Patent US1821825A successfully refreshed from Google Patents.
Patent US6011696A successfully refreshed from Google Patents.
US6011696A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Cartridge and an enclosure for a semiconductor package
Assignee: Intel Corp
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Filing: 1998-05-28
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Granted: 2000-01-04
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Expires: 2018-05-28
Abstract
Abstract An electronic cartridge comprising a cartridge substrate, a package substrate, an integrated circuit, and an enclosure. The package substrate is mounted to the cartridge substrate. The integrated circuit is mounted to the package substrate. The enclosure encloses the integrated circuit, the package substrate and the cartridge substrate.
Inventors
- 👤 Ravi V. Mahajan
- 👤 Hong Xie
- 👤 Neil C. Delaplane
- 👤 Gregory A. James
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 16:37
CPC Classifications
H; H05; H05K; H05K5/00; H05K5/02; H05K5/0256; H05K5/026; H10; H10W; H10W40/00; H10W40/20; H10W40/22; H10W40/25; H10W40/255; H10W72/00; H10W72/851; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
79 words
A cartridge comprising: a semiconductor package including: a cartridge substrate; electrical contacts on the cartridge substrate; a package substrate mounted to the cartridge substrate; and an integrated circuit mounted to the package substrate; and an enclosure that encloses the semiconductor package, the enclosure having an opening over the electrical contacts and including first and second portions located on opposing sides of the semiconductor package and a third portion extending between the first and second portions past the semiconductor package.
Claim 2
Dependent Claim
79 words
A cartridge comprising: a semiconductor package including: a cartridge substrate; electrical contacts on the cartridge substrate; a package substrate mounted to the cartridge substrate; and an integrated circuit mounted to the package substrate; and an enclosure that encloses the semiconductor package, the enclosure having an opening over the electrical contacts and including first and second portions located on opposing sides of the semiconductor package and a third portion extending between the first and second portions past the semiconductor package.
Claim 3
Dependent Claim
33 words
The cartridge of claim 1 further comprising a circuit in a side of the integrated circuit facing the substrate, and an array of electrical connections between the integrated circuit and the package substrate.
Claim 4
Dependent Claim
12 words
The cartridge of claim 2 wherein the electrical connections are solder bumps.
Claim 5
Dependent Claim
36 words
The cartridge of claim 1 further comprising an electrical connection mounted to the cartridge substrate and extending through the opening, the electrical contacts being located on the electrical connection at a location externally of the enclosure.
Claim 6
Dependent Claim
22 words
The cartridge of claim 1 wherein the electrical contacts and the integrated circuit are located on opposing sides of the cartridge substrate.
Claim 7
Dependent Claim
21 words
The cartridge of claim 1 wherein opposing surfaces of the integrated circuit and the enclosure are thermally coupled to one another.
Claim 8
Dependent Claim
24 words
The cartridge of claim 6 further comprising a substance which thermally couples opposing surfaces of the integrated circuit and the enclosure to one another.
Claim 9
Dependent Claim
11 words
The cartridge of claim 7 wherein the substance is a grease.
Claim 10
Dependent Claim
34 words
The cartridge of claim 1 wherein the enclosure includes a recess fitting over the integrated circuit, and a shoulder portion which rests on the package substrate in an area next to the integrated circuit.
Claim 11
Dependent Claim
29 words
The cartridge of claim 1 wherein the enclosure is made of first and second layers of materials, the first material having a higher thermal conductivity than the second material.
Claim 12
Dependent Claim
15 words
The cartridge of claim 10 wherein one of the materials is plated on the other.
Claim 13
Dependent Claim
15 words
The cartridge of claim 11 wherein the second material is plated on the first material.
Claim 14
Dependent Claim
18 words
The cartridge of claim 12 wherein the second material is located on both sides of the first material.
Claim 15
Dependent Claim
11 words
The cartridge of claim 10 wherein the first material is copper.
Claim 16
Dependent Claim
11 words
The cartridge of claim 10 wherein the second material is nickel.
Claim 17
Dependent Claim
25 words
The cartridge of claim 1 wherein the enclosure includes two parts which are secured to one another to retain the semiconductor package within the enclosure.
Claim 18
Dependent Claim
25 words
The cartridge of claim 16 wherein the two parts are secured to one another by means of dimples and complementary projections located within the dimples.
Claim 19
Dependent Claim
136 words
An enclosure for a semiconductor package including a cartridge substrate, a package substrate mounted to the cartridge substrate, and an integrated circuit mounted on the package substrate, the enclosure comprising: a first part having a first portion having a recess for receiving the integrated circuit and a shoulder portion for resting on the package substrate in an area next to the integrated circuit, the first part in the first portion of the recess being made of first and second layers of materials, the first material having a higher thermal conductivity than the second material; and a second part which is securable to the first part so that the first and second parts jointly enclose the semiconductor package, the second part having a second portion located on a side of the semiconductor package opposing the first portion.
Claim 20
Dependent Claim
136 words
An enclosure for a semiconductor package including a cartridge substrate, a package substrate mounted to the cartridge substrate, and an integrated circuit mounted on the package substrate, the enclosure comprising: a first part having a first portion having a recess for receiving the integrated circuit and a shoulder portion for resting on the package substrate in an area next to the integrated circuit, the first part in the first portion of the recess being made of first and second layers of materials, the first material having a higher thermal conductivity than the second material; and a second part which is securable to the first part so that the first and second parts jointly enclose the semiconductor package, the second part having a second portion located on a side of the semiconductor package opposing the first portion.
Claim 21
Dependent Claim
81 words
A cartridge comprising: semiconductor package including: a cartridge substrate; a package substrate mounted to the cartridge substrate; and an integrated circuit mounted to the package substrate; and an enclosure that encloses the semiconductor package, the enclosure including first and second portions located on opposing sides of the semiconductor package and a third portion extending between the first and second portion past the semiconductor package, wherein opposing surfaces of the integrated circuit and the first portion are thermally coupled to one another.
Claim 22
Dependent Claim
81 words
A cartridge comprising: semiconductor package including: a cartridge substrate; a package substrate mounted to the cartridge substrate; and an integrated circuit mounted to the package substrate; and an enclosure that encloses the semiconductor package, the enclosure including first and second portions located on opposing sides of the semiconductor package and a third portion extending between the first and second portion past the semiconductor package, wherein opposing surfaces of the integrated circuit and the first portion are thermally coupled to one another.
References Cited (Backward Citations)
US5311402A
Cited
US5659458A
Cited
US5642261A
Cited
US5477933A
Cited
US5715144A
Cited
US5783870A
Cited
US5892245A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2003-01-03 | 2003-07-05 | 2004-01-04 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2007-01-03 | 2007-07-05 | 2008-01-04 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2011-01-03 | 2011-07-05 | 2012-01-04 | $7700.00 | Window Closed / Lapsed |