US5957648A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Factory automation apparatus and method for handling, moving and storing semiconductor wafer carriers
Assignee: Applied Materials Inc
•
Filing: 1996-12-11
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Granted: 1999-09-28
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Expires: 2016-12-11
Abstract
Abstract An improved apparatus and method is provided for handling, moving and storing semiconductor wafer carriers. The apparatus comprises two physically separate load ports, each coupled to a vertical transfer mechanism. Coupled between the two vertical transfer mechanisms is a horizontal transfer mechanism which extends above the footprint of the fabrication tool to which wafers are to be supplied. In a preferred embodiment the horizontal transfer mechanism comprises a bi-level conveyor comprised of a series of dual compartment segments. The dual compartment segments are coupled such that they may shift between a neutral and a positive position while maintaining a continuous movement channel between the two vertical transfer mechanisms. In this manner a wafer carrier may be placed within a first compartment of a neutrally positioned segment for movement; to store the wafer carrier the segment is shifted to the positive position. Thus a continuous movement channel comprised of the first or second compartments of a plurality of segments is maintained. The horizontal movement channel of a number of apparati may be interconnected to provide a local interconnection of fabrication tools.
Inventors
- 👤 Robert Z. Bachrach
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-03 10:43
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/30; H10P72/34; H10P72/3404; H10P72/32; H10P72/3216; H10P72/3218; H10P72/3222; Y; Y10; Y10S; Y10S414/00; Y10S414/135; Y10S414/139; Y10S414/14
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
169 words
An apparatus for buffering wafer carriers to be loaded to a fabrication tool comprising: a first load port adapted to receive a wafer carrier; a first vertical transfer mechanism disposed to elevate the wafer carrier from the first load port to a height greater than that of the fabrication tool; a horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the fabrication tool; a second vertical transfer mechanism operatively coupled to said horizontal transfer mechanism at a location above the fabrication tool and adapted to lower the wafer carrier from said horizontal transfer mechanism to a position for loading into the fabrication tool; and a second load port disposed to receive the wafer carrier from said second vertical transfer mechanism; wherein said horizontal transfer mechanism defines a path between said first vertical transfer mechanism and said second vertical transfer mechanism.
Claim 2
Independent Claim
169 words
An apparatus for buffering wafer carriers to be loaded to a fabrication tool comprising: a first load port adapted to receive a wafer carrier; a first vertical transfer mechanism disposed to elevate the wafer carrier from the first load port to a height greater than that of the fabrication tool; a horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the fabrication tool; a second vertical transfer mechanism operatively coupled to said horizontal transfer mechanism at a location above the fabrication tool and adapted to lower the wafer carrier from said horizontal transfer mechanism to a position for loading into the fabrication tool; and a second load port disposed to receive the wafer carrier from said second vertical transfer mechanism; wherein said horizontal transfer mechanism defines a path between said first vertical transfer mechanism and said second vertical transfer mechanism.
Claim 3
Dependent Claim
24 words
The apparatus of claim 1 wherein at least one of said first load port and said second load port comprises an E15 load port.
Claim 4
Dependent Claim
29 words
The apparatus of claim 1 wherein at least one of said first vertical transfer mechanism and said second vertical transfer mechanism is operatively coupled to an overhead load port.
Claim 5
Dependent Claim
35 words
The apparatus of claim 1 wherein the horizontal transfer mechanism comprises at least one extended portion adapted to connect to a remote apparatus for buffering wafer carriers to be loaded to a remote fabrication tool.
Claim 6
Dependent Claim
30 words
The apparatus of claim 1 wherein the first vertical transfer mechanism comprises an elevator, the second vertical transfer mechanism comprises an elevator, and the horizontal transfer mechanism comprises a conveyor.
Claim 7
Dependent Claim
22 words
The apparatus of claim 5 wherein the horizontal transfer mechanism comprises a bi-level conveyor having a first compartment and a second compartment.
Claim 8
Dependent Claim
17 words
The apparatus of claim 6 wherein the first and second compartments comprise a plurality of rolling mechanisms.
