Claims Analysis
Total Claims: 16
Claim 1
Independent Claim
96 words
A production method for a solid state imaging device comprising: a resist coating step of coating light receiving portions formed on a semiconductor substrate with a lens resin; a patterning step of making the lens resin into desired patterns so as to form lens patterns; and a lens forming step of forming micro lenses for collecting light on the light receiving portions by heating the lens patterns, wherein the lens forming step includes a step of forming the micro lenses at a temperature lower than a temperature at which the lens patterns are substantially completely melted.
Claim 2
Dependent Claim
96 words
A production method for a solid state imaging device comprising: a resist coating step of coating light receiving portions formed on a semiconductor substrate with a lens resin; a patterning step of making the lens resin into desired patterns so as to form lens patterns; and a lens forming step of forming micro lenses for collecting light on the light receiving portions by heating the lens patterns, wherein the lens forming step includes a step of forming the micro lenses at a temperature lower than a temperature at which the lens patterns are substantially completely melted.
Claim 3
Dependent Claim
48 words
The production method for a solid state imaging device of claim 1, wherein the lens forming step includes a step of forming the micro lenses so as not to change a distance between the adjacent lens patterns and a distance between the adjacent micro lenses to be formed.
Claim 4
Dependent Claim
57 words
The production method for a solid state imaging device of claim 1, wherein the resist coating step includes a step of coating the lens resin in a thickness larger than a half of a shorter side of a bottom in the shape of a rectangle of each micro lens to be formed in the lens forming step.
Claim 5
Dependent Claim
95 words
A production method for a solid state imaging device comprising: an insulating film forming step of forming an insulating film on a semiconductor substrate, the semiconductor substrate having light receiving portions and having recesses in areas where the light receiving portions are formed; and a flattening layer forming step of forming a flattening layer on the insulating film for flattening a surface of the insulating film, wherein the flattening layer forming step includes a step of forming the flattening layer out of a material having a larger refractive index than that of the insulating film.
Claim 6
Dependent Claim
95 words
A production method for a solid state imaging device comprising: an insulating film forming step of forming an insulating film on a semiconductor substrate, the semiconductor substrate having light receiving portions and having recesses in areas where the light receiving portions are formed; and a flattening layer forming step of forming a flattening layer on the insulating film for flattening a surface of the insulating film, wherein the flattening layer forming step includes a step of forming the flattening layer out of a material having a larger refractive index than that of the insulating film.
Claim 7
Dependent Claim
176 words
A production method for a solid state imaging device comprising: an insulating film forming step of forming an insulating film on a semiconductor substrate, the semiconductor substrate having light receiving portions and having recesses in areas where the light receiving portions are formed; a flattening layer forming step of forming a flattening layer on the insulating film for flattening a surface of the insulating film; a resist coating step of coating the light receiving portions with a lens resin; a patterning step of making the lens resin into desired patterns so as to form lens patterns; and a lens forming step of forming micro lenses for collecting light on the light receiving portions by heating the lens patterns, wherein the flattening layer forming step includes a step of forming the flattening layer out of a material having a larger refractive index than that of the insulating film, and the lens forming step includes a step of forming the micro lenses at a temperature lower than a temperature at which the lens patterns are substantially completely melted.
Claim 8
Dependent Claim
176 words
A production method for a solid state imaging device comprising: an insulating film forming step of forming an insulating film on a semiconductor substrate, the semiconductor substrate having light receiving portions and having recesses in areas where the light receiving portions are formed; a flattening layer forming step of forming a flattening layer on the insulating film for flattening a surface of the insulating film; a resist coating step of coating the light receiving portions with a lens resin; a patterning step of making the lens resin into desired patterns so as to form lens patterns; and a lens forming step of forming micro lenses for collecting light on the light receiving portions by heating the lens patterns, wherein the flattening layer forming step includes a step of forming the flattening layer out of a material having a larger refractive index than that of the insulating film, and the lens forming step includes a step of forming the micro lenses at a temperature lower than a temperature at which the lens patterns are substantially completely melted.
