Patent US6069407A successfully refreshed from Google Patents.
US6069407A
Expired / Lapsed
US
⏱️ 0.0 years remaining
BGA package using PCB and tape in a die-up configuration
Assignee: Philips Semiconductors Inc
•
Filing: 1998-11-18
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Granted: 2000-05-30
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Expires: 2018-11-18
Abstract
Abstract A die-up configuration includes a rigid circuit board with electrically conductive plated-through holes formed therethrough and an integrated-circuit die mounted to the upper surface of which a flexible insulated tape layer is fixed to the upper surface of a rigid circuit board and which has a number of wire-bonding sites. Conductive vias or plated-through holes are provided for connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the contact areas formed on the lower surface of the flexible insulated tape layer. Conductors are provided for connecting respective contact areas on the lower surface of the flexible insulated tape layer to solder balls on the bottom of the rigid circuit board.
Inventors
- 👤 Ahmad Hamzehdoost
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 15:19
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/401; H05; H05K; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10W74/00; H10W74/10; H10W74/111; H10W74/114; H10W74/117; H05K2201/00; H05K2201/03; H05K2201/0302; H05K2201/0305; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10666; H05K3/40; H05K3/4038; H05K3/4046; H10W72/00; H10W72/071; H10W72/075; H10W72/851; H10W72/874; H10W72/884; H10W72/90; H10W72/951; H10W90/701; H10W90/751; H10W90/754; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 24
Claim 1
Independent Claim
332 words
A die-up BGA package for an integrated-circuit die, comprising: a rigid circuit board having a top surface, a bottom surface, and a plurality of electrical conductors formed therethrough between the top surface and the bottom surface of the rigid circuit board, wherein said electrical conductors each have circuit-board contact areas at the top surface of the rigid circuit board; a flexible insulated tape layer having an upper surface and a lower surface, wherein the lower surface of the flexible insulated tape layer is fixed to the top surface of the rigid circuit board, wherein the upper surface of the flexible insulated tape layer has a number of wire-bonding sites formed thereon, and wherein the lower surface of the flexible insulated tape layer has a number of tape-layer contact areas formed thereon; an integrated-circuit die having a pair of opposing surfaces, one of which surfaces is a die-mounting surface and the other surface of which has wire-bonding pads formed thereupon, wherein the die-mounting surface of the integrated-circuit side is mounted to the upper surface of the flexible insulated tape layer; means for electrically connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to respective tape-layer contact areas formed on the lower surface of the flexible insulated tape layer; a plurality of bonding-wire loops, each of which has one end bonded to one of the wire-bonding pads formed on the integrated-circuit die and the other end bonded to a respective one of the wire-bonding sites on the upper surface of the flexible insulated tape layer; means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas of the electrical conductors at the top surface of the rigid circuit board; a plurality of solder balls connected to the lower surface of the rigid circuit board and to the conductors formed through the rigid circuit board; and sealing means for covering and sealing the integrated-circuit die and the bonding wires.
Claim 2
Dependent Claim
332 words
A die-up BGA package for an integrated-circuit die, comprising: a rigid circuit board having a top surface, a bottom surface, and a plurality of electrical conductors formed therethrough between the top surface and the bottom surface of the rigid circuit board, wherein said electrical conductors each have circuit-board contact areas at the top surface of the rigid circuit board; a flexible insulated tape layer having an upper surface and a lower surface, wherein the lower surface of the flexible insulated tape layer is fixed to the top surface of the rigid circuit board, wherein the upper surface of the flexible insulated tape layer has a number of wire-bonding sites formed thereon, and wherein the lower surface of the flexible insulated tape layer has a number of tape-layer contact areas formed thereon; an integrated-circuit die having a pair of opposing surfaces, one of which surfaces is a die-mounting surface and the other surface of which has wire-bonding pads formed thereupon, wherein the die-mounting surface of the integrated-circuit side is mounted to the upper surface of the flexible insulated tape layer; means for electrically connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to respective tape-layer contact areas formed on the lower surface of the flexible insulated tape layer; a plurality of bonding-wire loops, each of which has one end bonded to one of the wire-bonding pads formed on the integrated-circuit die and the other end bonded to a respective one of the wire-bonding sites on the upper surface of the flexible insulated tape layer; means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas of the electrical conductors at the top surface of the rigid circuit board; a plurality of solder balls connected to the lower surface of the rigid circuit board and to the conductors formed through the rigid circuit board; and sealing means for covering and sealing the integrated-circuit die and the bonding wires.
Claim 3
Dependent Claim
76 words
The package of claim 1 wherein the means for connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the tape-layer contact areas formed on the lower surface of the flexible insulated tape layer include conductive vias formed through the flexible insulated layer, filled with conductive material, and also connected to conductive traces formed on the upper surface of the flexible insulated tape layer for connection to the wire bonding sites.
