US6012967A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Polishing method and polishing apparatus
Assignee: Panasonic Holdings Corp
•
Filing: 1997-11-26
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Granted: 2000-01-11
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Expires: 2017-11-26
Abstract
Abstract A rotatable platen has a polishing pad adhered to the top surface thereof. A carrier for holding a substrate and a slurry supply pipe for supplying an abrasive slurry onto the near-center region of the polishing pad are provided above the polishing pad. Two lamps for partially irradiating the surface of the polishing pad with visible light or infrared light are provided at respective locations above the polishing pad and upstream of the carrier in the direction of rotation of the platen. Of the area of the polishing pad in contact with the substrate, a region closer to the center of rotation of the polishing pad and a region farther away therefrom are heated by the two lamps.
Inventors
- 👤 Mitsunari Satake
- 👤 Mikio Nishio
- 👤 Tomoyasu Murakami
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 14:57
CPC Classifications
B; B24; B24B; B24B37/00; B24B37/005; B24B37/015; H; H10; H10P; H10P95/00; B24B37/04; B24B37/07; B24B37/10; B24B37/105; B24B37/107; B24B37/34; B24B49/00; B24B49/14; B24B57/00; B24B57/02; H10P52/00; H10P52/40; H10P52/403; H10P95/06; H10P95/062
Claims Analysis
Total Claims: 44
Claim 1
Independent Claim
108 words
A polishing method comprising: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad heating step of heating, of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface, a specified region in contact with a portion of said target surface being polished at a low speed relative to another portion of said target surface.
Claim 2
Dependent Claim
108 words
A polishing method comprising: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad heating step of heating, of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface, a specified region in contact with a portion of said target surface being polished at a low speed relative to another portion of said target surface.
Claim 3
Dependent Claim
135 words
A polishing method comprising: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad heating step of heating, of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface, a specified region which is at least one of a first region closer to a center of rotation of said polishing pad than a central axis of said target surface and a second region farther away from the center of rotation of said polishing pad than a central axis of said target surface.
Claim 4
Dependent Claim
135 words
A polishing method comprising: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad heating step of heating, of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface, a specified region which is at least one of a first region closer to a center of rotation of said polishing pad than a central axis of said target surface and a second region farther away from the center of rotation of said polishing pad than a central axis of said target surface.
Claim 5
Dependent Claim
107 words
A polishing method comprising: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad heating step of measuring a surface temperature of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface and heating a specified region of said contact area having a low surface temperature relative to another region of said contact area.
Claim 6
Dependent Claim
107 words
A polishing method comprising: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad heating step of measuring a surface temperature of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface and heating a specified region of said contact area having a low surface temperature relative to another region of said contact area.
Claim 7
Dependent Claim
41 words
A polishing method according to any one of claims 1 to 3, wherein said polishing pad heating step includes the step of irradiating said specified region with light, an electromagnetic wave, or a laser beam and thereby heating said specified region.
Claim 8
Dependent Claim
35 words
A polishing method according to any one of claims 1 to 3, wherein said polishing pad heating step includes the step of spraying high-temperature gas onto said specified region and thereby heating said specified region.
Claim 9
Dependent Claim
39 words
A polishing method according to any one of claims 1 to 3, wherein said polishing pad heating step includes the step of bringing a high-temperature solid member into contact with said specified region and thereby heating said specified region.
Claim 10
Dependent Claim
41 words
A polishing method according to any one of claims 1 to 3, wherein said polishing pad heating step includes the step of pressing a pressing solid member against said specified region to generate frictional heat and thereby heating said specified region.
Claim 11
Dependent Claim
37 words
A polishing method according to any one of claims 1 to 3, wherein said polishing pad heating step includes the step of supplying a high-temperature abrasive slurry to said specified region and thereby heating said specified region.
Claim 12
Dependent Claim
108 words
A polishing method comprising: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad cooling step of cooling, of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface, a specified region in contact with a portion of said target surface being polished at a high speed relative to another portion of said target surface.
Claim 13
Dependent Claim
108 words
A polishing method comprising: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad cooling step of cooling, of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface, a specified region in contact with a portion of said target surface being polished at a high speed relative to another portion of said target surface.
Claim 14
Dependent Claim
132 words
A polishing method comprising polishing: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad cooling step of cooling, of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface, a third region located between a first region closer to a center of rotation of said polishing pad than a central axis of said target surface and a second region farther away from the center of rotation of said polishing pad than a central axis of said target surface.
