Chip and board stress relief interposer

Claim 2

An interposer to electrically couple contact pads of a chip and a substrate bonded on opposite sides of the interposer, comprising: a substantially planar dielectric film having first and second opposing surfaces; a first electrical contact pad disposed on the first surface of the film; a second electrical contact pad disposed on the second surface of the film and laterally spaced apart from said first electrical contact pad; a conductive via disposed in said film having a first end proximate the first surface and a second end proximate the second surface, the first end of said via electrically coupled to said first contact pad and the second end of said via electrically coupled to said second contact pad by a flexible conductive trace disposed on the second surface of the film; and a plurality of cavities disposed in said film, said cavities arranged to increase the effective elasticity of the interposer between said first and said second contact pads; wherein a flexible region is formed between said first and second contact pads to enable transverse displacement of said first electrical contact pad relative to said second electrical contact pad.

Claim 3

The interposer of claim 1, wherein said flexible region is substantially physically decoupled from the dielectric film along at least two sides by a series of spaced cavities extending substantially through the dielectric film to form a flap.

Claim 4

The interposer of claim 1, wherein said trace is dimensioned to permit at least 15 microns of relative displacement.

Claim 5

The interposer of claim 2, wherein said cavities are shaped and spaced to perforate in response to thermal stresses in the mounted interposer to form the flap.

Claim 6

The interposer of claim 4, wherein said cavities and said trace are shaped and positioned to enable at least 15 microns of relative displacement between said first and second contact pads in the mounted interposer.

Claim 7

The interposer of claim 1, wherein said cavities extend from the first to the second side of said film.

Claim 8

The interposer of claim 1, wherein said flexible region is substantially free of non-ductile metal layers.

Claim 9

An interposer to electrically connect contact pads disposed on surfaces on opposite sides of the interposer, comprising: a substantially planar dielectric film having first and second opposing surfaces; a first electrical contact pad disposed on the first surface of the film, the electrical contact pad dimensioned to be attached to a chip contact pad; a conductive via disposed in the film, and electrically coupled to the first electrical contact pad; a second electrical contact pad disposed on the second surface of the film laterally spaced apart from said first contact pad; a flexible electrically conductive trace disposed on the second surface of said film, the trace having a first end and a second end, the first end of said trace electrically coupled to said via and the second end of said trace electrically coupled to the second contact pad; and a plurality of cavities in the film extending substantially through the film generally around the via and the trace, said cavities arranged to increase the effective elasticity of the interposer between said first electrical contact pad and said second electrical contact pad; wherein a flexible region substantially free of non-ductile metal layers disposed between said first and second contact pads enables transverse displacement of said first contact pad relative to said second contact pad.

Claim 10

An interposer to electrically connect contact pads disposed on surfaces on opposite sides of the interposer, comprising: a substantially planar dielectric film having first and second opposing surfaces; a first electrical contact pad disposed on the first surface of the film, the electrical contact pad dimensioned to be attached to a chip contact pad; a conductive via disposed in the film, and electrically coupled to the first electrical contact pad; a second electrical contact pad disposed on the second surface of the film laterally spaced apart from said first contact pad; a flexible electrically conductive trace disposed on the second surface of said film, the trace having a first end and a second end, the first end of said trace electrically coupled to said via and the second end of said trace electrically coupled to the second contact pad; and a plurality of cavities in the film extending substantially through the film generally around the via and the trace, said cavities arranged to increase the effective elasticity of the interposer between said first electrical contact pad and said second electrical contact pad; wherein a flexible region substantially free of non-ductile metal layers disposed between said first and second contact pads enables transverse displacement of said first contact pad relative to said second contact pad.

Claim 11

The interposer of claim 8, wherein the cavities are comprised of holes less than about 50 microns in diameter and with a spacing between holes that is less than twice the hole diameter.

Claim 12

The interposer of claim 9, wherein the holes have a diameter less than about 30 microns.

Claim 13

The interposer of claim 8, wherein the cavity size and spacing is selected such that the film is perforable along the cavities so that the film tears along the cavities in the mounted interposer in response to thermal stress.

Claim 14

The interposer of claim 11, wherein the perforations define a flap-like region.

Claim 15

The interposer of claim 12, wherein the flap-like region is shaped and positioned such that a torn flap in the mounted interposer enables at least 15 microns of relative transverse displacement between the first electrical contact pad and the second electrical contact pad.

Claim 16

A dielectric interposer which permits substantial relative radial displacement of the contact pads of a chip and a substrate bonded on opposing sides of the interposer, comprising: a polyimide dielectric film less than about 100 microns thick having a first surface and a second surface; a first electrical contact pad less than about 150 microns in diameter disposed on the first surface of the film, the electrical contact pad dimensioned to be attached to the chip contact pad solder ball; a conductive via less than about 50 microns in diameter disposed in the film and electrically coupled to the first electrical contact pad; a second electrical contact pad less than about 150 microns in diameter disposed on the second surface of the film laterally spaced apart a distance greater than the largest thermal displacement associated with the maximum thermal cycling of the chip, the second contact pad dimensioned to be attached to the substrate contact pad solder ball; a flexible electrically conductive trace disposed on the second surface of the film, the trace having a first end and a second end, the first end of said trace coupled to said via and the second end coupled to the second contact pad; and a plurality of cavities in said film extending substantially through said film generally around the via hole and the trace, said spaced cavities comprising a series of holes less than about 30 microns in diameter and separated from one another by a distance of less than about 60 microns, said cavities arranged to increase the effective elasticity of the interposer between said first electrical contact pad and said second electrical contact pad in a region between said contact pads; wherein a flexible region substantially free of non-ductile metal layers disposed between said first contact pad and said second contact pad enables transverse displacement of said first contact pad relative to said second contact pad.

Claim 17

A dielectric interposer which permits substantial relative radial displacement of the contact pads of a chip and a substrate bonded on opposing sides of the interposer, comprising: a polyimide dielectric film less than about 100 microns thick having a first surface and a second surface; a first electrical contact pad less than about 150 microns in diameter disposed on the first surface of the film, the electrical contact pad dimensioned to be attached to the chip contact pad solder ball; a conductive via less than about 50 microns in diameter disposed in the film and electrically coupled to the first electrical contact pad; a second electrical contact pad less than about 150 microns in diameter disposed on the second surface of the film laterally spaced apart a distance greater than the largest thermal displacement associated with the maximum thermal cycling of the chip, the second contact pad dimensioned to be attached to the substrate contact pad solder ball; a flexible electrically conductive trace disposed on the second surface of the film, the trace having a first end and a second end, the first end of said trace coupled to said via and the second end coupled to the second contact pad; and a plurality of cavities in said film extending substantially through said film generally around the via hole and the trace, said spaced cavities comprising a series of holes less than about 30 microns in diameter and separated from one another by a distance of less than about 60 microns, said cavities arranged to increase the effective elasticity of the interposer between said first electrical contact pad and said second electrical contact pad in a region between said contact pads; wherein a flexible region substantially free of non-ductile metal layers disposed between said first contact pad and said second contact pad enables transverse displacement of said first contact pad relative to said second contact pad.

Claim 18

The interposer of claim 14, wherein the spaced cavities define flap-like regions.

Claim 19

The interposer of claim 15, wherein the flap-like regions comprise radially oriented flaps.

Claim 20

The interposer of claim 16, wherein the effective elasticity of the interposer layer in flap regions is increased by at least a factor of two compared to the dielectric film as a whole.