Material of forming silicon oxide film, silicon oxide film, method of forming silicon oxide film and semiconductor element

Claim 1

A method for forming a silicon oxide film, which comprises the steps of; forming a resin layer by coating a material of forming silicon oxide film comprising a polymer containing a repeating unit represented by the following general formula (1A), (1B) or (1C) on a substrate, and by heat-treating said material of forming silicon oxide film coated on said substrate; and heating said resin layer at a temperature ranging from 250° C. to the glass transition point of said material of forming silicon oxide film; ##STR48## wherein R 1 is a substituent group which can be eliminated at a temperature ranging from 250° C. to the glass transition point of said material of forming silicon oxide film; and R 2 is a substituent group which cannot be eliminated at a temperature of 250° C. or more.

Claim 2

A method for forming a silicon oxide film, which comprises the steps of; forming a resin layer by coating a material of forming silicon oxide film comprising a polymer containing a repeating unit represented by the following general formula (1A), (1B) or (1C) on a substrate, and by heat-treating said material of forming silicon oxide film coated on said substrate; and heating said resin layer at a temperature ranging from 250° C. to the glass transition point of said material of forming silicon oxide film; ##STR48## wherein R 1 is a substituent group which can be eliminated at a temperature ranging from 250° C. to the glass transition point of said material of forming silicon oxide film; and R 2 is a substituent group which cannot be eliminated at a temperature of 250° C. or more.

Claim 4

A method for forming a silicon oxide film, which comprises the steps of; forming a resin layer by coating a material of forming silicon oxide film comprising a polymer containing a repeating unit represented by the following general formula (2A), (2B) or (2C) on a substrate, and by heat-treating said material of forming silicon oxide film coated on said substrate; and heating said resin layer at a temperature ranging from 250° C. to the glass transition point of said material of forming silicon oxide film; ##STR49## wherein R 21 is a substituent group which can be eliminated at a temperature ranging from 250° C. to the glass transition point of said material of forming silicon oxide film; R 22 is a substituent group which cannot be eliminated at a temperature of 250° C. or more; and R 23 is hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aromatic group.

Claim 5

A method for forming a silicon oxide film, which comprises the steps of; forming a resin layer by coating a material of forming silicon oxide film comprising a polymer containing a repeating unit represented by the following general formula (2A), (2B) or (2C) on a substrate, and by heat-treating said material of forming silicon oxide film coated on said substrate; and heating said resin layer at a temperature ranging from 250° C. to the glass transition point of said material of forming silicon oxide film; ##STR49## wherein R 21 is a substituent group which can be eliminated at a temperature ranging from 250° C. to the glass transition point of said material of forming silicon oxide film; R 22 is a substituent group which cannot be eliminated at a temperature of 250° C. or more; and R 23 is hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aromatic group.