Patent US6043153A successfully refreshed from Google Patents.
US6043153A
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Method for reducing electromigration in a copper interconnect
Assignee: GlobalFoundries Inc
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Filing: 1997-09-25
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Granted: 2000-03-28
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Expires: 2017-09-25
Abstract
Abstract A system and method for providing copper interconnect in a trench formed in a dielectric is disclosed. In one aspect, the method and system include providing a copper layer; removing a portion of the copper layer outside of the trench; annealing the copper layer; and providing a layer disposed above the copper layer. In another aspect, the method and system include providing a copper interconnect formed in a trench on a dielectric. The copper interconnect includes a copper layer disposed in the trench and a layer disposed above the copper layer. The copper layer has a bamboo structure at least one grain. The at least one grain has substantially one orientation.
Inventors
- 👤 Takeshi Nogami
- 👤 Simon Chan
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-06 13:56
CPC Classifications
H; H10; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/056; H10W20/032
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
48 words
A method for providing a copper interconnect in a trench formed in a dielectric, the method comprising the sequential steps of: providing a copper layer; removing a portion of the copper layer outside of the trench; annealing the copper layer; and providing a layer disposed above the copper.
Claim 2
Independent Claim
48 words
A method for providing a copper interconnect in a trench formed in a dielectric, the method comprising the sequential steps of: providing a copper layer; removing a portion of the copper layer outside of the trench; annealing the copper layer; and providing a layer disposed above the copper.
Claim 3
Dependent Claim
26 words
The method of claim 1 further comprising the step of: providing a barrier layer, the barrier layer being disposed between the copper layer and the dielectric.
Claim 4
Dependent Claim
26 words
The method of claim 2 wherein the step of annealing the copper layer further comprises the step of: annealing the copper layer in a non-oxidizing ambient.
Claim 5
Dependent Claim
12 words
The method of claim 3 wherein the non-oxidizing ambient further comprises vacuum.
Claim 6
Dependent Claim
12 words
The method of claim 3 wherein the non-oxidizing ambient further comprises hydrogen.
Claim 7
Dependent Claim
24 words
The method of claim 5 wherein the layer providing step further comprises the step of: providing a dielectric layer disposed above the copper layer.
Claim 8
Dependent Claim
41 words
The method of claim 6 wherein the step of annealing the copper layer further comprises the step of: annealing the copper layer within a temperature range, the temperature range being between approximately three hundred fifty and approximately four hundred degrees Celsius.
Claim 9
Independent Claim
74 words
A method for providing a copper interconnect in a trench formed in a dielectric, the method comprising the steps of: (a) providing a copper layer; (b) removing a first portion of the copper layer outside of the trench; and (c) treating the copper layer to ensure that a second portion of the copper layer within the trench has a bamboo structure and that the second portion of the copper layer has substantially one orientation.
Claim 10
Independent Claim
74 words
A method for providing a copper interconnect in a trench formed in a dielectric, the method comprising the steps of: (a) providing a copper layer; (b) removing a first portion of the copper layer outside of the trench; and (c) treating the copper layer to ensure that a second portion of the copper layer within the trench has a bamboo structure and that the second portion of the copper layer has substantially one orientation.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-03-28 | 2003-09-27 | 2004-03-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-03-28 | 2007-09-27 | 2008-03-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-03-28 | 2011-09-27 | 2012-03-28 | $7700.00 | Window Closed / Lapsed |