Claim 9
Dependent Claim
48 words
The production method for a solid state imaging device of claim 5, wherein the lens forming step includes a step of forming the micro lenses so as not to change a distance between the adjacent lens patterns and a distance between the adjacent micro lenses to be formed.
Claim 10
Dependent Claim
57 words
The production method for a solid state imaging device of claim 5, wherein the resist coating step includes a step of coating the lens resin in a thickness larger than a half of a shorter side of a bottom in the shape of a rectangle of each micro lens to be formed in the lens forming step.
Claim 11
Dependent Claim
123 words
A production method for a solid state imaging device comprising: an insulating film forming step of forming an insulating film on a semiconductor substrate, the semiconductor substrate having light receiving portions and having recesses in areas where the light receiving portions are formed; and a flattening layer forming step of forming a flattening layer on the insulating film for flattening a surface of the insulating film, wherein the flattening layer forming step includes a step of forming the flattening layer out of a material which has a larger refractive index than that of the insulating film and is melted into a liquid state through a heat treatment, so as to melt the material by heating, thereby flattening a surface of the flattening layer.
Claim 12
Dependent Claim
123 words
A production method for a solid state imaging device comprising: an insulating film forming step of forming an insulating film on a semiconductor substrate, the semiconductor substrate having light receiving portions and having recesses in areas where the light receiving portions are formed; and a flattening layer forming step of forming a flattening layer on the insulating film for flattening a surface of the insulating film, wherein the flattening layer forming step includes a step of forming the flattening layer out of a material which has a larger refractive index than that of the insulating film and is melted into a liquid state through a heat treatment, so as to melt the material by heating, thereby flattening a surface of the flattening layer.
Claim 13
Dependent Claim
204 words
A production method for a solid state imaging device comprising: an insulating film forming step of forming an insulating film on a semiconductor substrate, the semiconductor substrate having light receiving portions and having recesses in areas where the light receiving portions are formed; a flattening layer forming step of forming a flattening layer on the insulating film for flattening a surface of the insulating film; a resist coating step of coating the light receiving portions with a lens resin; a patterning step of making the lens resin into desired patterns so as to form lens patterns; and a lens forming step of forming micro lenses for collecting light on the light receiving portions by heating the lens patterns, wherein the flattening layer forming step includes a step of forming the flattening layer out of a material which has a larger refractive index than that of the insulating film and is melted into a liquid state through a heat treatment, so as to melt the material by heating, thereby flattening a surface of the flattening layer, and the lens forming step includes a step of forming the micro lenses at a temperature lower than a temperature at which the lens patterns are substantially completely melted.
Claim 14
Dependent Claim
204 words
A production method for a solid state imaging device comprising: an insulating film forming step of forming an insulating film on a semiconductor substrate, the semiconductor substrate having light receiving portions and having recesses in areas where the light receiving portions are formed; a flattening layer forming step of forming a flattening layer on the insulating film for flattening a surface of the insulating film; a resist coating step of coating the light receiving portions with a lens resin; a patterning step of making the lens resin into desired patterns so as to form lens patterns; and a lens forming step of forming micro lenses for collecting light on the light receiving portions by heating the lens patterns, wherein the flattening layer forming step includes a step of forming the flattening layer out of a material which has a larger refractive index than that of the insulating film and is melted into a liquid state through a heat treatment, so as to melt the material by heating, thereby flattening a surface of the flattening layer, and the lens forming step includes a step of forming the micro lenses at a temperature lower than a temperature at which the lens patterns are substantially completely melted.
Claim 15
Dependent Claim
48 words
The production method for a solid state imaging device of claim 9, wherein the lens forming step includes a step of forming the micro lenses so as not to change a distance between the adjacent lens patterns and a distance between the adjacent micro lenses to be formed.
Claim 16
Dependent Claim
57 words
The production method for a solid state imaging device of claim 9, wherein the resist coating step includes a step of coating the lens resin in a thickness larger than a half of a shorter side of a bottom in the shape of a rectangle of each micro lens to be formed in the lens forming step.