Claim 15
Dependent Claim
132 words
A polishing method comprising polishing: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad cooling step of cooling, of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface, a third region located between a first region closer to a center of rotation of said polishing pad than a central axis of said target surface and a second region farther away from the center of rotation of said polishing pad than a central axis of said target surface.
Claim 16
Dependent Claim
106 words
A polishing method comprising: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad cooling step of measuring a surface temperature of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface and cooling a region of said contact area having a high surface temperature relative to another region of said contact area.
Claim 17
Dependent Claim
106 words
A polishing method comprising: polishing a target surface of a substrate to be polished by pressing said substrate against a surface of a polishing pad fixed on a rotating platen, while supplying an abrasive slurry onto said polishing pad, said method further comprising: a polishing pad cooling step of measuring a surface temperature of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad to polish said target surface and cooling a region of said contact area having a high surface temperature relative to another region of said contact area.
Claim 18
Dependent Claim
131 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from the polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; and polishing pad heating means for heating only a specified region of a contact area included in the surface of said polishing pad and brought in contact with said target surface with the rotation of said polishing pad, said specified region being in contact with a portion of said target surface being polished at a low speed relative to another portion of said target surface.
Claim 19
Dependent Claim
131 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from the polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; and polishing pad heating means for heating only a specified region of a contact area included in the surface of said polishing pad and brought in contact with said target surface with the rotation of said polishing pad, said specified region being in contact with a portion of said target surface being polished at a low speed relative to another portion of said target surface.
Claim 20
Dependent Claim
156 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from said polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; and polishing pad heating means for heating only a specified region of a contact area included in the surface of said polishing pad and brought in contact with said target surface with the rotation of said polishing pad, said specified region being at least one of a first region closer to a center of rotation of said polishing pad than a central axis of said target surface and a second region farther away from the center of rotation of said polishing pad than a central axis of said target surface.
Claim 21
Dependent Claim
156 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from said polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; and polishing pad heating means for heating only a specified region of a contact area included in the surface of said polishing pad and brought in contact with said target surface with the rotation of said polishing pad, said specified region being at least one of a first region closer to a center of rotation of said polishing pad than a central axis of said target surface and a second region farther away from the center of rotation of said polishing pad than a central axis of said target surface.
Claim 22
Dependent Claim
141 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from said polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; temperature measuring means for measuring a surface temperature of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad; and polishing pad heating means for heating only a specified region of said contact area in which the surface temperature of said polishing pad measured by said temperature measuring means is low relative to another region of said contact area.
Claim 23
Dependent Claim
141 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from said polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; temperature measuring means for measuring a surface temperature of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad; and polishing pad heating means for heating only a specified region of said contact area in which the surface temperature of said polishing pad measured by said temperature measuring means is low relative to another region of said contact area.
Claim 24
Dependent Claim
35 words
A polishing apparatus according to any one of claims 12 to 14, wherein said polishing pad heating means includes a plurality of polishing pad heating means arranged in a radial direction of said polishing pad.
Claim 25
Dependent Claim
28 words
A polishing apparatus according to any one of claims 12 to 14, wherein said polishing pad heating means is movable in a radial direction of said polishing pad.
Claim 26
Dependent Claim
46 words
A polishing apparatus according to any one of claims 12 to 14, wherein said polishing pad heating means heats a region of the contact area of said polishing pad to be subsequently brought in contact with said target surface with the rotation of said polishing pad.
Claim 27
Dependent Claim
39 words
A polishing apparatus according to any one of claims 12 to 14, wherein said polishing pad heating means is energy supplying means for supplying energy composed of light, an electromagnetic wave, or a laser beam to said specified region.
Claim 28
Dependent Claim
30 words
A polishing apparatus according to any one of claims 12 to 14, wherein said polishing pad heating means is high-temperature-gas spraying means for spraying high-temperature gas onto said specified region.
Claim 29
Dependent Claim
34 words
A polishing apparatus according to any one of claims 12 to 14, wherein said polishing pad heating means is high-temperature-solid-member contacting means for bringing a high-temperature solid member into contact with said specified region.
Claim 30
Dependent Claim
41 words
A polishing apparatus according to claim 20, wherein said high-temperature solid member is composed of metal and a surface portion of said high-temperature solid member in direct contact with said polishing pad is formed with a coating layer composed of polytetrafluoroethylene.
