US5677567A
Expired / Lapsed
US
⏱️ 0.0 years remaining
Leads between chips assembly
Assignee: Micron Technology Inc
•
Filing: 1996-06-17
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Granted: 1997-10-14
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Expires: 2016-06-17
Abstract
Abstract A device and method for increasing integrated circuit density comprising at least a pair of superimposed dice, wherein at least one of the superimposed dice has at least one bond pad variably positioned on an active surface of the die. A plurality of lead fingers from a leadframe extend between the dice. The leadframe comprises at least one lead with leads of non-uniform length and configuration to attach to the differently positioned bond pads of the multiple dice. An advantage of the present invention is that it allows dice with differing bond pad arrangements to be used in a superimposed configuration to increase circuit density, while eliminating the use of bond wires in such a configuration.
Inventors
- 👤 Manny Kin F. Ma
- 👤 Jeffrey D. Bruce
- 👤 Daryl L. Habersetzer
- 👤 Gordon D. Roberts
- 👤 James E. Miller
Bibliographic Details
Application Number
—
Jurisdiction
US
Data Source
google_patents
Last Synchronized
2026-10-29 02:39
CPC Classifications
H; H10; H10W; H10W90/00; H10W90/811; H10W70/00; H10W70/40; H10W70/421; H10W70/442; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W72/50; H10W72/541; H10W72/5449; H10W72/551; H10W72/552; H10W72/5522; H10W72/5524; H10W72/90; H10W72/931; H10W72/932; H10W74/00; H10W74/10; H10W74/15; H10W90/701; H10W90/721; H10W90/726; H10W90/751; H10W90/756
Claims Analysis
Total Claims: 36
Claim 1
Independent Claim
107 words
A multi-die semiconductor die assembly, comprising: first die having a face surface, with said first die face surface having a first pattern of bond pads positioned thereon; second die having a face surface, with said second die face surface having a second pattern of bond pads thereon, said second pattern differing from said first pattern by at least one bond pad location; and a leadframe having a plurality of lead finger elements of different length, orientation or configuration to make contact with said first and second bond pad patterns, said leadframe including a paddle, wherein said paddle comprises a power bus for said first and second dice.
Claim 2
Dependent Claim
107 words
A multi-die semiconductor die assembly, comprising: first die having a face surface, with said first die face surface having a first pattern of bond pads positioned thereon; second die having a face surface, with said second die face surface having a second pattern of bond pads thereon, said second pattern differing from said first pattern by at least one bond pad location; and a leadframe having a plurality of lead finger elements of different length, orientation or configuration to make contact with said first and second bond pad patterns, said leadframe including a paddle, wherein said paddle comprises a power bus for said first and second dice.
Claim 3
Dependent Claim
109 words
A multi-die semiconductor die assembly, comprising: a first die having a face surface, with said first die face surface having a first pattern of bond pads positioned thereon; a second die having a face surface, with said second die face surface having a second pattern of bond pads thereon, said second pattern differing from said first pattern by at least one bond pad location; and a leadframe having a plurality of lead finger elements of different length, orientation or configuration to make contact with said first and second bond pad patterns, said leadframe including a paddle, wherein said paddle comprises a common ground for said first and second dice.
Claim 4
Dependent Claim
109 words
A multi-die semiconductor die assembly, comprising: a first die having a face surface, with said first die face surface having a first pattern of bond pads positioned thereon; a second die having a face surface, with said second die face surface having a second pattern of bond pads thereon, said second pattern differing from said first pattern by at least one bond pad location; and a leadframe having a plurality of lead finger elements of different length, orientation or configuration to make contact with said first and second bond pad patterns, said leadframe including a paddle, wherein said paddle comprises a common ground for said first and second dice.
Claim 5
Dependent Claim
111 words
A multi-die semiconductor die assembly, comprising: a first die having a face surface, with said first die face surface having a first pattern of bond pads positioned thereon; a second die having a face surface, with said second die face surface having a second pattern of bond pads thereon, said second pattern differing from said first pattern by at least one bond pad location; and a leadframe having a plurality of lead finger elements of different length, orientation or configuration to make contact with said first and second bond pad patterns, said leadframe including a paddle, wherein said paddle comprises a signal-bearing lead finger accessed by said first and second dice.
Claim 6
Dependent Claim
111 words
A multi-die semiconductor die assembly, comprising: a first die having a face surface, with said first die face surface having a first pattern of bond pads positioned thereon; a second die having a face surface, with said second die face surface having a second pattern of bond pads thereon, said second pattern differing from said first pattern by at least one bond pad location; and a leadframe having a plurality of lead finger elements of different length, orientation or configuration to make contact with said first and second bond pad patterns, said leadframe including a paddle, wherein said paddle comprises a signal-bearing lead finger accessed by said first and second dice.
