Patent US5945741A successfully refreshed from Google Patents.
US5945741A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Semiconductor chip housing having a reinforcing plate
Assignee: Sony Corp
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Filing: 1997-03-05
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Granted: 1999-08-31
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Expires: 2017-03-05
Abstract
Abstract A semiconductor device employs interconnecting films on film circuit as ground lines which extend to the periphery of the film circuit where there is a further connection to a conductive reinforcing plate. Advantageously the conductive reinforcing plate reduces electrical noise from interfering with the semiconductor device and prevents the semiconductor device from radiating undesired signals. The interconnecting films also reduce cross-talk between signal lines of the semiconductor device.
Inventors
- 👤 Kenji Ohsawa
- 👤 Makoto Ito
- 👤 Yasushi Otsuka
- 👤 Kazuhiro Sato
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 08:30
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W70/00; H10W70/40; H10W70/453; H10W76/00; H10W76/40; H10W76/42; H10W76/47; H10W70/60; H10W70/62; H10W70/65; H10W70/654; H10W70/655; H10W70/67; H10W70/68; H10W70/682; H10W70/685; H10W72/071; H10W72/077
Claims Analysis
Total Claims: 14
Claim 1
Independent Claim
159 words
A semiconductor device comprising: a film circuit comprising a plurality of interconnecting films with an insulating base layer wherein a plurality of said interconnecting films has a semiconductor-chip side terminal each respectively connected to at least one electrode of a semiconductor chip and an external terminal is located on an opposite edge thereof of said films; a semiconductor chip having a plurality of electrodes connected to said semiconductor-chip side terminals of said interconnecting films; a ring-shaped electrically conductive reinforcing plate adhered to said film circuit surrounding said semiconductor chip, wherein a space between said reinforcing plate, said film circuit, and said semiconductor chip is sealed; said film circuit comprising an interconnecting film serving as a ground line; and said conductive reinforcing plate electrically connected with said interconnecting film and wherein a top portion of the reinforcing plate is connected to the ground line with an electrical connection that does not extend beneath a bottom surface of the reinforcing plate.
Claim 2
Dependent Claim
159 words
A semiconductor device comprising: a film circuit comprising a plurality of interconnecting films with an insulating base layer wherein a plurality of said interconnecting films has a semiconductor-chip side terminal each respectively connected to at least one electrode of a semiconductor chip and an external terminal is located on an opposite edge thereof of said films; a semiconductor chip having a plurality of electrodes connected to said semiconductor-chip side terminals of said interconnecting films; a ring-shaped electrically conductive reinforcing plate adhered to said film circuit surrounding said semiconductor chip, wherein a space between said reinforcing plate, said film circuit, and said semiconductor chip is sealed; said film circuit comprising an interconnecting film serving as a ground line; and said conductive reinforcing plate electrically connected with said interconnecting film and wherein a top portion of the reinforcing plate is connected to the ground line with an electrical connection that does not extend beneath a bottom surface of the reinforcing plate.
Claim 3
Dependent Claim
20 words
A semiconductor device according to claim 1, wherein a heat sink is adhered to a bottom of said semiconductor chip.
Claim 4
Dependent Claim
18 words
A semiconductor device according to claim 1, wherein said insulating base layer is made of a photosensitive material.
Claim 5
Dependent Claim
15 words
A semiconductor device according to claim 1, wherein said reinforcing plate is comprised of aluminum.
Claim 6
Dependent Claim
39 words
A semiconductor device according to claim 1, wherein at least a portion of said reinforcing plate protrudes from an edge of the film circuit and the protruding portion is electrically connected with said interconnecting film via a conductive paste.
Claim 7
Dependent Claim
25 words
A semiconductor device according to claim 1, wherein an external reinforcing ring is formed by said interconnecting film and is used as a ground line.
Claim 8
Dependent Claim
92 words
A semiconductor device comprising: a semiconductor chip; a conductive reinforcing plate adjacent to said semiconductor chip; a film circuit forming a plurality of leads located above a top surface of said reinforcing plate; and an electrical connection from a ground reference of said semiconductor chip to said reinforcing plate via a ground line which is one of said plurality of leads, and wherein a top portion of the reinforcing plate is connected to the ground line with an electrical connection that does not extend beneath a bottom surface of the reinforcing plate.
Claim 9
Dependent Claim
92 words
A semiconductor device comprising: a semiconductor chip; a conductive reinforcing plate adjacent to said semiconductor chip; a film circuit forming a plurality of leads located above a top surface of said reinforcing plate; and an electrical connection from a ground reference of said semiconductor chip to said reinforcing plate via a ground line which is one of said plurality of leads, and wherein a top portion of the reinforcing plate is connected to the ground line with an electrical connection that does not extend beneath a bottom surface of the reinforcing plate.
Claim 10
Dependent Claim
15 words
The semiconductor device of claim 7, wherein the conductive reinforcing plate surrounds the semiconductor chip.
Claim 11
Dependent Claim
35 words
The semiconductor device of claim 7, wherein at least one ground line forming a connection between the electrically conductive reinforcing plate and the ground reference of the semiconductor chip is located between two signal leads.
Claim 12
Dependent Claim
35 words
The semiconductor device of claim 9, wherein a plurality of ground lines forming electrical connections between the conductive reinforcing plate and the ground reference of the semiconductor chip are each located between two signal leads.
Claim 13
Dependent Claim
36 words
The semiconductor device of claim 1, wherein a top portion of the reinforcing plate is connected to the ground line with an electrical connection that does not extend below a top surface of the reinforcing plate.
Claim 14
Dependent Claim
36 words
The semiconductor device of claim 7, wherein a top portion of the reinforcing plate is connected to the ground line with an electrical connection that does not extend below a top surface of the reinforcing plate.
References Cited (Backward Citations)
USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-08-30 | 2003-03-01 | 2003-08-31 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-08-30 | 2007-03-01 | 2007-08-31 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-08-30 | 2011-03-01 | 2011-08-31 | $7700.00 | Window Closed / Lapsed |