US5942798A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Apparatus and method for automating the underfill of flip-chip devices
Assignee: STMicroelectronics lnc USA
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Filing: 1997-11-24
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Granted: 1999-08-24
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Expires: 2017-11-24
Abstract
Abstract An apparatus and method for underfilling a silicon chip (16) to a substrate (12) by depositing an underfill dam (18) on the surface (20) of the substrate (12) prior to addition of the underfill material (14), is disclosed. A bead of underfill material (14) is provided on the substrate (12) about the periphery of the silicon chip (16), within the underfill dam (18). The underfill material (14) fills the gap (22) between the electrical contacts, the substrate (12) and the silicon chip (16) by capillary action and differential pressure created by a vacuum system (40).
Inventors
- 👤 Anthony M. Chiu
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-11-08 18:00
CPC Classifications
H; H10; H10W; H10W74/00; H10W74/01; H10W74/012; H10W72/00; H10W72/01; H10W72/011; H10W72/0113; H10W74/10; H10W74/15; H10W72/013; H10W72/01308; H10W72/851; H10W72/853; H10W72/856; H10W90/00; H10W90/701; H10W90/721; H10W90/724; H10W90/731; H10W90/734
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
88 words
An integrated circuit package comprising: a substrate having a surface; a silicon chip electrically connected to the substrate, the space between the substrate surface and the silicon chip forming a gap; and an underfill dam disposed on the surface of the substrate spaced apart from the silicon chip, wherein the underfill dam is of sufficient height to prevent an amount of underfill sufficient to at least fill the gap from overflowing the underfill dam when deposited on the substrate surface between the underfill dam and the silicon chip.
Claim 2
Dependent Claim
88 words
An integrated circuit package comprising: a substrate having a surface; a silicon chip electrically connected to the substrate, the space between the substrate surface and the silicon chip forming a gap; and an underfill dam disposed on the surface of the substrate spaced apart from the silicon chip, wherein the underfill dam is of sufficient height to prevent an amount of underfill sufficient to at least fill the gap from overflowing the underfill dam when deposited on the substrate surface between the underfill dam and the silicon chip.
Claim 3
Dependent Claim
30 words
The integrated circuit package of claim 1 further comprising: an underfill material disposed in the gap formed in the space between the silicon chip and the surface of the substrate.
Claim 4
Dependent Claim
17 words
The integrated circuit package of claim 1 wherein the underfill dam is further defined as being epoxy.
Claim 5
Dependent Claim
17 words
The integrated circuit package of claim 1 wherein the underfill dam is further defined as being plastic.
Claim 6
Dependent Claim
24 words
The integrated circuit package of claim 1 wherein the underfill dam is disposed on substrate prior to attaching the silicon chip to the substrate.
Claim 7
Dependent Claim
15 words
The integrated circuit package of claim 2 wherein the underfill material is an epoxy resin.
Claim 8
Dependent Claim
104 words
An integrated circuit package comprising: a substrate having a surface and connection pads; a silicon chip electrically connected to the connection pads on the substrate, the space between the substrate surface and the silicon chip forming a gap; an underfill dam disposed on the surface of the substrate surrounding the silicon chip and forming an open reservoir for a liquid underfill polymer, wherein the underfill dam is of sufficient height to prevent an amount of liquid underfill polymer sufficient to at least fill the gap from overflowing the underfill dam when deposited on the substrate surface between the underfill dam and the silicon chip.
Claim 9
Dependent Claim
104 words
An integrated circuit package comprising: a substrate having a surface and connection pads; a silicon chip electrically connected to the connection pads on the substrate, the space between the substrate surface and the silicon chip forming a gap; an underfill dam disposed on the surface of the substrate surrounding the silicon chip and forming an open reservoir for a liquid underfill polymer, wherein the underfill dam is of sufficient height to prevent an amount of liquid underfill polymer sufficient to at least fill the gap from overflowing the underfill dam when deposited on the substrate surface between the underfill dam and the silicon chip.
Claim 10
Dependent Claim
19 words
The integrated circuit package of claim 7 wherein the underfill dam is further defined as being a thermo-setting epoxy.
Claim 11
Dependent Claim
19 words
The integrated circuit package of claim 7 wherein the underfill dam is further defined as being a thermal plastic.
Claim 12
Dependent Claim
25 words
The integrated circuit package of claim 7 wherein the underfill dam is disposed on the substrate prior to attaching the silicon chip to the substrate.
Claim 13
Dependent Claim
15 words
The integrated circuit package of claim 7 wherein the underfill material is an epoxy resin.
Claim 14
Dependent Claim
43 words
An integrating circuit package comprising: a stubstrate having a surface; a silicon chip electrically connected to the substrate, the space between the substrate surface and the silicon chip forming a gap; and an epoxy underfill dam disposed on the surface of the substrate.
Claim 15
Dependent Claim
43 words
An integrating circuit package comprising: a stubstrate having a surface; a silicon chip electrically connected to the substrate, the space between the substrate surface and the silicon chip forming a gap; and an epoxy underfill dam disposed on the surface of the substrate.
Claim 16
Dependent Claim
65 words
An integrating circuit package comprising: a substrate having a surface and connection pads; a silicon chip electrically connected to the connection pads on the substrate, the space between the substrate surface and the silicon chip forming a gap; and a thermo-setting epoxy underfill dam disposed on the surface of the substrate surrounding the silicon chip and forming an open reservoir for a liquid underfill polymer.
Claim 17
Dependent Claim
65 words
An integrating circuit package comprising: a substrate having a surface and connection pads; a silicon chip electrically connected to the connection pads on the substrate, the space between the substrate surface and the silicon chip forming a gap; and a thermo-setting epoxy underfill dam disposed on the surface of the substrate surrounding the silicon chip and forming an open reservoir for a liquid underfill polymer.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2002-08-23 | 2003-02-22 | 2003-08-24 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2006-08-23 | 2007-02-22 | 2007-08-24 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2010-08-23 | 2011-02-22 | 2011-08-24 | $7700.00 | Window Closed / Lapsed |