US5954997A
Expired / Lapsed
US
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Chemical mechanical polishing slurry useful for copper substrates
Assignee: CMC Materials LLC
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Filing: 1996-12-09
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Granted: 1999-09-21
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Expires: 2016-12-09
Abstract
Abstract A chemical mechanical polishing slurry comprising a film forming agent, an oxidizer, a complexing agent and an abrasive, and a method for using the chemical mechanical polishing slurry to remove copper alloy, titanium, and titanium nitride containing layers from a substrate.
Inventors
- 👤 Vlasta Brusic Kaufman
- 👤 Rodney C. Kistler
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-31 18:08
CPC Classifications
C; C23; C23F; C23F3/00; C23F3/04; C23F3/06; C09; C09G; C09G1/00; C09G1/02; H; H10; H10P; H10P52/00; H10P52/40; H10P52/403
Claims Analysis
Total Claims: 28
Claim 1
Independent Claim
57 words
A chemical mechanical polishing slurry comprising: alumina; at least one oxidizer; a complexing agent selected from the group consisting of compounds consisting of citric acid, lactic acid, tartaric acid, succinic acid, oxalic acid, amino acids, and salts thereof; and a film forming agent wherein the chemical mechanical polishing slurry has a pH of from 7.2 to 9.0.
Claim 2
Dependent Claim
57 words
A chemical mechanical polishing slurry comprising: alumina; at least one oxidizer; a complexing agent selected from the group consisting of compounds consisting of citric acid, lactic acid, tartaric acid, succinic acid, oxalic acid, amino acids, and salts thereof; and a film forming agent wherein the chemical mechanical polishing slurry has a pH of from 7.2 to 9.0.
Claim 3
Dependent Claim
15 words
The chemical mechanical polishing slurry of claim 1 wherein the complexing agent is ammonium oxalate.
Claim 4
Dependent Claim
25 words
The chemical mechanical polishing slurry of claim 2 wherein the ammonium oxalate is present in an amount ranging from 0.5 to about 3.0 weight percent.
Claim 5
Dependent Claim
15 words
The chemical mechanical polishing slurry of claim 1 wherein the film forming agent is benzotriazole.
Claim 6
Dependent Claim
18 words
The chemical mechanical polishing slurry of claim 4 including from about 0.01 to about 0.1 weight percent benzotriazole.
Claim 7
Dependent Claim
20 words
The chemical mechanical polishing slurry of claim 1 wherein the oxidizer is a compound that forms hydroxyl radicals upon reduction.
Claim 8
Dependent Claim
27 words
The chemical mechanical polishing slurry of claim 6 wherein the oxidizing agent is selected from the group consisting of hydrogen peroxide, urea hydrogen peroxide and combinations thereof.
Claim 9
Dependent Claim
26 words
The chemical mechanical polishing slurry of claim 7 wherein the hydrogen peroxide is present in an amount ranging from about 0.3 to about 12 weight percent.
Claim 10
Dependent Claim
66 words
A chemical mechanical polishing slurry comprising: alumina; an oxidizing agent selected from the group consisting of hydrogen peroxide, urea hydrogen peroxided, and mixtures thereof; a complexing agent selected from the group consisting of citric acid, lactic acid, tartaric acid, succinic acid, oxalic acids, amino acids, salts thereof, and mixtures thereof; and benzotriazole, wherein the chemical mechanical polishing slurry has a pH of from 7.2 to 9.0.
Claim 11
Dependent Claim
66 words
A chemical mechanical polishing slurry comprising: alumina; an oxidizing agent selected from the group consisting of hydrogen peroxide, urea hydrogen peroxided, and mixtures thereof; a complexing agent selected from the group consisting of citric acid, lactic acid, tartaric acid, succinic acid, oxalic acids, amino acids, salts thereof, and mixtures thereof; and benzotriazole, wherein the chemical mechanical polishing slurry has a pH of from 7.2 to 9.0.
