Patent US6002172A successfully refreshed from Google Patents.
US6002172A
Expired / Lapsed
US
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Substrate structure and method for improving attachment reliability of semiconductor chips and modules
Assignee: International Business Machines Corp
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Filing: 1997-03-12
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Granted: 1999-12-14
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Expires: 2017-03-12
Abstract
Abstract An adhesion pad for adhering a semiconductor chip or a ball grid array module to a supporting substrate includes a stepped or tapered structure. The structure is composed of at least one solder wettable metal or alloy layer having solder deposited thereon. The stepped or tapered structure prevents a fatigue crack from propagating in the X-Y plane above the adhesion pad.
Inventors
- 👤 Kishor V. Desai
- 👤 Amit K. Sarkhel
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 13:55
CPC Classifications
H; H05; H05K; H05K1/00; H05K1/02; H05K1/11; H05K1/111; H05K3/00; H05K3/30; H05K3/32; H05K3/34; H05K3/341; H05K3/3431; H05K3/3436; H10; H10W; H10W72/00; H10W72/071; H10W72/072; H05K1/112; H05K2201/00; H05K2201/09; H05K2201/09209; H05K2201/09372; H05K2201/09472; H05K2201/095; H05K2201/09509; H05K2201/09654; H05K2201/09736; H05K2201/09745; H05K2201/10; H05K2201/10613; H05K2201/10621; H05K2201/10734; H05K2201/10954; H05K2201/10992; H05K2203/00; H05K2203/04; H05K2203/041; H10W72/07231; H10W72/07236; H10W72/20; H10W72/221; H10W72/251; H10W72/252; H10W72/90; H10W72/951; H10W72/952; Y; Y02; Y02P; Y02P70/00; Y02P70/50
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
196 words
An adhesion pad for a substrate comprising: a first flat planar layer having a perimeter on said substrate; a second flat planar layer on said first flat planar layer disposed within said perimeter of said first flat planar layer to form at least one raised structure with a substantially vertical sidewall on said first flat planar layer, said first and second flat planar layers being wettable for directly contacting a mass of solder; said first flat planar layer and said second flat planar layer are substantially circular, each having a respective diameter, said diameter of said second flat planar layer is in the range of 30-70% of said diameter of said first flat planar layer, said first flat planar layer has a thickness at least 10% of said diameter of said first flat planar layer; said substrate is one of the group consisting of an organic chip carrier, a ceramic chip carrier, and an organic circuit board, and said thickness of said first flat planar layer is in the range of 33-41 μm (0.0013 to 0.0016 inches) and said second flat planar layer has a thickness in the range of 63-76 μm (0.0025 to 0.0030 inches).
Claim 2
Dependent Claim
196 words
An adhesion pad for a substrate comprising: a first flat planar layer having a perimeter on said substrate; a second flat planar layer on said first flat planar layer disposed within said perimeter of said first flat planar layer to form at least one raised structure with a substantially vertical sidewall on said first flat planar layer, said first and second flat planar layers being wettable for directly contacting a mass of solder; said first flat planar layer and said second flat planar layer are substantially circular, each having a respective diameter, said diameter of said second flat planar layer is in the range of 30-70% of said diameter of said first flat planar layer, said first flat planar layer has a thickness at least 10% of said diameter of said first flat planar layer; said substrate is one of the group consisting of an organic chip carrier, a ceramic chip carrier, and an organic circuit board, and said thickness of said first flat planar layer is in the range of 33-41 μm (0.0013 to 0.0016 inches) and said second flat planar layer has a thickness in the range of 63-76 μm (0.0025 to 0.0030 inches).
Claim 3
Dependent Claim
26 words
The adhesion pad according to claim 1, further comprising a mass of solder on said raised structure and a portion of said first flat planar layer.
Claim 4
Dependent Claim
45 words
The adhesion pad according to claim 1, wherein said first flat planar layer is one of a metal and an alloy and said second flat planar layer is one of a metal and an alloy, said first and second flat planar layers being solder wettable.
Claim 5
Dependent Claim
37 words
The adhesion pad according to claim 3, wherein said first flat planar layer and said second flat planar layer each comprise at least one of the group consisting of copper, cobalt, nickel, platinum, palladium, and alloys thereof.
Claim 6
Dependent Claim
21 words
The adhesion pad according to claim 1, wherein said second flat planar layer is concentric with said first flat planar layer.
Claim 7
Dependent Claim
21 words
The adhesion pad according to claim 1, wherein said second flat planar layer is eccentric with said first flat planar layer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-12-13 | 2003-06-14 | 2003-12-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-12-13 | 2007-06-14 | 2007-12-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-12-13 | 2011-06-14 | 2011-12-14 | $7700.00 | Window Closed / Lapsed |