Claim 9
Dependent Claim
41 words
The apparatus of claim 6 wherein the horizontal transfer mechanism is configured so as to form a first region for moving the wafer carriers, a second region for shuttling empty conveyor compartments, and a third region for storing the wafer carriers.
Claim 10
Dependent Claim
19 words
The apparatus of claim 8 wherein the first region, the second region and the third region are vertically oriented.
Claim 11
Dependent Claim
19 words
The apparatus of claim 8 wherein the first region, the second region and the third region are horizontally oriented.
Claim 12
Dependent Claim
230 words
An automated local area semiconductor wafer fabrication system for automatically storing, loading and processing semiconductor wafers, comprising: a fabrication tool having at least a first load lock; a transfer chamber operatively coupled to said first load lock; and at least one process chamber operatively coupled to said transfer chamber; and an apparatus adapted to buffer wafer carriers to be loaded to the fabrication tool, said apparatus operatively coupled to said first load lock and comprising: a first load port adapted to receive a wafer carrier; a first vertical transfer mechanism disposed to elevate the wafer carrier from the first load port to a height greater than that of the fabrication tool; a horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the fabrication tool; a second vertical transfer mechanism operatively coupled to said horizontal transfer mechanism at a location above the fabrication tool and adapted to lower the wafer carrier from said horizontal transfer mechanism to a position for loading into the fabrication tool; and a second load port disposed to receive the wafer carrier from said second vertical transfer mechanism; wherein said horizontal transfer mechanism defines a path between said first vertical transfer mechanism and said second vertical transfer mechanism.
Claim 13
Dependent Claim
230 words
An automated local area semiconductor wafer fabrication system for automatically storing, loading and processing semiconductor wafers, comprising: a fabrication tool having at least a first load lock; a transfer chamber operatively coupled to said first load lock; and at least one process chamber operatively coupled to said transfer chamber; and an apparatus adapted to buffer wafer carriers to be loaded to the fabrication tool, said apparatus operatively coupled to said first load lock and comprising: a first load port adapted to receive a wafer carrier; a first vertical transfer mechanism disposed to elevate the wafer carrier from the first load port to a height greater than that of the fabrication tool; a horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the fabrication tool; a second vertical transfer mechanism operatively coupled to said horizontal transfer mechanism at a location above the fabrication tool and adapted to lower the wafer carrier from said horizontal transfer mechanism to a position for loading into the fabrication tool; and a second load port disposed to receive the wafer carrier from said second vertical transfer mechanism; wherein said horizontal transfer mechanism defines a path between said first vertical transfer mechanism and said second vertical transfer mechanism.
Claim 14
Dependent Claim
224 words
A factory automation system comprising: at least a first automated local area semiconductor wafer fabrication system comprising a fabrication tool comprising at least a first load lock; a transfer chamber operatively coupled to said first load lock; and at least one process chamber; and an apparatus adapted to buffer wafer carriers to be loaded to the fabrication tool, said apparatus operatively coupled to said first load lock and comprising: a first load port adapted to receive a wafer carrier; a first vertical transfer mechanism disposed to elevate the wafer carrier from the first load port to a height greater than that of the fabrication tool; a horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the fabrication tool; a second vertical transfer mechanism operatively coupled to said horizontal transfer mechanism at a location above the fabrication tool and adapted to lower the wafer carrier from said horizontal transfer mechanism to a position for loading into the fabrication tool; and a second load port disposed to receive the wafer carrier from said second vertical transfer mechanism; wherein said horizontal transfer mechanism defines a path between said first vertical transfer mechanism and said second vertical transfer mechanism.
Claim 15
Dependent Claim
224 words
A factory automation system comprising: at least a first automated local area semiconductor wafer fabrication system comprising a fabrication tool comprising at least a first load lock; a transfer chamber operatively coupled to said first load lock; and at least one process chamber; and an apparatus adapted to buffer wafer carriers to be loaded to the fabrication tool, said apparatus operatively coupled to said first load lock and comprising: a first load port adapted to receive a wafer carrier; a first vertical transfer mechanism disposed to elevate the wafer carrier from the first load port to a height greater than that of the fabrication tool; a horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the fabrication tool; a second vertical transfer mechanism operatively coupled to said horizontal transfer mechanism at a location above the fabrication tool and adapted to lower the wafer carrier from said horizontal transfer mechanism to a position for loading into the fabrication tool; and a second load port disposed to receive the wafer carrier from said second vertical transfer mechanism; wherein said horizontal transfer mechanism defines a path between said first vertical transfer mechanism and said second vertical transfer mechanism.
