Abstract A semiconductor package has a controlling IC attached to a die pad using an epoxy molding compound (EMC) pad. The EMC pad is formed so as to be slightly larger than the controlling IC. EMC pads are cut from an EMC pad pattern which is formed from a predetermined number of EMC tablets. The EMC pad pattern is molded by heating and pressing the EMC tablets into a wafer shape having a thickness of approximately 0.3 mm and a diameter of approximately 100 mm. Such a thin EMC pad is capable of providing sufficient dielectric strength, and allows for manufacturing of semiconductor packages at lower cost. In addition, conventional equipment can be used to fabricate the semiconductor packages. The packages are flexible, and even a thin package is not easily broken.
A semiconductor package structure comprising: a power semiconductor chip mounted on a die pad using a conductive adhesive material; an epoxy molded compound (EMC) pad attached to said die pad using a first insulating adhesive material; and a controlling integrated circuit chip mounted on said EMC pad using a second insulating adhesive material, wherein the epoxy molded compound has a predetermined resilience to protect the controlling integrated circuit chip against an external impact, and wherein the EMC pad is a single rigid pad.
Claim 2
Dependent Claim
83 words
A semiconductor package structure comprising: a power semiconductor chip mounted on a die pad using a conductive adhesive material; an epoxy molded compound (EMC) pad attached to said die pad using a first insulating adhesive material; and a controlling integrated circuit chip mounted on said EMC pad using a second insulating adhesive material, wherein the epoxy molded compound has a predetermined resilience to protect the controlling integrated circuit chip against an external impact, and wherein the EMC pad is a single rigid pad.
Claim 3
Dependent Claim
16 words
The semiconductor package structure according to claim 1, wherein said first semiconductor chip comprises a MOSFET.
Claim 4
Dependent Claim
19 words
The semiconductor package structure according to claim 1, wherein said first and said second insulating materials comprise an epoxy.
Claim 5
Dependent Claim
19 words
The semiconductor package structure according to claim 1, wherein said EMC pad is larger than said second semiconductor chip.
Claim 6
Dependent Claim
25 words
The semiconductor package structure according to claim 4, wherein said EMC pad is larger than said second semiconductor chip by 1 mm on all sides.