Patent US5959353A successfully refreshed from Google Patents.
US5959353A
Expired / Lapsed
US
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Semiconductor device
Assignee: Mitsubishi Electric Corp
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Filing: 1998-04-27
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Granted: 1999-09-28
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Expires: 2018-04-27
Abstract
Abstract A semiconductor device includes a plastic substrate with a multilayer structure having electrically conductive lines and an embedded planar metal layer, a semiconductor chip having electrodes connected to respective lines by solder, and a sealing member of a synthetic resin adhering the semiconductor chip tightly to the plastic substrate.
Inventors
- 👤 Yoshihiro Tomita
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-09 21:00
CPC Classifications
H; H10; H10W; H10W42/00; H10W72/00; H10W72/30; H10W74/00; H10W74/01; H10W74/012; H10W74/10; H10W74/15; H10W76/00; H10W76/60; H10W72/071; H10W72/072; H10W72/073; H10W72/851; H10W72/853; H10W72/856; H10W72/874; H10W72/877; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 5
Claim 1
Independent Claim
126 words
A semiconductor device comprising: a plastic substrate with a multilayer structure having plural electrically conductive lines, containing a planar metal layer, and having a surface; a solder resist film disposed on the surface of the plastic substrate to control wetting of the electrically conductive lines by solder; a semiconductor chip having plural electrodes respectively connected to corresponding electrically conductive lines by solder; and a sealing member of a synthetic resin adhering to the solder resist film whereby the semiconductor chip is tightly urged toward the plastic substrate, wherein the solder resist film has a roughened undulating surface reinforcing adhesion to the sealing member and the planar metal layer is embedded within the plastic substrate for preventing moisture from penetrating through the substrate to the sealing member.
Claim 2
Dependent Claim
126 words
A semiconductor device comprising: a plastic substrate with a multilayer structure having plural electrically conductive lines, containing a planar metal layer, and having a surface; a solder resist film disposed on the surface of the plastic substrate to control wetting of the electrically conductive lines by solder; a semiconductor chip having plural electrodes respectively connected to corresponding electrically conductive lines by solder; and a sealing member of a synthetic resin adhering to the solder resist film whereby the semiconductor chip is tightly urged toward the plastic substrate, wherein the solder resist film has a roughened undulating surface reinforcing adhesion to the sealing member and the planar metal layer is embedded within the plastic substrate for preventing moisture from penetrating through the substrate to the sealing member.
Claim 3
Dependent Claim
17 words
The semiconductor device of claim 1, wherein the planar metal layer is disposed opposite the semiconductor chip.
Claim 4
Dependent Claim
14 words
The semiconductor device of claim 2, wherein the planar metal layer is a plate.
Claim 5
Dependent Claim
14 words
The semiconductor device of claim 2, wherein the planar metal layer is a mesh.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-27 | 2003-03-29 | 2003-09-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-27 | 2007-03-29 | 2007-09-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-27 | 2011-03-29 | 2011-09-28 | $7700.00 | Window Closed / Lapsed |