
Dependent Claim 29 words
The capacitor structure as claimed in claim 1, wherein the insulating layer comprises first and second insulating layers formed of materials having a different etching rate from one another.
Claim 4
Dependent Claim 27 words
The capacitor structure as claimed in claim 2, wherein the first insulating layer is formed to a thickness of 3000 Å(±200 Å) by using SiO 2 .
Claim 5
Dependent Claim 29 words
The capacitor structure as claimed in claim 2, wherein the second insulating layer is formed to a thickness of 300 Å(±20 Å) by using Si 3 N 4 .
Claim 6
Dependent Claim 19 words
The capacitor structure as claimed in claim 1, wherein the upper and lower electrodes are comprised of platinum (Pt).
Claim 7
Dependent Claim 20 words
The capacitor structure as claimed in claim 1, wherein the upper and lower electrodes are comprised of RuO 2 .
Claim 8
Dependent Claim 19 words
The capacitor structure as claimed 1, wherein the barrier metal layer is in contact with the impurity diffusion region.
Claim 9
Dependent Claim 17 words
The capacitor structure as claimed in claim 7, wherein the barrier metal layer is comprised of TiN.
Claim 10
Dependent Claim 18 words
The capacitor structure as claimed in claim 1, wherein the upper and lower electrodes are comprised of polysilicon.
Claim 11
Dependent Claim 22 words
The capacitor structure as claimed in claim 5, wherein the dielectric layer is comprised of a material having a high dielectric constant.
Claim 12
Dependent Claim 22 words
The capacitor structure as claimed in claim 6, wherein the dielectric layer is comprised of a material having a high dielectric constant.
Claim 13
Dependent Claim 19 words
The capacitor structure as claimed in claim 9, wherein the dielectric layer is formed of an oxide-nitride (ON) structure.
Claim 14
Dependent Claim 19 words
The capacitor structure as claimed in claim 1, wherein the first lower electrode comprises first and second conductive sidewalls.
Claim 15
Dependent Claim 19 words
The capacitor structure as claimed in claim 13, wherein the first and second conductive sidewalls directly contact each other.
Claim 16
Dependent Claim 18 words
The capacitor structure as claimed in claim 13, wherein the first and second conductive sidewalls have different heights.

References Cited (Backward Citations)

US5291058A Cited
US5108943A Cited
US5150276A Cited
US5460996A Cited
US5581110A Cited
US5604696A Cited
US5555486A Cited

USPTO Annuity & Maintenance Windows

Annuity Stage Window Opens Payment Deadline Surcharge Period Until Estimated Fee Status
3.5 Years (Year 4) 2003-06-20 2003-12-20 2004-06-20 $2000.00 Window Closed / Lapsed
7.5 Years (Year 8) 2007-06-20 2007-12-20 2008-06-20 $3760.00 Window Closed / Lapsed
11.5 Years (Year 12) 2011-06-20 2011-12-20 2012-06-20 $7700.00 Window Closed / Lapsed

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