Claim 16
Dependent Claim
53 words
The apparatus of claim 12 further comprising a factory transfer system adapted to operatively coupled said first automated local area semiconductor wafer processing system to a remote second fabrication tool, so as to automatically transfer wafer carriers between said first automated local area semiconductor wafer processing system and the remote second fabrication tool.
Claim 17
Dependent Claim
351 words
A local interconnection of fabrication tools comprising: a first apparatus adapted to buffer wafer carriers to be loaded to a first fabrication tool comprising: a first load port adapted to receive a wafer carrier; a first vertical transfer mechanism disposed to elevate the wafer carrier to a height greater than that of the first fabrication tool; a first horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the first fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the first fabrication tool; a second vertical transfer mechanism operatively coupled to said first horizontal transfer mechanism at a location above the first fabrication tool and adapted to lower the wafer carrier from said first horizontal transfer mechanism to a position for loading into the first fabrication tool; and a second load port disposed to receive the wafer carrier from said second vertical transfer mechanism; and a second apparatus adapted to buffer wafer carriers to be loaded to a second fabrication tool comprising: a third load port adapted to receive a wafer carrier; a third vertical transfer mechanism disposed to elevate the wafer carrier from the third load port to a height greater than that of the second fabrication tool; a second horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the second fabrication tool, and adapted to transfer the wafer carrier from a first side of the second fabrication tool to a second side of the second fabrication tool; a fourth vertical transfer mechanism operatively coupled to said second horizontal transfer mechanism at a location above the second fabrication tool and adapted to lower the wafer carrier from said second horizontal transfer mechanism to a position for loading into the second fabrication tool; and a fourth load port disposed to receive the wafer carrier from said fourth vertical transfer mechanism; wherein said first horizontal transfer mechanism and said second horizontal transfer mechanism are operatively coupled via said first horizontal transfer mechanism and said second horizontal transfer mechanism.
Claim 18
Dependent Claim
351 words
A local interconnection of fabrication tools comprising: a first apparatus adapted to buffer wafer carriers to be loaded to a first fabrication tool comprising: a first load port adapted to receive a wafer carrier; a first vertical transfer mechanism disposed to elevate the wafer carrier to a height greater than that of the first fabrication tool; a first horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the first fabrication tool, and adapted to transfer the wafer carrier from a first side of the fabrication tool to a second side of the first fabrication tool; a second vertical transfer mechanism operatively coupled to said first horizontal transfer mechanism at a location above the first fabrication tool and adapted to lower the wafer carrier from said first horizontal transfer mechanism to a position for loading into the first fabrication tool; and a second load port disposed to receive the wafer carrier from said second vertical transfer mechanism; and a second apparatus adapted to buffer wafer carriers to be loaded to a second fabrication tool comprising: a third load port adapted to receive a wafer carrier; a third vertical transfer mechanism disposed to elevate the wafer carrier from the third load port to a height greater than that of the second fabrication tool; a second horizontal transfer mechanism operatively coupled to said first vertical transfer mechanism at a location above the second fabrication tool, and adapted to transfer the wafer carrier from a first side of the second fabrication tool to a second side of the second fabrication tool; a fourth vertical transfer mechanism operatively coupled to said second horizontal transfer mechanism at a location above the second fabrication tool and adapted to lower the wafer carrier from said second horizontal transfer mechanism to a position for loading into the second fabrication tool; and a fourth load port disposed to receive the wafer carrier from said fourth vertical transfer mechanism; wherein said first horizontal transfer mechanism and said second horizontal transfer mechanism are operatively coupled via said first horizontal transfer mechanism and said second horizontal transfer mechanism.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-27 | 2003-03-29 | 2003-09-28 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-27 | 2007-03-29 | 2007-09-28 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-27 | 2011-03-29 | 2011-09-28 | $7700.00 | Window Closed / Lapsed |