Claim 31
Dependent Claim
37 words
A polishing apparatus according to any one of claims 12 to 14, wherein said polishing pad heating means is pressing-solid-member pressing means for pressing a pressing solid member against said specified region and thereby generating frictional heat.
Claim 32
Dependent Claim
26 words
A polishing apparatus according to claim 22, wherein said pressing-solid-member pressing means presses said pressing solid member against said specified region by using a pressing fluid.
Claim 33
Dependent Claim
32 words
A polishing apparatus according to claim 22, wherein a surface portion of said pressing solid member in direct contact with said polishing pad is formed with a coating layer composed of polytetrafluoroethylene.
Claim 34
Dependent Claim
39 words
A polishing apparatus according to claim 22, wherein a portion of said pressing solid member in direct contact with said polishing pad is formed of the same material as a target film to be polished deposited on said substrate.
Claim 35
Dependent Claim
37 words
A polishing apparatus according to any one of claims 12 to 14, wherein said polishing pad heating means is high-temperature-slurry supplying means for supplying a high-temperature abrasive slurry from said slurry supply pipe to said specified region.
Claim 36
Dependent Claim
74 words
A polishing apparatus according to claim 14, further comprising a heating means control unit for reducing the degree of heating by said polishing pad heating means when the surface temperature of said polishing pad measured by said temperature measuring means is tending to increase, while increasing the degree of heating by said polishing pad heating means when the surface temperature of said polishing pad measured by said temperature measuring means is tending to decrease.
Claim 37
Dependent Claim
131 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from said polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; and polishing pad cooling means for cooling only a specified region of a contact area included in the surface of said polishing pad and brought in contact with said target surface with the rotation of said polishing pad, said specified region being in contact with a portion of said target surface being polished at a high speed relative to another portion of said target surface.
Claim 38
Dependent Claim
131 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from said polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; and polishing pad cooling means for cooling only a specified region of a contact area included in the surface of said polishing pad and brought in contact with said target surface with the rotation of said polishing pad, said specified region being in contact with a portion of said target surface being polished at a high speed relative to another portion of said target surface.
Claim 39
Dependent Claim
157 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from said polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; and polishing pad cooling means for cooling only a specified region of a contact area included in the surface of said polishing pad and brought in contact with said target surface with the rotation of said polishing pad, said specified region being a third region located between a first region closer to a center of rotation of said polishing pad than a central axis of said target surface and a second region farther away from the center of rotation of said polishing pad than a central axis of said target surface.
Claim 40
Dependent Claim
157 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from said polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; and polishing pad cooling means for cooling only a specified region of a contact area included in the surface of said polishing pad and brought in contact with said target surface with the rotation of said polishing pad, said specified region being a third region located between a first region closer to a center of rotation of said polishing pad than a central axis of said target surface and a second region farther away from the center of rotation of said polishing pad than a central axis of said target surface.
Claim 41
Dependent Claim
141 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from said polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; temperature measuring means for measuring a surface temperature of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad; and polishing pad cooling means for cooling only a specified region of said contact area in which the surface temperature of said polishing pad measured by said temperature measuring means is high relative to another region of said contact area.
Claim 42
Dependent Claim
141 words
A polishing apparatus comprising: a rotatable platen; a polishing pad fixed on said platen; a slurry supply pipe for supplying an abrasive slurry onto said polishing pad; substrate holding means for holding a substrate to be polished such that said substrate is movable toward and away from said polishing pad with a target surface of said substrate being opposed to a surface of said polishing pad; temperature measuring means for measuring a surface temperature of a contact area included in the surface of said polishing pad and brought into contact with said target surface with the rotation of said polishing pad; and polishing pad cooling means for cooling only a specified region of said contact area in which the surface temperature of said polishing pad measured by said temperature measuring means is high relative to another region of said contact area.
Claim 43
Dependent Claim
48 words
A polishing apparatus according to claim 14 or 30, wherein said temperature measuring means is a plurality of radiation thermometers arranged in a radial direction of said polishing pad, each of said radiation thermometers measuring the surface temperature at a point on said polishing pad without contact therewith.
Claim 44
Dependent Claim
46 words
A polishing apparatus according to claim 14 or 30, wherein said temperature measuring means measures the surface temperature of a region of the contact area of said polishing pad to be subsequently brought in contact with said target surface with the rotation of said polishing pad.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-01-10 | 2003-07-12 | 2004-01-11 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-01-10 | 2007-07-12 | 2008-01-11 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-01-10 | 2011-07-12 | 2012-01-11 | $7700.00 | Window Closed / Lapsed |