US6037665A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Mounting assembly of integrated circuit device and method for production thereof
Assignee: NEC Corp
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Filing: 1998-03-02
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Granted: 2000-03-14
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Expires: 2018-03-02
Abstract
Abstract A mounting assembly of an integrated circuit device includes an integrated circuit device having pads on its lower side, through holes formed in a mounting substrate at positions opposed to the pads of the integrated circuit device, and solders for connecting the pads of the integrated circuit device with the through holes. An electrode is provided on the inside wall of each through hole, and the mounting substrate includes therein wirings connected to the electrodes. The solder is filled into the through holes to such an extent that the solder filled in the through holes can be visually checked from the lower side of the substrate.
Inventors
- 👤 Hirokazu Miyazaki
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-02 19:28
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/62; H10W70/63; H10W70/635; H10W72/00; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/251; H10W72/252; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
212 words
A mounting assembly comprising: an integrated circuit device having a plurality of input/output terminals on one side thereof; a substrate for mounting said integrated circuit device; a plurality of through-holes provided in said substrate at positions corresponding to said plurality of input/output terminals of said integrated circuit device; a plurality of connecting members connecting said integrated circuit device to said substrate, wherein each of said plurality of connecting members extends from a respective one of said plurality of input/output terminals directly into a respective one of said plurality of through-holes to substantially occupy a respective through hole, and wherein each of said plurality of connecting members is electrically conductive; and a plurality of electrodes, wherein each of said plurality of electrodes is provided in a respective one of said plurality of through-holes, wherein wires provided in said substrate are connected to each of said plurality of electrodes, wherein an inner circumferential surface of each of said plurality of electrodes is in contact with a respective one of said plurality of connecting members, wherein an outer circumferential surface of each of said plurality of electrodes is in contact with an inner surface of said through-holes, and wherein said wires are connected to said outer circumferential surface of each of said plurality of electrodes.
Claim 2
Dependent Claim
212 words
A mounting assembly comprising: an integrated circuit device having a plurality of input/output terminals on one side thereof; a substrate for mounting said integrated circuit device; a plurality of through-holes provided in said substrate at positions corresponding to said plurality of input/output terminals of said integrated circuit device; a plurality of connecting members connecting said integrated circuit device to said substrate, wherein each of said plurality of connecting members extends from a respective one of said plurality of input/output terminals directly into a respective one of said plurality of through-holes to substantially occupy a respective through hole, and wherein each of said plurality of connecting members is electrically conductive; and a plurality of electrodes, wherein each of said plurality of electrodes is provided in a respective one of said plurality of through-holes, wherein wires provided in said substrate are connected to each of said plurality of electrodes, wherein an inner circumferential surface of each of said plurality of electrodes is in contact with a respective one of said plurality of connecting members, wherein an outer circumferential surface of each of said plurality of electrodes is in contact with an inner surface of said through-holes, and wherein said wires are connected to said outer circumferential surface of each of said plurality of electrodes.
Claim 3
Dependent Claim
19 words
A mounting assembly as claimed in claim 1, further comprising terminals provided on said substrate connected to said wires.
Claim 4
Dependent Claim
17 words
A mounting assembly as claimed in claim 2, wherein said terminals are arranged in a lattice pattern.
Claim 5
Dependent Claim
18 words
A mounting assembly as claimed in claim 1, wherein each of said plurality of connecting members comprises solder.
Claim 6
Dependent Claim
21 words
A mounting assembly as claimed in claim 1, wherein each of said plurality of connecting members comprises an electrically conductive resin.
Claim 7
Dependent Claim
24 words
A mounting assembly as claim in claim 1, wherein said substrates has an outside size not greater than that of said integrated circuit device.
Claim 8
Dependent Claim
47 words
A mounting assembly as claimed in claim 1, wherein a portion of each of said plurality of connecting members projects from a respective through-hole at a second side of said substrate opposite to a first side of said substrate on which said integrated circuit device is mounted.