Claim 4
Dependent Claim
72 words
The package of claim 1 wherein the means for connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the tape-layer contact areas formed on the lower surface of the flexible insulated tape layer include plated through holes formed through the flexible insulated layer and connected to conductive traces formed on the upper surface of the flexible insulated tape layer for connection to the wire bonding sites.
Claim 5
Dependent Claim
21 words
The package of claim 1 wherein the electrical conductors formed through the rigid circuit board include vias filled with conductive material.
Claim 6
Dependent Claim
74 words
The package of claim 4 wherein the means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board include the conductive material in the vias in the rigid circuit board making contact with respective tape-layer contact areas on the lower surface of the flexible insulated tape layer through a layer of conductive adhesive material.
Claim 7
Dependent Claim
18 words
The package of claim 1 wherein the electrical conductors formed through the rigid circuit board include plated-through holes.
Claim 8
Dependent Claim
46 words
The package of claim 6 wherein the means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board include the top surfaces of the plated-through holes.
Claim 9
Dependent Claim
34 words
The package of claim 1 wherein the solder balls connected to the lower surface of the rigid circuit board are arranged in a grid pattern on the bottom side of the die-up BGA package.
Claim 10
Dependent Claim
15 words
The package of claim 1 wherein the rigid circuit board is an epoxy printed-circuit board.
Claim 11
Dependent Claim
15 words
The package of claim 1 wherein the rigid circuit board is a ceramic circuit board.
Claim 12
Dependent Claim
21 words
The package of claim 1 wherein the sealing means includes an encapsulation layer covering the integrated-circuit die and the bonding wires.
Claim 13
Dependent Claim
366 words
A die-up BGA package for an integrated-circuit die, comprising: a rigid circuit board having a top surface, a bottom surface, and a plurality of electrical conductors formed therethrough between the top surface and the bottom surface of the rigid circuit board, wherein said electrical conductors each have a circuit-board contact area at the top surface of the rigid circuit board; a flexible insulated tape layer having an upper surface and a lower surface, wherein the lower surface of the flexible insulated tape layer is fixed to the top surface of the rigid circuit board, wherein the upper surface of the flexible insulated tape layer has a number of wire-bonding sites formed thereon, and wherein the lower surface of the flexible insulated tape layer has a number of tape-layer contact areas formed thereon; an integrated-circuit die having a pair of opposing surfaces, one of which surfaces is a die-mounting surface and the other surface of which has wire-bonding pads formed thereupon, wherein the die-mounting surface of the integrated-circuit side is mounted to the upper surface of the flexible insulated tape layer; means for electrically connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the tape-layer contact areas formed on the lower surface of the flexible insulated tape layer, wherein said means include conductive vias formed through the flexible insulated layer, filled with conductive material, and also connected to conductive traces formed on the upper surface of the flexible insulated tape layer for connection to the wire bonding; a plurality of bonding-wire loops, each of which has one end bonded to one of the wire-bonding pads formed on the integrated-circuit die and the other end bonded to a respective one of the wire-bonding sites on the upper surface of the flexible insulated tape layer; means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board; a plurality of solder balls connected to the lower surface of rigid circuit board and to the conductors formed through the rigid circuit board; and sealing means for covering and sealing the integrated-circuit die, the bonding wires.
Claim 14
Dependent Claim
366 words
A die-up BGA package for an integrated-circuit die, comprising: a rigid circuit board having a top surface, a bottom surface, and a plurality of electrical conductors formed therethrough between the top surface and the bottom surface of the rigid circuit board, wherein said electrical conductors each have a circuit-board contact area at the top surface of the rigid circuit board; a flexible insulated tape layer having an upper surface and a lower surface, wherein the lower surface of the flexible insulated tape layer is fixed to the top surface of the rigid circuit board, wherein the upper surface of the flexible insulated tape layer has a number of wire-bonding sites formed thereon, and wherein the lower surface of the flexible insulated tape layer has a number of tape-layer contact areas formed thereon; an integrated-circuit die having a pair of opposing surfaces, one of which surfaces is a die-mounting surface and the other surface of which has wire-bonding pads formed thereupon, wherein the die-mounting surface of the integrated-circuit side is mounted to the upper surface of the flexible insulated tape layer; means for electrically connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the tape-layer contact areas formed on the lower surface of the flexible insulated tape layer, wherein said means include conductive vias formed through the flexible insulated layer, filled with conductive material, and also connected to conductive traces formed on the upper surface of the flexible insulated tape layer for connection to the wire bonding; a plurality of bonding-wire loops, each of which has one end bonded to one of the wire-bonding pads formed on the integrated-circuit die and the other end bonded to a respective one of the wire-bonding sites on the upper surface of the flexible insulated tape layer; means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board; a plurality of solder balls connected to the lower surface of rigid circuit board and to the conductors formed through the rigid circuit board; and sealing means for covering and sealing the integrated-circuit die, the bonding wires.
