US5939779A — Bottom lead semiconductor chip stack package

Claim 1

Independent Claim 168 words

A bottom lead semiconductor chip stack package comprising: a first body including a pair of lead frames, each lead frame having a first lead portion and a second lead portion connected to said first lead portion, said first lead portion containing a protrusion extending therefrom, a semiconductor chip containing chip pads disposed on the surface thereof, said chip pads being connected to said protrusions, said body being encased in a molding compound such that a surface of each of said first lead portions is disposed outside said molding compound of said package and such that a surface of each of said second lead portions is disposed to extend outside said package; a second body having the same structural configurations as the first body and reversely stacked relative to the first body such that the semiconductor chips are disposed in opposing relationship relative to each other, and an adhesive for attaching the second lead portions of the first body to the corresponding second lead portions of the second body.

Claim 2

Dependent Claim 168 words

A bottom lead semiconductor chip stack package comprising: a first body including a pair of lead frames, each lead frame having a first lead portion and a second lead portion connected to said first lead portion, said first lead portion containing a protrusion extending therefrom, a semiconductor chip containing chip pads disposed on the surface thereof, said chip pads being connected to said protrusions, said body being encased in a molding compound such that a surface of each of said first lead portions is disposed outside said molding compound of said package and such that a surface of each of said second lead portions is disposed to extend outside said package; a second body having the same structural configurations as the first body and reversely stacked relative to the first body such that the semiconductor chips are disposed in opposing relationship relative to each other, and an adhesive for attaching the second lead portions of the first body to the corresponding second lead portions of the second body.

Claim 3

Dependent Claim 17 words

The bottom lead semiconductor chip stack package of claim 1, wherein the adhesive is a conductive material.

Claim 4

Dependent Claim 16 words

The bottom lead semiconductor chip stack package of claim 2, wherein the conductive material is solder.

Claim 5

Dependent Claim 17 words

The bottom lead semiconductor chip stack package of claim 1, wherein the adhesive is an insulating material.

Claim 6

Dependent Claim 17 words

The bottom lead semiconductor chip stack package of claim 4, wherein the insulating material is a polyamide.

Claim 7

Dependent Claim 25 words

The bottom lead semiconductor chip stack package of claim 1, wherein the surfaces of the first and second leads are plated with a conductive film.

Claim 8

Dependent Claim 39 words

The bottom lead semiconductor chip stack package of claim 1, wherein a polyamide layer is formed on the surface of the semiconductor chips containing the chip pads, while exposing the chip pads for attachment to the solder enclosed protrusions.

Claim 9

Dependent Claim 39 words

The bottom lead semiconductor chip stack package of claim 1, wherein the first and second body together form a two-tiered structure where said first body corresponds to a first tier and said second body corresponds to a second tier.

Claim 10

Dependent Claim 17 words

The bottom lead semiconductor chip stack package of claim 8, comprising a plurality of said two-tiered structures.

Claim 11

Dependent Claim 22 words

The bottom lead semiconductor chip stack package of claim 9, wherein the plurality of two-tiered structures are disposed in a stacked configuration.

Claim 12

Dependent Claim 162 words

A bottom lead semiconductor chip stack package, comprising: a first body and a second body reversely stacked relative to each other, wherein each of the bodies includes lead frames having first leads containing a protrusion which extends from an upper surface thereof and second leads connected to said first leads, a semiconductor chip containing chip pads in a surface thereof which are aligned with and attached to the corresponding protrusions; an adhesive attaching the second leads of each of the first and second bodies to each other; and a molding compound filling the interior of each of the first and second bodies, enclosing the semiconductor chips therein, respectively, and sealing the chip stack package; and said first leads being disposed such that a surface of each of said first leads extends outside said molding compound of said package; and said second leads being disposed such that a surface of each of said second leads extends outside said molding compound of said package.

Claim 13

Dependent Claim 162 words

A bottom lead semiconductor chip stack package, comprising: a first body and a second body reversely stacked relative to each other, wherein each of the bodies includes lead frames having first leads containing a protrusion which extends from an upper surface thereof and second leads connected to said first leads, a semiconductor chip containing chip pads in a surface thereof which are aligned with and attached to the corresponding protrusions; an adhesive attaching the second leads of each of the first and second bodies to each other; and a molding compound filling the interior of each of the first and second bodies, enclosing the semiconductor chips therein, respectively, and sealing the chip stack package; and said first leads being disposed such that a surface of each of said first leads extends outside said molding compound of said package; and said second leads being disposed such that a surface of each of said second leads extends outside said molding compound of said package.

Claim 14

Dependent Claim 14 words

The package of claim 11, wherein the adhesive is formed of a conductive material.

Claim 15

Dependent Claim 11 words

The package of claim 12, wherein the conductive material is solder.

Claim 16

Dependent Claim 14 words

The package of claim 11, wherein the adhesive is formed of an insulating material.

Claim 17

Dependent Claim 12 words

The package of claim 14, wherein the insulating material is a polyamide.

Claim 18

Dependent Claim 22 words

The package of claim 11, wherein each surface of the first leads and the second leads is plated with a conductive film.

Claim 19

Dependent Claim 25 words

The package of claim 11, wherein on the lower surface of each semiconductor chip there is provided a polyamide layer which exposes the chip pads.

Claim 20

Dependent Claim 13 words

The package of claim 11, wherein the molding compound is an epoxy resin.

Annuity Stage	Window Opens	Payment Deadline	Surcharge Period Until	Estimated Fee	Status
3.5 Years (Year 4)	2002-08-16	2003-02-15	2003-08-17	$2000.00	Window Closed / Lapsed
7.5 Years (Year 8)	2006-08-16	2007-02-15	2007-08-17	$3760.00	Window Closed / Lapsed
11.5 Years (Year 12)	2010-08-16	2011-02-15	2011-08-17	$7700.00	Window Closed / Lapsed

Bottom lead semiconductor chip stack package

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