Patent US6040622A successfully refreshed from Google Patents.
US6040622A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor package using terminals formed on a conductive layer of a circuit board
Assignee: SanDisk Technologies LLC
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Filing: 1998-06-11
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Granted: 2000-03-21
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Expires: 2018-06-11
Abstract
Abstract A small package is provided for a flash EEPROM memory. The small package uses terminals which are part of a bottom conductive layer of a circuit board. In this manner, the final package can be quite thin. The circuit board can be connected to the integrated circuits and passive devices and can be encapsulated in plastic or glued to a plastic cover. In this manner, a thin and relatively inexpensive package can be formed. Additionally, the circuit board can have testing connections which can be removed before forming the final package.
Inventors
- 👤 Robert F. Wallace
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 23:08
CPC Classifications
G; G11; G11C; G11C5/00; G11C5/06; G11C29/00; G11C29/04; G11C29/08; G11C29/12; G11C29/1201; G11C29/48; G11C5/02; G11C5/04; H; H05; H05K; H05K1/00; H05K1/02; H05K1/0266; H05K1/0268; H05K1/11; H05K1/117; H05K3/00; H05K3/22; H05K3/28; H05K3/284; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/699; H10W74/00; H10W74/01; H10W74/016; H10W74/10; H10W74/111; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W90/00; G11C16/00; G11C16/02; G11C16/04; H05K2201/00; H05K2201/09; H05K2201/09009; H05K2201/09127; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10689; H05K2201/20; H05K2201/2018; H05K3/0011; H05K3/0044; H05K3/0052; H10W72/00; H10W72/20; H10W72/30
Claims Analysis
Total Claims: 31
Claim 1
Independent Claim
88 words
A package including: a circuit board; an set of circuit elements on the circuit board, the set of circuit elements including at least one integrated circuit and passive components; and packaging material surrounding the set of circuit elements and part of the circuit board, wherein one side of the circuit board includes a set of terminals that are visible from the side of the package, the set of terminals being positioned away from the edge of the circuit board, and wherein the package is a flash EEPROM package.
Claim 2
Dependent Claim
88 words
A package including: a circuit board; an set of circuit elements on the circuit board, the set of circuit elements including at least one integrated circuit and passive components; and packaging material surrounding the set of circuit elements and part of the circuit board, wherein one side of the circuit board includes a set of terminals that are visible from the side of the package, the set of terminals being positioned away from the edge of the circuit board, and wherein the package is a flash EEPROM package.
Claim 3
Dependent Claim
12 words
The package of claim 1, wherein the packaging material includes molded plastic.
Claim 4
Dependent Claim
13 words
The package of claim 2, wherein the packaging material includes a bordering frame.
Claim 5
Dependent Claim
14 words
The package of claim 3, wherein the bordering frame is made of plastic material.
Claim 6
Dependent Claim
14 words
The package of claim 1, wherein one side of the circuit board is exposed.
Claim 7
Dependent Claim
29 words
The package of claim 5, wherein the exposed side of the circuit board material includes the set of terminals connected to the remainder of the circuit board by vias.
Claim 8
Dependent Claim
18 words
The package of claim 6, wherein the circuit board material is attached to the packaging material by epoxy.
Claim 9
Dependent Claim
18 words
The package of claim 1, wherein the circuit elements includes at least two integrated circuits and passive devices.
Claim 10
Dependent Claim
16 words
The package of claim 8, wherein the thickness of the package is less than 12 mils.
Claim 11
Dependent Claim
70 words
A package including: a circuit board; at least one integrated circuit on the circuit board; and packaging material surrounding the set of circuit elements and part of the circuit board, wherein one side of the circuit board is exposed, the exposed side of the circuit board including a set of terminals connected to the remainder of the circuit board by vias; and wherein the package is a flash EEPROM package.
Claim 12
Dependent Claim
70 words
A package including: a circuit board; at least one integrated circuit on the circuit board; and packaging material surrounding the set of circuit elements and part of the circuit board, wherein one side of the circuit board is exposed, the exposed side of the circuit board including a set of terminals connected to the remainder of the circuit board by vias; and wherein the package is a flash EEPROM package.
Claim 13
Dependent Claim
18 words
The package of claim 10, wherein the circuit board material is attached to the packaging material by epoxy.
