US5989995A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor device and wire bonding method therefor
Assignee: Shinkawa Ltd
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Filing: 1997-12-29
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Granted: 1999-11-23
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Expires: 2017-12-29
Abstract
Abstract A semiconductor device including a bonded wire that connects a first bonding point and a second bonding point and has a linear portion in the top area thereof, the linear portion being bent or depressed down, thus having a high shape-retaining strength.
Inventors
- 👤 Shinichi Nishiura
- 👤 Tooru Mochida
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 02:23
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/071; H10W72/075; H10W72/50; H10W72/0711; H10W72/07141; H10W72/07521; H10W72/07531; H10W72/07532; H10W72/07533; H10W72/07551; H10W72/07553; H10W72/531; H10W72/536; H10W72/5363; H10W72/5366; H10W72/90; H10W72/951; H10W74/00; H10W90/00; H10W90/701; H10W90/751; H10W90/754; H10W90/756
Claims Analysis
Total Claims: 7
Claim 1
Independent Claim
134 words
A wire bonding method in which a first bonding point and a second bonding point are connected by a wire, said method comprising the steps of: connecting said wire to said first bonding point; performing a first reverse operation in which a capillary is raised slightly and is then moved slightly in an opposite direction from said second bonding point; performing at least one second reverse operation in which said capillary is raised, after which said capillary is moved slightly toward said second bonding point, and is then raised and moved in an opposite direction from said second bonding point; and performing a process in which said capillary is raised delivering said wire, after which said capillary is moved toward said second bonding point and said wire is connected to said second bonding point.
Claim 2
Dependent Claim
134 words
A wire bonding method in which a first bonding point and a second bonding point are connected by a wire, said method comprising the steps of: connecting said wire to said first bonding point; performing a first reverse operation in which a capillary is raised slightly and is then moved slightly in an opposite direction from said second bonding point; performing at least one second reverse operation in which said capillary is raised, after which said capillary is moved slightly toward said second bonding point, and is then raised and moved in an opposite direction from said second bonding point; and performing a process in which said capillary is raised delivering said wire, after which said capillary is moved toward said second bonding point and said wire is connected to said second bonding point.
Claim 3
Dependent Claim
36 words
A semiconductor device comprising a wire loop which connects a first bonding point and a second bonding point, and at least one downward depression formed in a linear portion at a top of the wire loop.
Claim 4
Dependent Claim
36 words
A semiconductor device comprising a wire loop which connects a first bonding point and a second bonding point, and at least one downward depression formed in a linear portion at a top of the wire loop.
Claim 5
Dependent Claim
19 words
The semiconductor device according to claim 2, wherein two of said downward depressions are formed in said wire loop.
Claim 6
Dependent Claim
51 words
A semiconductor device wherein a wire loop which connects a first bonding point and a second bonding point is of a trapezoidal loop shape, and a kink is formed in a trapezoidal length portion of said trapezoidal loop shape such that said trapezoidal length portion is formed with a downward depression.
Claim 7
Dependent Claim
51 words
A semiconductor device wherein a wire loop which connects a first bonding point and a second bonding point is of a trapezoidal loop shape, and a kink is formed in a trapezoidal length portion of said trapezoidal loop shape such that said trapezoidal length portion is formed with a downward depression.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-11-22 | 2003-05-24 | 2003-11-23 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-11-22 | 2007-05-24 | 2007-11-23 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-11-22 | 2011-05-24 | 2011-11-23 | $7700.00 | Window Closed / Lapsed |