Patent US5998241A successfully refreshed from Google Patents.
US5998241A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and method of manufacturing the same
Assignee: NEC Corp
•
Filing: 1998-12-08
•
Granted: 1999-12-07
•
Expires: 2018-12-08
Abstract
Abstract A semiconductor device includes a tape carrier, a semiconductor chip, a metal heat spreader, a support ring, and a projection, recess, and spot welding portion. The tape carrier includes a TAB tape. The semiconductor chip is mounted on the tape carrier. The metal heat spreader is fixed to a surface of the semiconductor chip opposite to the tape carrier to dissipate heat generated in the semiconductor chip. The heat spreader has a shape larger than that of the semiconductor chip. The support ring is arranged between the heat spreader and tape carrier and is adhered to the tape carrier. The support ring serves to ensure a predetermined gap between the heat spreader and the tape carrier and to prevent warp of the tape carrier. The projection, recess, and spot welding portion bond the heat spreader and reinforcing member to each other by employing one of mechanical engagement and fusion welding. A method of manufacturing a semiconductor device is also disclosed.
Inventors
- 👤 Kouichirou Niwa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 20:11
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W40/00; H10W40/10; H10W72/00; H10W72/701; H10W90/00; H10W90/701; H10W72/851; H10W72/874; H10W90/731; H10W90/736
Claims Analysis
Total Claims: 23
Claim 1
Independent Claim
133 words
A method of manufacturing a semiconductor device comprising: a tape carrier constituted by a TAB (Tape Automated Bonding) tape; a semiconductor chip mounted on said tape carrier; a metal heat spreader fixed to a surface of said semiconductor chip opposite to said tape carrier to dissipate heat generated in said semiconductor chip, said heat spreader having a shape larger than that of said semiconductor chip; and a reinforcing member arranged between said heat spreader and said tape carrier and adhered to said tape carrier, said reinforcing member serving to ensure a predetermined gap between said heat spreader and said tape carrier and to prevent warp of said tape carrier, comprising the step of bonding said heat spreader and said reinforcing member to each other by employing one of mechanical engagement and fusion welding.
Claim 2
Independent Claim
133 words
A method of manufacturing a semiconductor device comprising: a tape carrier constituted by a TAB (Tape Automated Bonding) tape; a semiconductor chip mounted on said tape carrier; a metal heat spreader fixed to a surface of said semiconductor chip opposite to said tape carrier to dissipate heat generated in said semiconductor chip, said heat spreader having a shape larger than that of said semiconductor chip; and a reinforcing member arranged between said heat spreader and said tape carrier and adhered to said tape carrier, said reinforcing member serving to ensure a predetermined gap between said heat spreader and said tape carrier and to prevent warp of said tape carrier, comprising the step of bonding said heat spreader and said reinforcing member to each other by employing one of mechanical engagement and fusion welding.
Claim 3
Dependent Claim
36 words
A method according to claim 1, wherein said reinforcing member is made of a metal, and the bonding step comprises the step of bonding said heat spreader and said reinforcing member to each other by caulking.
Claim 4
Dependent Claim
37 words
A method according to claim 1, wherein said reinforcing member is made of a metal, and the bonding step comprises the step of bonding said heat spreader and said reinforcing member to each other by spot welding.
Claim 5
Dependent Claim
67 words
A method according to claim 1, wherein said reinforcing member is made of a heat-resistant resin, said heat spreader has a projection, and the bonding step comprises the steps of bringing said heat spreader and said resin into contact with each other to bury said projection in said resin, and solidifying said resin to bond said heat spreader and reinforcing member to each other through said projection.
Claim 6
Independent Claim
102 words
A method of manufacturing a semiconductor device comprising: a tape carrier constituted by a TAB (Tape Automated Bonding) tape; a semiconductor chip mounted on said tape carrier; and a metal heat spreader fixed to a surface of said semiconductor chip opposite to said tape carrier to dissipate heat generated in said semiconductor chip, said heat spreader having a shape larger than that of said semiconductor chip, comprising the steps of bending an edge of said heat spreader, and bonding a bent portion and said tape carrier to each other to ensure a predetermined gap between said heat spreader and said tape carrier.
Claim 7
Independent Claim
102 words
A method of manufacturing a semiconductor device comprising: a tape carrier constituted by a TAB (Tape Automated Bonding) tape; a semiconductor chip mounted on said tape carrier; and a metal heat spreader fixed to a surface of said semiconductor chip opposite to said tape carrier to dissipate heat generated in said semiconductor chip, said heat spreader having a shape larger than that of said semiconductor chip, comprising the steps of bending an edge of said heat spreader, and bonding a bent portion and said tape carrier to each other to ensure a predetermined gap between said heat spreader and said tape carrier.
Claim 8
Dependent Claim
28 words
A method according to claim 5, wherein the bending step comprises the step of bending said edge of said heat spreader toward said semiconductor chip through about 180°.
Claim 9
Dependent Claim
20 words
A method according to claim 5, wherein the bending step comprises the step of forming a gap between bent portions.
