Patent US6060768A successfully refreshed from Google Patents.
US6060768A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device, method of manufacturing the semiconductor device, and method of manufacturing lead frame
Assignee: Fujitsu Ltd
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Filing: 1997-09-23
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Granted: 2000-05-09
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Expires: 2017-09-23
Abstract
Abstract A semiconductor device includes a semiconductor chip in which electrode pads are formed with a first pitch, leads electrically connected with the electrode pads through lines, and sealing plastic sealing the semiconductor chip. In the semiconductor device, projections used for external connection ports are formed in the leads with a second pitch. The sealing plastic seals the lines connecting the electrode pads and the leads, but the projections are exposed from the sealing plastic.
Inventors
- 👤 Katsuhiro Hayashida
- 👤 Mitsutaka Sato
- 👤 Tadashi Uno
- 👤 Tetsuya Fujisawa
- 👤 Masaki Waki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:17
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/016; H10W70/00; H10W70/40; H10W70/411; H10W70/415; H10W70/421; H10W70/424; H10W74/10; H10W74/111; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/073; H10W72/07331; H10W72/07337; H10W72/07351; H10W72/07352; H10W72/075; H10W72/07521; H10W72/20; H10W72/29; H10W72/30; H10W72/321; H10W72/351; H10W72/352; H10W72/353; H10W72/354; H10W72/50; H10W72/531; H10W72/536; H10W72/5363; H10W72/551; H10W72/552; H10W72/5522; H10W72/59; H10W72/851; H10W72/853; H10W72/865; H10W72/90; H10W72/931; H10W72/932; H10W72/941; H10W72/944; H10W72/9445; H10W90/00; H10W90/701; H10W90/731; H10W90/736; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
142 words
A semiconductor device comprising: a semiconductor chip in which electrode pads are formed with a first pitch; leads electrically connected with said electrode pads through lines, said pads being located beyond end portions of the leads, the end portions of the leads being wire-bonded to the pads; and sealing plastic sealing said semiconductor chip; wherein projections used for external connection ports are formed in said leads with a second pitch, said projections and the sealing plastic being flush with each other, said projections being located at a side of a surface of the semiconductor chip on which circuits are formed within a chip area defined by said surface of the semiconductor chip; said sealing plastic seals said lines connecting said electrode pads and said leads; and parts being provided at ends of the projections so as to protrude from said sealing plastic.
Claim 2
Dependent Claim
142 words
A semiconductor device comprising: a semiconductor chip in which electrode pads are formed with a first pitch; leads electrically connected with said electrode pads through lines, said pads being located beyond end portions of the leads, the end portions of the leads being wire-bonded to the pads; and sealing plastic sealing said semiconductor chip; wherein projections used for external connection ports are formed in said leads with a second pitch, said projections and the sealing plastic being flush with each other, said projections being located at a side of a surface of the semiconductor chip on which circuits are formed within a chip area defined by said surface of the semiconductor chip; said sealing plastic seals said lines connecting said electrode pads and said leads; and parts being provided at ends of the projections so as to protrude from said sealing plastic.
Claim 3
Dependent Claim
38 words
The semiconductor device as claimed in claim 1, wherein said semiconductor device further comprises a polyimide film operable as an adhesive and said semiconductor chip and said leads are joined by said polyimide film operating as the adhesive.
Claim 4
Dependent Claim
20 words
The semiconductor device as claimed in claim 2, wherein said projections are respectively formed as one body with said leads.
Claim 5
Dependent Claim
13 words
The semiconductor device as claimed in claim 3, wherein said lines comprise wires.
Claim 6
Dependent Claim
18 words
The semiconductor device as claimed in claim 4, wherein said semiconductor device further comprises bumps on said projections.
Claim 7
Dependent Claim
39 words
The semiconductor device as claimed in claim 1, wherein the top end part is exposed from a bottom face of the sealing plastic, and a part of the lead is exposed from a side face of said sealing plastic.
Claim 8
Dependent Claim
179 words
A semiconductor device comprising: a semiconductor chip in which electrode pads are formed with a first pitch; leads electrically connected with said electrode pads through lines, said pads being located beyond end portions of the leads, the end portions of the leads being wire-bonded to the pads; and sealing plastic sealing said semiconductor chip; wherein projections used for external connection ports are formed in said leads with a second pitch, said projections and the sealing plastic being flush with each other, parts being provided at ends of said projections so as to protrude from said sealing plastic, said projections being located at a side of a surface of the semiconductor chip on which circuits are formed within a chip area defined by the surface of the semiconductor chip; and a thickness of said sealing plastic from a face of said electrode pads is equal to or smaller than a height of said projections from said face of the electrode pads, and is equal to or larger than a height from said face of the electrode pads to said lines.
Claim 9
Dependent Claim
179 words
A semiconductor device comprising: a semiconductor chip in which electrode pads are formed with a first pitch; leads electrically connected with said electrode pads through lines, said pads being located beyond end portions of the leads, the end portions of the leads being wire-bonded to the pads; and sealing plastic sealing said semiconductor chip; wherein projections used for external connection ports are formed in said leads with a second pitch, said projections and the sealing plastic being flush with each other, parts being provided at ends of said projections so as to protrude from said sealing plastic, said projections being located at a side of a surface of the semiconductor chip on which circuits are formed within a chip area defined by the surface of the semiconductor chip; and a thickness of said sealing plastic from a face of said electrode pads is equal to or smaller than a height of said projections from said face of the electrode pads, and is equal to or larger than a height from said face of the electrode pads to said lines.
Claim 10
Dependent Claim
39 words
The semiconductor device as claimed in claim 7, wherein the top end part is exposed from a bottom face of the sealing plastic, and a part of the lead is exposed from a side face of said sealing plastic.
Claim 11
Dependent Claim
38 words
The semiconductor device as claimed in claim 7, wherein said semiconductor device further comprises a polyimide film operable as an adhesive, and said semiconductor chip and said leads are joined by said polyimide film operating as the adhesive.
Claim 12
Dependent Claim
20 words
The semiconductor device as claimed in claim 9, wherein said projections are respectively formed as one body with said leads.
Claim 13
Dependent Claim
13 words
The semiconductor device as claimed in claim 10, wherein said lines comprise wires.
Claim 14
Dependent Claim
18 words
The semiconductor device as claimed in claim 11, wherein said semiconductor device further comprises bumps on said projections.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-05-09 | 2003-11-08 | 2004-05-09 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-05-09 | 2007-11-08 | 2008-05-09 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-05-09 | 2011-11-08 | 2012-05-09 | $7700.00 | Window Closed / Lapsed |