Claim 14
Dependent Claim
21 words
The package of claim 10, wherein on the exposed side of the circuit board only the set of terminals is exposed.
Claim 15
Dependent Claim
18 words
The package of claim 10, wherein the circuit elements includes at least two integrated circuits and passive devices.
Claim 16
Dependent Claim
16 words
The package of claim 10, wherein the thickness of the package is less than 12 mils.
Claim 17
Dependent Claim
89 words
A package including: a circuit board; a set of circuit elements on the circuit board, the set of circuit elements including at least one integrated circuit and passive components; and a plastic material encasing the set of circuit elements and part of the circuit board, wherein one side of the circuit board includes a set of terminals that are accessible from the side of the package, the set of terminals being positioned away from the edge of the circuit board; and wherein the package is a flash EEPROM package.
Claim 18
Dependent Claim
89 words
A package including: a circuit board; a set of circuit elements on the circuit board, the set of circuit elements including at least one integrated circuit and passive components; and a plastic material encasing the set of circuit elements and part of the circuit board, wherein one side of the circuit board includes a set of terminals that are accessible from the side of the package, the set of terminals being positioned away from the edge of the circuit board; and wherein the package is a flash EEPROM package.
Claim 19
Dependent Claim
14 words
The package of claim 15, wherein one side of the circuit board is exposed.
Claim 20
Dependent Claim
28 words
The package of claim 16, wherein the exposed side of the circuit board material includes the set of terminals connected to the remainder of the circuit by vias.
Claim 21
Dependent Claim
18 words
The package of claim 15, wherein the circuit board material is attached to the packaging material by epoxy.
Claim 22
Dependent Claim
21 words
The package of claim 15, wherein on the exposed side of the circuit board only the set of terminals is exposed.
Claim 23
Dependent Claim
16 words
The package of claim 15, wherein the thickness of the package is less than 12 mils.
Claim 24
Dependent Claim
80 words
A completed non-volatile memory package for use with a host device, comprising: a circuit board; at least one IC attached to the circuit board, including an array of flash EEPROM cells; terminals which are included in a side of the circuit board and positioned away from an edge of the circuit board; and packaging material surrounding the at least one IC, and part of the circuit board, but not the terminals, whereby the terminals are exposed in the completed package.
Claim 25
Dependent Claim
80 words
A completed non-volatile memory package for use with a host device, comprising: a circuit board; at least one IC attached to the circuit board, including an array of flash EEPROM cells; terminals which are included in a side of the circuit board and positioned away from an edge of the circuit board; and packaging material surrounding the at least one IC, and part of the circuit board, but not the terminals, whereby the terminals are exposed in the completed package.
Claim 26
Dependent Claim
23 words
The package of claim 21, wherein a size of the non-volatile memory package is 11/4 inches long by 7/8 of an inch wide.
Claim 27
Dependent Claim
18 words
The package of claim 22, wherein a thickness of the non-volatile memory package is less than 12 mils.
Claim 28
Dependent Claim
81 words
A completed non-volatile memory package for use with a host device, comprising: a circuit board having a first side and a second side; a row of terminals provided on the first side of the circuit board; an IC electrically connected with the terminals, the IC being provided on the second side of the circuit board; and packaging material encapsulating the IC and part of the second side of the circuit board, wherein the IC includes an array of flash EEPROM cells.
Claim 29
Dependent Claim
81 words
A completed non-volatile memory package for use with a host device, comprising: a circuit board having a first side and a second side; a row of terminals provided on the first side of the circuit board; an IC electrically connected with the terminals, the IC being provided on the second side of the circuit board; and packaging material encapsulating the IC and part of the second side of the circuit board, wherein the IC includes an array of flash EEPROM cells.
Claim 30
Dependent Claim
23 words
The package of claim 24, wherein a size of the non-volatile memory package is 11/4 inches long by 7/8 of an inch wide.
Claim 31
Dependent Claim
18 words
The package of claim 25, wherein a thickness of the non-volatile memory package is less than 12 mils.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-03-21 | 2003-09-20 | 2004-03-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-03-21 | 2007-09-20 | 2008-03-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-03-21 | 2011-09-20 | 2012-03-21 | $7700.00 | Window Closed / Lapsed |