Claim 7
Dependent Claim
19 words
The assembly of claim 1, further comprising a passivatlon layer disposed between said first die and said second die.
Claim 8
Dependent Claim
33 words
The assembly of claim 1, further comprising at least one internal lead finger segment in electrical communication between a bond pad of said first die and a bond pad of said second die.
Claim 9
Dependent Claim
135 words
A multi-die semiconductor die assembly, comprising: at least two semiconductor dice disposed with their active surfaces in mutually facing relationship and in at least partial superimposition, said at least two dice including at least two bond pad patterns on said active surfaces, said at least two patterns differing by the location of at least one bond pad; at least one leadframe having a portion extending between said at least two dice, and electrically connected to at least some of said bond pads of each of said at least two dice, wherein said at least one leadframe includes at least one lead finger segment which provides no exterior electrical connection for said assembly and which is aligned with and connected to at least one bond pad of at least two of said at least two dice.
Claim 10
Dependent Claim
135 words
A multi-die semiconductor die assembly, comprising: at least two semiconductor dice disposed with their active surfaces in mutually facing relationship and in at least partial superimposition, said at least two dice including at least two bond pad patterns on said active surfaces, said at least two patterns differing by the location of at least one bond pad; at least one leadframe having a portion extending between said at least two dice, and electrically connected to at least some of said bond pads of each of said at least two dice, wherein said at least one leadframe includes at least one lead finger segment which provides no exterior electrical connection for said assembly and which is aligned with and connected to at least one bond pad of at least two of said at least two dice.
Claim 11
Dependent Claim
111 words
A multi-die semiconductor die assembly, comprising: at least three semiconductor dice, two of which lie on one side of said at least one leadframe, wherein at least two semiconductor dice disposed with their active surfaces in mutually facing relationship and in at least partial superimposition, said at least two dice including at least two bond pad patterns on said active surfaces, said at least two patterns differing by the location of at least one bond pad; and said at least one leadframe having a portion extending between said at least two dice, and electrically connected to at least some of said bond pads of each of said at least two dice.
Claim 12
Dependent Claim
111 words
A multi-die semiconductor die assembly, comprising: at least three semiconductor dice, two of which lie on one side of said at least one leadframe, wherein at least two semiconductor dice disposed with their active surfaces in mutually facing relationship and in at least partial superimposition, said at least two dice including at least two bond pad patterns on said active surfaces, said at least two patterns differing by the location of at least one bond pad; and said at least one leadframe having a portion extending between said at least two dice, and electrically connected to at least some of said bond pads of each of said at least two dice.
Claim 13
Dependent Claim
104 words
A multi-die semiconductor die assembly, comprising: at least four dice comprising at least two groups of dice, each die of a said group disposed with their active surfaces in mutually facing relationship to at least one other die of said group, said each die of a said group including a bond pad pattern on said active surface, said patterns of each group differing by the location of at least one bond pad; and at least one leadframe having a portion extending between each of group, and electrically connected to at least some of said bond pads of each of said at least two dice.
Claim 14
Dependent Claim
104 words
A multi-die semiconductor die assembly, comprising: at least four dice comprising at least two groups of dice, each die of a said group disposed with their active surfaces in mutually facing relationship to at least one other die of said group, said each die of a said group including a bond pad pattern on said active surface, said patterns of each group differing by the location of at least one bond pad; and at least one leadframe having a portion extending between each of group, and electrically connected to at least some of said bond pads of each of said at least two dice.
Claim 15
Dependent Claim
180 words
A multi-die semiconductor die assembly, comprising: at least two semiconductor dice disposed with their active surfaces in mutually facing relationship and in at least partial superimposition, said at least two dice including at least two bond pad patterns on said active surfaces, said at least two patterns differing by the location of at least one bond pad; at least one leadframe having a portion extending between said at least two dice, and electrically connected to at least some of said bond pads of each of said at least two dice, wherein said at least one leadframe comprises a two-piece leadframe, said at least two dice comprise at least two groups including at least two dice each, each die of a said group being in mutually facing relationship to at least one other die of said group, and wherein one piece of said at least one leadframe is interposed between at least two dice of one of said groups and a second piece of said at least one leadframe is interposed between at least two dice of another of said groups.
