Patent US6074695A successfully refreshed from Google Patents.
US6074695A
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Composition and process for forming electrically insulating thin films
Assignee: DuPont Toray Specialty Materials KK
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Filing: 1998-03-31
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Granted: 2000-06-13
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Expires: 2018-03-31
Abstract
Abstract To provide a composition for the formation of insulating films that can form an insulating film having a low dielectric constant. The composition comprises (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) at least two solvents: (B)(i) a solvent capable of dissolving resin (A) and (B)(ii) a solvent whose boiling point or vapor pressure curve differs from that of solvent (B)(i) or whose affinity for resin (A) differs from that of solvent (B)(i). Also claimed is a method for forming a insulating films that have a dielectric constant of less than 2.7.
Inventors
- 👤 Akihiko Kobayashi
- 👤 Katsutoshi Mine
- 👤 Takashi Nakamura
- 👤 Motoshi Sasaki
- 👤 Kiyotaka Sawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-05 10:00
CPC Classifications
C; C04; C04B; C04B41/00; C04B41/009; H; H10; H10P; H10P14/00; H10P14/60; H10P14/69; H10P14/692; H10P14/6921; H10P14/6922; H10P14/6925; C04B41/45; C04B41/46; C04B41/49; C04B41/4905; C04B41/495; C04B41/4961; C04B41/4966; C04B41/80; C04B41/81; C04B41/82; C04B41/84; C09; C09D; C09D183/00; C09D183/04; H01; H01B; H01B3/00; H01B3/18; H01B3/30; H01B3/46; C04B2111/00; C04B2111/00474; C04B2111/00844; H10P14/63; H10P14/6326; H10P14/6342
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
88 words
A composition for forming electrically insulating thin films comprising (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) a solvent mixture comprising (i) a solvent capable of dissolving resin (A) and (ii) a solvent selected from the group consisting of solvents whose boiling point differs from solvent (i), solvents whose vapor pressure curve differs from that of solvent (i) and solvents whose affinity for resin (A) differs from that of solvent (i).
Claim 2
Dependent Claim
88 words
A composition for forming electrically insulating thin films comprising (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) a solvent mixture comprising (i) a solvent capable of dissolving resin (A) and (ii) a solvent selected from the group consisting of solvents whose boiling point differs from solvent (i), solvents whose vapor pressure curve differs from that of solvent (i) and solvents whose affinity for resin (A) differs from that of solvent (i).
Claim 3
Dependent Claim
14 words
The composition as claimed in claim 1 wherein resin (A) is hydrogen silsesquioxane resin.
Claim 4
Dependent Claim
19 words
The composition as claimed in claim 1 wherein the composition additionally contains (C) a cure-accelerating catalyst for component (A).
Claim 5
Dependent Claim
19 words
The composition as claimed in claim 3 wherein (C) is selected from a platinum compound or transition metal compound.
Claim 6
Dependent Claim
30 words
The composition as claimed in claim 1 wherein solvent (B)(i) is selected from the group consisting of aromatic solvents, aliphatic solvents; ketone solvents, aliphatic ester solvents, silicone solvents, and silanes.
Claim 7
Dependent Claim
14 words
The composition as claimed in claim 5 wherein the solvent is a ketone solvent.
Claim 8
Dependent Claim
14 words
The composition as claimed in claim 6 wherein the solvent is methyl isobutyl ketone.
Claim 9
Dependent Claim
14 words
The composition as claimed in claim 5 wherein the solvent is a silicone solvent.
Claim 10
Dependent Claim
22 words
The composition as claimed in claim 1 wherein the solvent (B)(ii) is a solvent having a higher boiling point than solvent (B)(i).
Claim 11
Dependent Claim
51 words
The composition as claimed in claim 9 wherein the solvent (B)(ii) is selected from the group consisting of hydrocarbon solvents ketone solvents; aldehyde solvents; ester solvents; diethyl sulfate; sulfolane; halohydrocarbon solvents; etherified hydrocarbon solvents; alcohol solvents; ether solvents; acetal solvents; polyhydric alcohol solvents; carboxylic anhydride solvents; phenolic solvents; and silicone solvents.
Claim 12
Dependent Claim
19 words
The composition as claimed in claim 1 wherein solvent (B)(i) is methyl isobuytyl ketone and solvent (B)(ii) is dodecylbenzene.
Claim 13
Dependent Claim
20 words
The composition as claimed in claim 1 wherein solvent (B)(i) is methyl isobuytyl ketone and solvent (B)(ii) is diethyl phthalate.
Claim 14
Dependent Claim
19 words
The composition as claimed in claim 1 wherein solvent (B)(i) is methyl isobuytyl ketone and solvent (B)(ii) is cyclohexylbenzene.
Claim 15
Dependent Claim
19 words
The composition as claimed in claim 1 wherein solvent (B)(i) is methyl isobuytyl ketone and solvent (B)(ii) is pentylbenzene.
Claim 16
Dependent Claim
19 words
The composition as claimed in claim 1 wherein solvent (B)(i) is a silicone solvent and solvent (B)(ii) is dodecylbenzene.
Claim 17
Dependent Claim
24 words
The composition as claimed in claim 1 wherein the solvent mixture (B) is present at 50 wt % per 100 weight parts resin (A).
Claim 18
Dependent Claim
145 words
A process for forming electrically insulating thin films comprising (I) coating the surface of a substrate with a composition for forming electrically insulating thin films comprising (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) a solvent mixture comprising (i) a solvent capable of dissolving resin (A) and (ii) a solvent selected from the group consisting of a solvent whose boiling point differs from solvent (i), a solvent whose vapor pressure curve differs from that of solvent (i) and a solvent whose affinity for resin (A) differs from that of solvent (i); (II) evaporating at least a portion of the solvent mixture (B); and (III) heating the substrate to induce gasification of the remaining component (B) during the course of or after the cure of the said resin (A).
Claim 19
Dependent Claim
145 words
A process for forming electrically insulating thin films comprising (I) coating the surface of a substrate with a composition for forming electrically insulating thin films comprising (A) an electrically insulating curable resin selected from the group consisting of electrically insulating curable organic resins and electrically insulating curable inorganic resins; and (B) a solvent mixture comprising (i) a solvent capable of dissolving resin (A) and (ii) a solvent selected from the group consisting of a solvent whose boiling point differs from solvent (i), a solvent whose vapor pressure curve differs from that of solvent (i) and a solvent whose affinity for resin (A) differs from that of solvent (i); (II) evaporating at least a portion of the solvent mixture (B); and (III) heating the substrate to induce gasification of the remaining component (B) during the course of or after the cure of the said resin (A).
Claim 20
Dependent Claim
14 words
The process as claimed in claim 17 wherein the substrate is an electronic device.
Claim 21
Dependent Claim
17 words
The process as claimed in claim 17 wherein the coating of the surface is by spin coating.
Claim 22
Dependent Claim
26 words
The process as claimed in claim 17 wherein the substrate is heated in (III) to a temperature higher than the melting point of the resin (A).
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-06-13 | 2003-12-13 | 2004-06-13 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-06-13 | 2007-12-13 | 2008-06-13 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-06-13 | 2011-12-13 | 2012-06-13 | $7700.00 | Window Closed / Lapsed |