Claim 10
Dependent Claim
129 words
A semiconductor device comprising: a tape carrier constituted by a TAB (Tape Automated Bonding) tape; a semiconductor chip mounted on said tape carrier; a metal heat spreader fixed on a surface of said semiconductor chip opposite to said tape carrier to dissipate heat generated in said semiconductor chip, said heat spreader having a shape larger than that of said semiconductor chip; a reinforcing member arranged between said heat spreader and said tape carrier and adhered to said tape carrier, said reinforcing member serving to ensure a predetermined gap between said heat spreader and said tape carrier and to prevent warp of said tape carrier; and a bonding structure for bonding said heat spreader and said reinforcing member to each other by employing one of mechanical engagement and fusion welding.
Claim 11
Dependent Claim
129 words
A semiconductor device comprising: a tape carrier constituted by a TAB (Tape Automated Bonding) tape; a semiconductor chip mounted on said tape carrier; a metal heat spreader fixed on a surface of said semiconductor chip opposite to said tape carrier to dissipate heat generated in said semiconductor chip, said heat spreader having a shape larger than that of said semiconductor chip; a reinforcing member arranged between said heat spreader and said tape carrier and adhered to said tape carrier, said reinforcing member serving to ensure a predetermined gap between said heat spreader and said tape carrier and to prevent warp of said tape carrier; and a bonding structure for bonding said heat spreader and said reinforcing member to each other by employing one of mechanical engagement and fusion welding.
Claim 12
Dependent Claim
48 words
A semiconductor device according to claim 8, wherein said bonding structure comprises an engaging projection formed on one of said heat spreader and said reinforcing member, and an engaging recess formed in the other of said heat spreader and said reinforcing member to fit on said engaging projection.
Claim 13
Dependent Claim
15 words
A semiconductor device according to claim 9, wherein said engaging recess comprises an engaging hole.
Claim 14
Dependent Claim
42 words
A semiconductor device according to claim 9, wherein said engaging recess comprises a through hole, and said engaging projection has a length larger than a thickness of one of said heat spreader and said reinforcing member where said through hole is formed.
Claim 15
Dependent Claim
36 words
A semiconductor device according to claim 1, wherein said reinforcing member is made of a metal, and said bonding structure comprises a welding portion that fusion-welds said heat spreader and said reinforcing member by spot welding.
Claim 16
Dependent Claim
61 words
A semiconductor device according to claim 1, wherein said reinforcing member is made of a heat-resistant resin, said bonding structure has a projection formed on said heat spreader, and said projection is buried in said resin, and said resin is solidified while being in contact with said heat spreader, thereby bonding said reinforcing member and said heat spreader to each other.
Claim 17
Dependent Claim
106 words
A semiconductor device comprising: a tape carrier constituted by a TAB (Tape Automated Bonding) tape; a semiconductor chip mounted on said tape carrier; a metal heat spreader fixed to a surface of said semiconductor chip opposite to said tape carrier to dissipate heat generated in said semiconductor chip, said heat spreader having a shape larger than that of said semiconductor chip; and a reinforcing portion constituted by a peripheral portion of said heat spreader which is bent toward said tape carrier, said reinforcing portion serving to ensure a predetermined gap between said heat spreader and said tape carrier and to prevent warp of said tape carrier.
Claim 18
Dependent Claim
106 words
A semiconductor device comprising: a tape carrier constituted by a TAB (Tape Automated Bonding) tape; a semiconductor chip mounted on said tape carrier; a metal heat spreader fixed to a surface of said semiconductor chip opposite to said tape carrier to dissipate heat generated in said semiconductor chip, said heat spreader having a shape larger than that of said semiconductor chip; and a reinforcing portion constituted by a peripheral portion of said heat spreader which is bent toward said tape carrier, said reinforcing portion serving to ensure a predetermined gap between said heat spreader and said tape carrier and to prevent warp of said tape carrier.
Claim 19
Dependent Claim
36 words
A semiconductor device according to claim 14, wherein said reinforcing portion is constituted by said peripheral portion of said heat spreader which is bent from a tape carrier side toward said semiconductor chip through about 180°.
Claim 20
Dependent Claim
34 words
A semiconductor device according to claim 14, wherein said reinforcing portion is constituted by said peripheral portion of said heat spreader which is bent toward said tape carrier to have an S-shaped/inverted S-shaped section.
Claim 21
Dependent Claim
41 words
A semiconductor device according to claim 14, wherein said reinforcing portion is constituted by said peripheral portion of said heat spreader which is bent toward said tape carrier to have a section in a shape of number 9 or inverted 9.
Claim 22
Dependent Claim
33 words
A semiconductor device according to claim 14, wherein said reinforcing portion is constituted by said peripheral portion of said heat spreader which is bent toward said tape carrier to have an O-shaped section.
Claim 23
Dependent Claim
44 words
A semiconductor device according to claim 14, wherein said reinforcing portion is constituted by a plurality of bent portions formed by bending said peripheral portion of said heat spreader at a plurality of portions, and adjacent ones of said bent portions form a gap.
References Cited (Backward Citations)
US4843808A
Cited
US5016084A
Cited
US5244838A
Cited
US5492866A
Cited
US5474957A
Cited
US5786239A
Cited
JPH0997856A
Cited
JPH09199631A
Cited
US5877042A
Cited
US5909056A
Cited
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-12-06 | 2003-06-07 | 2003-12-07 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-12-06 | 2007-06-07 | 2007-12-07 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-12-06 | 2011-06-07 | 2011-12-07 | $7700.00 | Window Closed / Lapsed |