Claim 15
Dependent Claim
21 words
The package of claim 12 wherein the electrical conductors formed through the rigid circuit board include vias filled with conductive material.
Claim 16
Dependent Claim
67 words
The package of claim 13 wherein the means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board include the conductive material in the vias in the rigid circuit board making contact with respective tape-layer contact areas on the lower surface of the flexible insulated tape layer.
Claim 17
Dependent Claim
18 words
The package of claim 12 wherein the electrical conductors formed through the rigid circuit board include plated-through holes.
Claim 18
Dependent Claim
46 words
The package of claim 15 wherein the means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board include the top surfaces of the plated-through holes.
Claim 19
Dependent Claim
363 words
A die-up BGA package for an integrated-circuit die, comprising: a rigid circuit board having a top surface, a bottom surface, and a plurality of electrical conductors formed therethrough between the top surface and the bottom surface of the rigid circuit board, wherein said electrical conductors each have a circuit-board contact area at the top surface of the rigid circuit board; a flexible insulated tape layer having an upper surface and a lower surface, wherein the lower surface of the flexible insulated tape layer is fixed to the top surface of the rigid circuit board, wherein the upper surface of the flexible insulated tape layer has a number of wire-bonding sites formed thereon, and wherein the lower surface of the flexible insulated tape layer has a number of tape-layer contact areas formed thereon; an integrated-circuit die having a pair of opposing surfaces, one of which surfaces is a die-mounting surface and the other surface of which has wire-bonding pads formed thereupon, wherein the die-mounting surface of the integrated-circuit side is mounted to the upper surface of the flexible insulated tape layer; means for electrically connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the tape-layer contact areas formed on the lower surface of the flexible insulated tape layer, wherein said means include plated through holes formed through the flexible insulated layer and connected to conductive traces formed on the upper surface of the flexible insulated tape layer for connection to the wire bonding sites; a plurality of bonding-wire loops, each of which has one end bonded to one of the wire-bonding pads formed on the integrated-circuit die and the other end bonded to a respective one of the wire-bonding sites on the upper surface of the flexible insulated tape layer; means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board; a plurality of solder balls connected to the lower surface of rigid circuit board and to the conductors formed through the rigid circuit board; and sealing means for covering and sealing the integrated-circuit die, the bonding wires.
Claim 20
Dependent Claim
363 words
A die-up BGA package for an integrated-circuit die, comprising: a rigid circuit board having a top surface, a bottom surface, and a plurality of electrical conductors formed therethrough between the top surface and the bottom surface of the rigid circuit board, wherein said electrical conductors each have a circuit-board contact area at the top surface of the rigid circuit board; a flexible insulated tape layer having an upper surface and a lower surface, wherein the lower surface of the flexible insulated tape layer is fixed to the top surface of the rigid circuit board, wherein the upper surface of the flexible insulated tape layer has a number of wire-bonding sites formed thereon, and wherein the lower surface of the flexible insulated tape layer has a number of tape-layer contact areas formed thereon; an integrated-circuit die having a pair of opposing surfaces, one of which surfaces is a die-mounting surface and the other surface of which has wire-bonding pads formed thereupon, wherein the die-mounting surface of the integrated-circuit side is mounted to the upper surface of the flexible insulated tape layer; means for electrically connecting the wire-bonding sites on the upper surface of the flexible insulated tape layer to the tape-layer contact areas formed on the lower surface of the flexible insulated tape layer, wherein said means include plated through holes formed through the flexible insulated layer and connected to conductive traces formed on the upper surface of the flexible insulated tape layer for connection to the wire bonding sites; a plurality of bonding-wire loops, each of which has one end bonded to one of the wire-bonding pads formed on the integrated-circuit die and the other end bonded to a respective one of the wire-bonding sites on the upper surface of the flexible insulated tape layer; means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board; a plurality of solder balls connected to the lower surface of rigid circuit board and to the conductors formed through the rigid circuit board; and sealing means for covering and sealing the integrated-circuit die, the bonding wires.
Claim 21
Dependent Claim
21 words
The package of claim 17 wherein the electrical conductors formed through the rigid circuit board include vias filled with conductive material.
Claim 22
Dependent Claim
67 words
The package of claim 18 wherein the means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board include the conductive material in the vias in the rigid circuit board making contact with respective tape-layer contact areas on the lower surface of the flexible insulated tape layer.
Claim 23
Dependent Claim
18 words
The package of claim 17 wherein the electrical conductors formed through the rigid circuit board include plated-through holes.
Claim 24
Dependent Claim
46 words
The package of claim 20 wherein the means for connecting respective tape-layer contact areas on the lower surface of the flexible insulated tape layer to the circuit-board contact areas at the top surface of the rigid circuit board include the top surfaces of the plated-through holes.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-30 | 2003-11-29 | 2004-05-30 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-30 | 2007-11-29 | 2008-05-30 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-30 | 2011-11-29 | 2012-05-30 | $7700.00 | Window Closed / Lapsed |