Claim 16
Dependent Claim
180 words
A multi-die semiconductor die assembly, comprising: at least two semiconductor dice disposed with their active surfaces in mutually facing relationship and in at least partial superimposition, said at least two dice including at least two bond pad patterns on said active surfaces, said at least two patterns differing by the location of at least one bond pad; at least one leadframe having a portion extending between said at least two dice, and electrically connected to at least some of said bond pads of each of said at least two dice, wherein said at least one leadframe comprises a two-piece leadframe, said at least two dice comprise at least two groups including at least two dice each, each die of a said group being in mutually facing relationship to at least one other die of said group, and wherein one piece of said at least one leadframe is interposed between at least two dice of one of said groups and a second piece of said at least one leadframe is interposed between at least two dice of another of said groups.
Claim 17
Dependent Claim
58 words
The assembly of claim 6, wherein said leadframe further includes a plurality of lead fingers, at least two of which vary in length, configuration or orientation to align with and connect to at least one bond pad of one of said at least two dice and with no bond pad of another of said at least two dice.
Claim 18
Dependent Claim
39 words
The assembly of claim 6, wherein said leadframe further includes a paddle extending between said at least two dice, and aligned with and connected to at least one said bond pad of each of said at least two dice.
Claim 19
Dependent Claim
25 words
The assembly of claim 6, wherein said at least two dice and at least said extending portion of said at least one leadframe are encapsulated.
Claim 20
Dependent Claim
23 words
The assembly of claim 6, further including a passivation material interposed between said at least two dice and said at least one leadframe.
Claim 21
Dependent Claim
19 words
The assembly of claim 2, further comprising a passivation layer disposed between said first die and said second die.
Claim 22
Dependent Claim
34 words
The assembly of claim 2, further comprising at least one internal lead finger segment in electrical communication between a first bond pad of said first die and a bond pad of said second die.
Claim 23
Dependent Claim
19 words
The assembly of claim 3, further comprising a passivation layer disposed between said first die and said second die.
Claim 24
Dependent Claim
34 words
The assembly of claim 3, further comprising at least one internal lead finger segment in electrical communication between a first bond pad of said first die and a bond pad of said second die.
Claim 25
Dependent Claim
58 words
The assembly of claim 7, wherein said leadframe further includes a plurality of lead fingers, at least two of which vary in length, configuration or orientation to align with and connect to at least one bond pad of one of said at least two dice and with no bond pad of another of said at least two dice.
Claim 26
Dependent Claim
42 words
The assembly of claim 7, wherein said leadframe further includes a paddle extending between said at least two dice, and aligned with and connected to at least one bond pad of each of at least two of said at least two dice.
Claim 27
Dependent Claim
19 words
The assembly of claim 7, wherein said die and at least said extending portion of said leadframe are encapsulated.
Claim 28
Dependent Claim
17 words
The assembly of claim 7, further including a passivation material interposed between said dice and said leadframe.
Claim 29
Dependent Claim
58 words
The assembly of claim 8, wherein said leadframe further includes a plurality of lead fingers, at least two of which vary in length, configuration or orientation to align with and connect to at least one bond pad of one of said at least two dice and with no bond pad of another of said at least two dice.
Claim 30
Dependent Claim
42 words
The assembly of claim 8, wherein said leadframe further includes a paddle extending between said at least two dice, and aligned with and connected to at least one bond pad of each of at least two of said at least two dice.
Claim 31
Dependent Claim
19 words
The assembly of claim 8, wherein said die and at least said extending portion of said leadframe are encapsulated.
Claim 32
Dependent Claim
17 words
The assembly of claim 8, further including a passivation material interposed between said dice and said leadframe.
Claim 33
Dependent Claim
58 words
The assembly of claim 9, wherein said leadframe further includes a plurality of lead fingers, at least two of which vary in length, configuration or orientation to align with and connect to at least one bond pad of one of said at least two dice and with no bond pad of another of said at least two dice.
Claim 34
Dependent Claim
42 words
The assembly of claim 9, wherein said leadframe further includes a paddle extending between said at least two dice, and aligued with and connected to at least one bond pad of each of at least two of said at least two dice.
Claim 35
Dependent Claim
19 words
The assembly of claim 9, wherein said die and at least said extending portion of said leadframe are encapsulated.
Claim 36
Dependent Claim
17 words
The assembly of claim 9, further including a passivation material interposed between said dice and said leadframe.
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USPTO Annuity & Maintenance Windows
| Annuity Stage | Window Opens | Payment Deadline | Surcharge Period Until | Estimated Fee | Status |
|---|---|---|---|---|---|
| 3.5 Years (Year 4) | 2000-10-13 | 2001-04-14 | 2001-10-14 | $2000.00 | Window Closed / Lapsed |
| 7.5 Years (Year 8) | 2004-10-13 | 2005-04-14 | 2005-10-14 | $3760.00 | Window Closed / Lapsed |
| 11.5 Years (Year 12) | 2008-10-13 | 2009-04-14 | 2009-10-14 | $7700.00 | Window Closed / Lapsed |