EP0735579A1
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EP
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Structure and method of coupling substrates
Assignee: Motorola Solutions Inc
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Filing: 1996-03-04
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Granted: —
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Expires: 2016-03-04
Abstract
Abstract A flip-chip structure and method connects a semiconductor chip (11) having conductive bumps (16) to a substrate (12) having vias (19) extending from a first side (21) to a second side (18) of the substrate (12). A filler material (22) is deposited into the vias (19), and the conductive bumps (16) are inserted into the vias (19) for connecting the semiconductor chip (11) to a conductive element (17) covering the vias (19) on the second side (18) of the substrate (12).
Inventors
- 👤 Jack A. Schroeder
- 👤 Conrad S. Monroe
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 23:44
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W72/00; H10W72/01; H10W72/012; H10W72/01221; H10W72/01225; H10W72/071; H10W72/072; H10W72/07231; H10W72/07236; H10W72/20; H10W72/251; H10W72/252; H10W90/00; H10W90/701; H10W90/721; H10W90/724
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
120 words
A method of coupling substrates, the method comprising: providing a first substrate (11) having a conductive bump (16); providing a second substrate (12) having a via (19) extending from a first side (21) of the second substrate (12) to a second side (18) of the second substrate (12) and wherein a conductive element (17) on the second side (18) of the second substrate (12) covers at least part of the via (19) on the second side (18) of the second substrate (12); depositing a filler material (22) in the via (19); and electrically coupling the first substrate (11) with the second substrate (12) by inserting the conductive bump (16) into the via (19) to couple to the conductive element (17).
Claim 2
Dependent Claim
96 words
A substrate structure comprising: a first substrate (12) having a via (19) extending from a first side (21) of the first substrate (12) to a second side (18) of the first substrate (12); a conductive element (17) on the second side (18) of the first substrate (12) covering at least part of the via (19) on the second side (18) of the first substrate (12); a second substrate (11) containing a conductive bump (16) disposed in the via (19) to electrically couple with the conductive element (17); and a filler material (22) in the via (19).
Claim 3
Dependent Claim
33 words
The substrate structure of claim 2 wherein the first substrate (12) is selected from the group consisting of an insulating substrate, a packaged semiconductor chip, an unpackaged semiconductor chip, and a discrete device.
Claim 4
Dependent Claim
33 words
The substrate structure of claim 3 wherein the second substrate (11) is selected from the group consisting of an insulating substrate, a packaged semiconductor chip, an unpackaged semiconductor chip, and a discrete device.
Claim 5
Dependent Claim
29 words
The substrate structure of claim 2 wherein the filler material (22) is selected from the group consisting of a conductive epoxy, a non-conductive epoxy, a resin, and a solder.
Claim 6
Dependent Claim
16 words
The substrate structure of claim 2 wherein the conductive bump (16) comprises a wire bond bump.
Claim 7
Dependent Claim
147 words
A flip-chip structure comprising: an insulating substrate (12) having a via (19) extending from a first side (21) of the insulating substrate (12) to a second side (18) of the insulating substrate (12); a conductive element (17) on the second side (18) of the insulating substrate (12) covering at least part of the via (19) on the second side (18) of the insulating substrate (12); a first surface (13) of a semiconductor chip (11) facing the first side (21) of the insulating substrate (12); a semiconductor device (23) on the first surface (13) of the semiconductor chip (11); a wire bond bump (16) on the first surface (13) of the semiconductor chip (11) electrically coupling the semiconductor device (23) through the via (19) on the first side (21) of the insulating substrate (12) to the conductive element (17); and a conductive epoxy (22) in the via (19).
Claim 8
Dependent Claim
13 words
The flip-chip structure of claim 7 wherein the conductive element (17) comprises copper.
Claim 9
Dependent Claim
13 words
The flip-chip structure of claim 8 wherein the insulating substrate (12) comprises polyimide.
Claim 10
Dependent Claim
16 words
The flip-chip structure of claim 8 wherein the insulating substrate (12) comprises glass cloth and epoxy.
References Cited (Backward Citations)
WO1991011833A1
Cited
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