Heat dissipative means for integrated circuit chip package

Claim 1

Heat dissipative apparatus for an integrated circuit chip package mounted on a printed circuit substrate comprising in combination: (a) an integrated circuit chip and a chip carrier having a recess therein with respect to a side thereof for receiving said chip, said recess and said chip being sized so that when said chip is positioned within said recess a void space is defined between said chip and said carrier side; (b) a thermal conductive plate having a first side abutting said carrier side and closing off said recess; (c) thermal conductive material positioned in said void space and functioning to provide heat transfer from said chip to said plate; (d) a printed circuit substrate having first and second mutually parallel sides and a preselected thickness, said substrate having, on said first side, means for receiving and mounting said plate, said receiving and mounting means including a plurality of elongated thermal conductive members, each having (i) a head portion plannar with said first side, and (ii) an elongated body portion connected at one end to said head portion and having a longitudinal length greater than said preselected thickness of said substrate and said body portion of said thermal conductive member extending through one of a plurality of preselected holes in said substrate adjacent to and proximate to the body of said chip, said holes being located in accordance with a preselected pattern; and (e) thermal conductive means on said second side of said substrate for receiving a second end of said body portion of said elongated thermal conductive member; whereby heat may be conducted from said integrated chip, mounted as aforesaid, through said thermal conductive material, said thermal conductive plate, and through said elongated thermal conductive members to said second side of said substrate.