Claim 12
Dependent Claim
87 words
A chemical mechanical polishing slurry comprising: from about 1.0 to about 15.0 weight percent of an alumina abrasive having a particle diameter less than 0.400 micron and a surface area ranging from about 10 m 2 /g to about 250 m 2 /g; from about 0.3 to about 12.0 weight percent hydrogen peroxide; from about 1.0 to about 3.0 weight percent ammonium oxalate; and from about 0.01 to about 0.2 weight percent benzotriazole, wherein the chemical mechanical polishing slurry has a pH of from 7.2 to 9.0.
Claim 13
Dependent Claim
87 words
A chemical mechanical polishing slurry comprising: from about 1.0 to about 15.0 weight percent of an alumina abrasive having a particle diameter less than 0.400 micron and a surface area ranging from about 10 m 2 /g to about 250 m 2 /g; from about 0.3 to about 12.0 weight percent hydrogen peroxide; from about 1.0 to about 3.0 weight percent ammonium oxalate; and from about 0.01 to about 0.2 weight percent benzotriazole, wherein the chemical mechanical polishing slurry has a pH of from 7.2 to 9.0.
Claim 14
Dependent Claim
13 words
The chemical mechanical polishing slurry of claim 9 including at least one surfactant.
Claim 15
Dependent Claim
28 words
The chemical mechanical polishing slurry of claim 9 wherein the complexing agent is selected from the group succinic acid, amino acids, lactic acid, salts thereof, and mixtures thereof.
Claim 16
Dependent Claim
15 words
The chemical mechanical polishing slurry of claim 9 wherein the complexing agent is ammonium oxalate.
Claim 17
Dependent Claim
16 words
The chemical mechanical polishing slurry of claim 13 wherein the oxidizing agent is urea hydrogen peroxide.
Claim 18
Dependent Claim
28 words
The chemical mechanical polishing slurry of claim 13 wherein ammonium oxalate is present in the slurry in an amount ranging from about 1.0 to about 3.0 weight percent.
Claim 19
Dependent Claim
28 words
The chemical mechanical polishing slurry of claim 13 wherein the benzotriazole is present in the slurry in an amount ranging from about 0.01 to about 0.2 weight percent.
Claim 20
Dependent Claim
15 words
The chemical mechanical polishing slurry of claim 13 wherein the oxidizing agent is hydrogen peroxide.
Claim 21
Dependent Claim
17 words
The chemical mechanical polishing slurry of claim 13 wherein the abrasive is at least one metal oxide.
Claim 22
Dependent Claim
19 words
The chemical mechanical polishing slurry of claim 13 wherein the abrasive is an aqueous dispersion of a metal oxide.
Claim 23
Dependent Claim
28 words
The chemical mechanical polishing slurry of claim 13 wherein the abrasive has a surface area ranging from about 5 m 2 /g to about 430 m 2 /g.
Claim 24
Dependent Claim
23 words
The chemical mechanical polishing slurry of claim 13 wherein the abrasive is selected from the group consisting of precipitated abrasives or fumed abrasives.
Claim 25
Dependent Claim
28 words
The chemical mechanical polishing slurry of claim 18 wherein the metal oxide abrasive is selected from the group including alumina, ceria, germania, silica, titania, zirconia, and mixtures thereof.
Claim 26
Dependent Claim
37 words
The chemical mechanical polishing slurry of claim 18 wherein the metal oxide abrasive consists of metal oxide aggregates having a size distribution less than about 1.0 micron and a mean aggregate diameter less than about 0.4 micron.
Claim 27
Dependent Claim
46 words
The chemical mechanical polishing slurry of claim 18 wherein the metal oxide abrasive consists of discrete, individual metal oxide spheres having a primary particle diameter less than 0.400 micron and a surface area ranging from about 10 m 2 /g to about 250 m 2 /g.
Claim 28
Dependent Claim
28 words
The chemical mechanical polishing slurry of claim 13 wherein the abrasive has a surface area of from about 30 m 2 /g to about 170 m 2 /g.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-09-20 | 2003-03-22 | 2003-09-21 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-09-20 | 2007-03-22 | 2007-09-21 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-09-20 | 2011-03-22 | 2011-09-21 | $7700.00 | Window Closed / Lapsed |