Claims Analysis
Total Claims: 20
Claim 1
Independent Claim
91 words
An apparatus for selectively exposing a semiconductor topography to an electric field, comprising: an electrically conductive plate having opposed upper and lower surfaces, wherein the lower surface includes a plurality of raised portions interposed among a plurality of recessed portions; and a voltage source adapted to produce an electrical voltage between the electrically conductive plate and the semiconductor topography adapted for being brought proximate the plurality of raised and recessed portions such that the electric field is formed between the conductive plate and the semiconductor topography, when the topography is present.
Claim 2
Independent Claim
91 words
An apparatus for selectively exposing a semiconductor topography to an electric field, comprising: an electrically conductive plate having opposed upper and lower surfaces, wherein the lower surface includes a plurality of raised portions interposed among a plurality of recessed portions; and a voltage source adapted to produce an electrical voltage between the electrically conductive plate and the semiconductor topography adapted for being brought proximate the plurality of raised and recessed portions such that the electric field is formed between the conductive plate and the semiconductor topography, when the topography is present.
Claim 3
Dependent Claim
29 words
The apparatus as recited in claim 1, wherein the lower surface of the conductive plate is adapted to be positioned above and in close proximity to the semiconductor topography.
Claim 4
Dependent Claim
14 words
The apparatus as recited in claim 1, wherein the electrically conductive plate comprises aluminum.
Claim 5
Dependent Claim
20 words
The apparatus as recited in claim 1, wherein the voltage source is adapted to produce an alternating current (a.c.) voltage.
Claim 6
Dependent Claim
20 words
The apparatus as recited in claim 1, wherein the voltage source is adapted to produce a direct current (d.c.) voltage.
Claim 7
Independent Claim
136 words
An apparatus for selectively exposing a semiconductor topography to an electric field, comprising: a first electrically conductive plate having opposed upper and lower surfaces, wherein the lower surface includes a plurality of raised portions interposed among a plurality of recessed portions; a second electrically conductive plate having opposed upper and lower surfaces, wherein the upper surface is adapted to electrically couple with the semiconductor topography adapted to be placed upon the second electrically conductive plate; a voltage source adapted to produce an electrical voltage between the first electrically conductive plate and the second electrically conductive plate; and wherein the semiconductor topography is adapted to be positioned proximate the plurality of raised and recessed portions of the first electrically conductive plate such that an electric field is formed between the first conductive plate and the semiconductor topography.
Claim 8
Independent Claim
136 words
An apparatus for selectively exposing a semiconductor topography to an electric field, comprising: a first electrically conductive plate having opposed upper and lower surfaces, wherein the lower surface includes a plurality of raised portions interposed among a plurality of recessed portions; a second electrically conductive plate having opposed upper and lower surfaces, wherein the upper surface is adapted to electrically couple with the semiconductor topography adapted to be placed upon the second electrically conductive plate; a voltage source adapted to produce an electrical voltage between the first electrically conductive plate and the second electrically conductive plate; and wherein the semiconductor topography is adapted to be positioned proximate the plurality of raised and recessed portions of the first electrically conductive plate such that an electric field is formed between the first conductive plate and the semiconductor topography.
Claim 9
Dependent Claim
31 words
The apparatus as recited in claim 6, wherein the lower surface of the conductive plate is adapted to be positioned above and in close proximity to the semiconductor topography when present.
Claim 10
Dependent Claim
14 words
The apparatus as recited in claim 6, wherein the electrically conductive plate comprises aluminum.
Claim 11
Dependent Claim
20 words
The apparatus as recited in claim 6, wherein the voltage source is adapted to produce a direct current (d.c.) voltage.
Claim 12
Dependent Claim
20 words
The apparatus as recited in claim 6, wherein the voltage source is adapted to produce an alternating current (a.c.) voltage.
Claim 13
Independent Claim
116 words
An apparatus for exposing a layer of a material formed upon a surface of a semiconductor substrate to an electric field, comprising: a plate having opposed upper and lower surfaces and comprising a plurality of electrically conductive structures arranged upon the lower surface; and a voltage source for applying an electrical voltage between a portion of the plurality of the electrically conductive structures and the semiconductor substrate; and wherein the semiconductor substrate is adapted to be positioned proximate the plurality of electrically conductive structures such that: (i) an electric field is formed between the portion of the plurality of electrically conductive structures and the semiconductor substrate, and (ii) the layer is exposed to the electric field.
Claim 14
Independent Claim
116 words
An apparatus for exposing a layer of a material formed upon a surface of a semiconductor substrate to an electric field, comprising: a plate having opposed upper and lower surfaces and comprising a plurality of electrically conductive structures arranged upon the lower surface; and a voltage source for applying an electrical voltage between a portion of the plurality of the electrically conductive structures and the semiconductor substrate; and wherein the semiconductor substrate is adapted to be positioned proximate the plurality of electrically conductive structures such that: (i) an electric field is formed between the portion of the plurality of electrically conductive structures and the semiconductor substrate, and (ii) the layer is exposed to the electric field.
Claim 15
Dependent Claim
39 words
The apparatus as recited in claim 11, wherein the lower surface of the plate is positioned above and in close proximity to the surface of the semiconductor substrate when the semiconductor substrate is positioned proximate the electrically conductive structures.
Claim 16
Dependent Claim
24 words
The apparatus as recited in claim 11, wherein the plurality of electrically conductive structures are electrically isolated from the plate and from each other.
Claim 17
Dependent Claim
29 words
The apparatus as recited in claim 13, wherein each of the plurality of electrically conductive structures are adapted to be operably coupled to a terminal of the voltage source.
Claim 18
Dependent Claim
47 words
The apparatus as recited in claim 11, wherein the voltage source comprises two terminals, and wherein the semiconductor substrate is adapted to be coupled to one terminal, and wherein each of the portion of the plurality of electrically conductive structures is operably coupled to the other terminal.
Claim 19
Dependent Claim
20 words
The apparatus as recited in claim 11, wherein the voltage source is adapted to produce a direct current (d.c.) voltage.
Claim 20
Dependent Claim
20 words
The apparatus as recited in claim 11, wherein the voltage source is adapted to produce an alternating current (a.c.) voltage.