Claim 9
Dependent Claim
64 words
A mounting assembly as claimed in claim 1, wherein a portion of each of said plurality of connecting members projects from a respective through-hole at a second side of said substrate opposite to a first side of said substrate on which said integrated circuit device is mounted, and wherein each of the portions projecting from a respective through-hole is used as a connecting terminal.
Claim 10
Dependent Claim
239 words
A mounting assembly comprising: an integrated circuit device having a plurality of input/output terminals on a side; a substrate for mounting said integrated circuit device; a plurality of through-holes provided in said substrate at positions opposite a respective one of said plurality of input/output terminals of said integrated circuit device, said through-holes extending from a proximal side of said substrate adjacent to said respective one of said plurality of input/output terminals of said integrated circuit device to a distal substrate side located opposite to said proximal side of said substrate; a plurality of connecting members extending from a respective one of said input/output terminals of said integrated circuit device directly into a respective one of said plurality of through-holes to substantially occupy a respective through hole, wherein each of said plurality of connecting members is electrically conductive; and a plurality of electrodes, wherein each of said plurality of electrodes covers an inside surface of a respective one of said through-holes, wherein wires provided in said substrate are connected to each of said plurality of electrodes, wherein an inner circumferential surface of each of said plurality of electrodes is in contact with a respective one of said plurality of connecting members and an outer circumferential surface of each of said plurality of electrodes is in contact with an inner surface of said through-holes, and wherein said wires are connected to said electrode at said outer circumferential surface of said electrode.
Claim 11
Dependent Claim
239 words
A mounting assembly comprising: an integrated circuit device having a plurality of input/output terminals on a side; a substrate for mounting said integrated circuit device; a plurality of through-holes provided in said substrate at positions opposite a respective one of said plurality of input/output terminals of said integrated circuit device, said through-holes extending from a proximal side of said substrate adjacent to said respective one of said plurality of input/output terminals of said integrated circuit device to a distal substrate side located opposite to said proximal side of said substrate; a plurality of connecting members extending from a respective one of said input/output terminals of said integrated circuit device directly into a respective one of said plurality of through-holes to substantially occupy a respective through hole, wherein each of said plurality of connecting members is electrically conductive; and a plurality of electrodes, wherein each of said plurality of electrodes covers an inside surface of a respective one of said through-holes, wherein wires provided in said substrate are connected to each of said plurality of electrodes, wherein an inner circumferential surface of each of said plurality of electrodes is in contact with a respective one of said plurality of connecting members and an outer circumferential surface of each of said plurality of electrodes is in contact with an inner surface of said through-holes, and wherein said wires are connected to said electrode at said outer circumferential surface of said electrode.
Claim 12
Dependent Claim
53 words
A mounting assembly as claimed in claim 9, wherein each of said plurality of connecting members extends from a respective one of said plurality of said input/output terminals of said integrated circuit device to a portion of a respective one of said plurality of through-holes disposed at said distal side of said substrate.
Claim 13
Dependent Claim
43 words
A mounting assembly as claimed in claim 9, wherein each of said plurality of connecting members extends from a respective one of said plurality of said input/output terminals of said integrated circuit device to a point beyond said distal side of said substrate.
Claim 14
Dependent Claim
25 words
A mounting assembly as claimed in claim 9, wherein each of said plurality of connecting members fill a respective one of said plurality of through-holes.
Claim 15
Dependent Claim
18 words
A mounting assembly as claimed in claim 9, wherein each of said plurality of connecting members comprises solder.
Claim 16
Dependent Claim
21 words
A mounting assembly as claimed in claim 9, wherein each of said plurality of connecting members comprises an electrically conductive resin.
Claim 17
Dependent Claim
41 words
A mounting assembly as claimed in claim 9, wherein a surface of each of said plurality of connecting members in contact with a respective one of said plurality of input/output terminals is substantially coplanar with a corresponding surface of said substrate.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-03-14 | 2003-09-13 | 2004-03-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-03-14 | 2007-09-13 | 2008-03-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-03-14 | 2011-09-13 | 2012-03-14 | $7700.00 | Window Closed / Lapsed |