US4932584A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Method of wire bonding
Assignee: Shinkawa Ltd
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Filing: 1989-01-31
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Granted: 1990-06-12
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Expires: 2009-01-31
Abstract
Abstract A wire bonding method for connecting a first bonding point and a second bonding point via a wire including the steps of first connecting the wire to the first bonding point, raising a capillary slightly and moving it slightly away from the second bonding point, raising the capillary further by an amount sufficient for forming the wire loop with the wire being played out, moving the capillary over the second bonding point along a circular track which has a radius sufficient for forming the wire loop, and connecting the wire to the second bonding point.
Inventors
- 👤 Nobuto Yamazaki
- 👤 Takeshi Hasegawa
- 👤 Junkichi Enomoto
- 👤 Yoshimitsu Terakado
- 👤 Shinichi Kumazawa
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-10 02:20
CPC Classifications
B; B23; B23K; B23K20/00; B23K20/002; B23K20/004; B23K20/005; B23K20/007; H; H10; H10W; H10W72/00; H10W72/071; H10W72/0711; H10W72/07141; H10W72/075; H10W72/07521; H10W72/50; H10W72/531; H10W72/536; H10W72/5363
Claims Analysis
Total Claims: 4
Claim 1
Independent Claim
182 words
A method of wire bonding for connecting a first bonding point and a second bonding point via a wire, said method comprising the steps of: connecting said wire to said first bonding point; vertically raising a capillary slightly and then stopping for an instant; moving said capillary slightly in a horizontal direction opposite the direction of said second bonding point and then stopping for an instant; further vertically raising said capillary by an amount less than an amount sufficient for formation of a wire loop which would reach said second bonding point with said wire being played out; further raising said capillary by another amount equal to a remainder of said amount sufficient for formation of said wire loop with said wire being played out while moving said capillary to a point directly above said first bonding point; clamping said wire so that said wire cannot play out of said capillary; moving said capillary over said second bonding point along a circular track which has a radius sufficient for forming said wire loop; and connecting said wire to said second bonding point.
Claim 2
Independent Claim
182 words
A method of wire bonding for connecting a first bonding point and a second bonding point via a wire, said method comprising the steps of: connecting said wire to said first bonding point; vertically raising a capillary slightly and then stopping for an instant; moving said capillary slightly in a horizontal direction opposite the direction of said second bonding point and then stopping for an instant; further vertically raising said capillary by an amount less than an amount sufficient for formation of a wire loop which would reach said second bonding point with said wire being played out; further raising said capillary by another amount equal to a remainder of said amount sufficient for formation of said wire loop with said wire being played out while moving said capillary to a point directly above said first bonding point; clamping said wire so that said wire cannot play out of said capillary; moving said capillary over said second bonding point along a circular track which has a radius sufficient for forming said wire loop; and connecting said wire to said second bonding point.
Claim 3
Dependent Claim
53 words
A method of wire bonding according to claim 1, wherein said amount sufficient for formation of said wire loop is equal to ##EQU2## wherein M is a height difference between said first and second bonding points, N is a loop height and L is a distance between said first and second bonding points.
Claim 4
Dependent Claim
33 words
A method according to claim 1, wherein said amount less than an amount sufficient to form a wire loop is equal to one half of said amount sufficient to form a wire loop.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 1993-06-11 | 1993-12-11 | 1994-06-12 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 1997-06-11 | 1997-12-11 | 1998-06-12 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2001-06-11 | 2001-12-11 | 2002-06-12 | $7700.00 | Window Closed / Lapsed |